High-voltage MOS transistor and method for fabricating the same
A method for fabricating a high-voltage MOS transistor. A first doping region with a first dosage is formed in a substrate. A gate structure is formed overlying the substrate and partially covers the first doping region. The substrate is ion implanted using the gate structure as a mask to simultaneously form a second doping region with a second dosage within the first doping region to serve as a drain region and form a third doping region with the second dosage in the substrate to serve as a source region. A channel region is formed in the substrate between the first and third doping regions when the high-voltage MOS transistor is turned on to pass current between the source and drain regions, where a resistance per unit length of the channel region is substantially equal to that of the first doping region. A high-voltage MOS transistor is also disclosed.
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The present disclosure relates in general to semiconductor devices and, more particularly, to a high-voltage metal-oxide-semiconductor (MOS) transistor and a method for fabricating the same.
BACKGROUNDMany applications for semiconductor devices require power devices, such as a liquid crystal display (LCD) driver IC, which can operate at high-voltage to drive the LCD and at low voltage to drive an associated logic circuit. A double diffused drain MOS (DDDMOS) transistor is a typical power device to sustain the higher operating voltage.
BRIEF DESCRIPTION OF THE DRAWINGSThe present disclosure will become more fully understood from the detailed description given hereinbelow and the accompanying drawings, given by way of illustration only and thus not intended to be limitative of the present disclosure.
The present disclosure relates in general to semiconductor devices and, more particularly, to a high-voltage metal-oxide-semiconductor (MOS) transistor and a method for fabricating the same. It is understood, however, that the following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
A high-voltage MOS transistor with a double diffused drain region is shown in
Another high-voltage MOS transistor with a double diffused drain region is shown in
Next, selective oxidation may be performed using a patterned silicon nitride layer (not shown) as a mask to form field oxide regions 204 on the substrate 200, thereby defining a device region bounded by field oxide regions 204. Thereafter, a patterned masking layer 206, such as a photoresist layer, having an opening 207 adjacent to one field oxide region 204 to expose a portion of the device region on the substrate 200 is formed overlying the substrate 200 and covers the field oxide regions 204. Ion implantation 208 is subsequently performed using the patterned masking layer 206 as an implanting mask to form a doping region 210 in the device region on the substrate 200. In the disclosure, the doping region 210 can be formed by phosphorus ion implantation with a dosage of about 7.0 to 9.0E12 ions/cm2 for NMOS fabrication or formed by boron ion implantation with a dosage of about 6.0 to 7.5E12 ions/cm2 for PMOS fabrication.
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The gate structure 218 has a first side and a second side opposite to the first side. The double diffused drain region 211 is formed in the well region 202 of the substrate 200 on the first side of the gate structure and is partially covered by the gate structure 218. The drain region 226 is formed within the double diffused drain region 211 and adjacent to the edge of the first side of the gate structure 218. The source region 228 is formed in the substrate 200 and adjacent to the edge of the second side of the gate structure 218.
It is noted that a channel region 230 is formed in the well region 202 of the substrate 200 between the source and drain regions 228 and 226 when the high-voltage MOS transistor is turned on to pass current therebetween. The conductive resistance RON of the high-voltage MOS transistor is:
≠RON=Rs+Lch×Rch+Ldd×Rdd+Rd
Where Rs is the resistance of the source contact (ohm); Rch is the resistance per unit length of the channel region (ohm/μm); Rdd is the resistance per unit length of the double diffused drain region (ohm/μm); Lch is a length of the channel region (μm); Ldd is a length of an overlap region between the gate structure and the double diffused drain region (μm); and Rd is the resistance of the drain contact (ohm).
When misalignment occurs during lithography for forming the gate 214, the conductive resistance of the transistor is varied due to a shift length (μm) Lmis (not shown) of the gate 214. Accordingly, the conductive resistance after misalignment RON(mis) is:
≠RON(mis)=Rs+(Lch−Lmis)×Rch+(Ldd+Lmix)×Rdd+Rd
≠RON
In this case, a varied conductive resistance RON causes an unstable driving current, resulting in reduced process stability for high-voltage transistor fabrication. In the disclosure, however, the resistance per unit length of the channel region Rch can be made substantially equal to the resistance per unit length of the double diffused drain region Rdd by previously adjusting the well region 202 implanting dosage and the double diffused drain region 211 implanting dosage. Accordingly, Rch and Rdd can be made substantially equal to a fixed value Rfix. That is, the conductive resistance after misalignment RON(mis) is:
≠RON(mis)=Rs+(Lch−Lmis)×Rch+(Ldd+Lmis)×Rdd+Rd
i.=Rs+(Lch−Lmis)×Rfix+(Ldd+Lmis)×Rfix+Rd
ii.=Rs+(Lch+Ldd)×Rfix+Rd
iii.=RON
Therefore, the conductive resistance of the high-voltage MOS transistor of the disclosure does not change even if misalignment occurs, thereby increasing the process stability for high-voltage transistor fabrication.
Moreover, since the double diffused drain region of the disclosure is formed before forming the gate structure, and then source and drain regions are formed by ion implantation using the subsequent gate structure as a mask, a post high temperature drive in process can be performed without affecting low voltage operation, which can form a larger drain extension region to improve breakdown voltage.
Furthermore, because the source and drain regions of the disclosure are formed by a self-alignment method, rather than the conventional non-self-alignment method, the device size can be reduced to increase integration of the integrated circuits.
Next, selective oxidation may be performed using a patterned silicon nitride layer (not shown) as a mask to form field oxide regions 304 on the substrate 300, thereby defining a device region bounded by field oxide regions 304. Thereafter, a patterned masking layer 306, such as a photoresist layer, having a pair of openings 307 adjacent to filed oxide regions 304 to expose a portion of the device region on the substrate 300, is formed overlying the substrate 300 and covers the field oxide regions 304. Ion implantation 308 is subsequently performed using the patterned masking layer 306 as an implanting mask to form a pair of doping regions 310 in the device region on the substrate 300. In the disclosure, the doping region 310 can be formed by phosphorus ion implantation with a dosage of about 7.0 to 9.0E12 ions/cm2 for NMOS fabrication or formed by boron ion implantation with a dosage of about 6.0 to 7.5E12 ions/cm2 for PMOS fabrication.
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As mentioned above, a channel region 328 is formed in the well region 302 of the substrate 300 between the source and drain regions 326 when the high-voltage MOS transistor is turned on to pass current therebetween. The conductive resistance RON of the high-voltage MOS transistor is:
≠RON=Rs+Ldd×Rdd+Lch×Rch+Ldd×Rdd+Rd
≠=Rs+2Ldd×Rdd+Lch×Rch+Rd
When misalignment occurs during lithography for forming the gate 314, the conductive resistance after misalignment RON(mis) is:
≠RON(mis)=Rs+(Ldd−Lmis)×Rdd+(Lch−Lmis)×Rch+(Ldd+Lmis)×Rdd+Rd
i.=Rs+2Ldd×Rdd+Lch×Rch+Rd
ii.=RON
Therefore, the conductive resistance RON can be maintained at a fixed value even if misalignment occurs, thereby obtaining a stable driving current to increase the process stability for high-voltage transistor fabrication.
Moreover, since the double diffused drain region of the disclosure is formed before forming the gate structure, and then source and drain regions are formed by ion implantation using the subsequent gate structure as a mask, a post high temperature drive in process can be performed on the substrate without affecting low voltage operation, thus forming a larger drain extension region and improving breakdown voltage.
Furthermore, as the source and drain regions of the disclosure are formed by a self-alignment method, rather than the conventional non-self-alignment method, the device size can be reduced to increase integration of the integrated circuits.
The present disclosure has been described relative to a preferred embodiment. Improvements or modifications that become apparent to persons of ordinary skill in the art only after reading this disclosure are deemed within the spirit and scope of the application. It is understood that several modifications, changes and substitutions are intended in the foregoing disclosure and in some instances some features of the disclosure will be employed without a corresponding use of other features. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the disclosure.
Claims
1. A method for fabricating a high-voltage MOS transistor on a substrate, the method comprising:
- forming a first doping region with a first dosage in the substrate;
- forming a gate structure overlying the substrate and partially covering the first doping region; and
- ion implanting the substrate using the gate structure as a mask to simultaneously form a second doping region with a second dosage within the first doping region to serve as a drain region and form a third doping region with the second dosage in the substrate to serve as a source region;
- wherein a channel region is formed in the substrate between the first and third doping regions when the high-voltage MOS transistor is turned on to pass current between the source and drain regions, where a resistance per unit length of the channel region is substantially equal to a resistance per unit length of the first doping region.
2. The method as claimed in claim 1, further comprising the step of performing a drive in process on the first doping region.
3. The method as claimed in claim 2, wherein the drive in process is performed at 1000 to 1100° C.
4. The method as claimed in claim 2, wherein the drive in process i performed for 6 to 8 hours.
5. The method as claimed in claim 1, wherein the first dosage is about 7.0 to 9.0E12 ions/cm2.
6. The method as claimed in claim 1, wherein the gate structure is composed of a gate, a gate dielectric layer, and a gate spacer.
7. The method as claimed in claim 1, wherein the second dosage is about 2.0 to 4.0E15 ions/cm2.
8. A high-voltage MOS transistor comprising:
- a substrate;
- a gate structure overlying the substrate, the gate structure having a first side and a second side opposite to the first side;
- a first doping region with a first dosage formed in the substrate on the first side of the gate structure and partially covered by the gate structure; and
- a second doping region with a second dosage formed within the first doping region adjacent to the edge on the first side of the gate structure to serve as a drain region and a third doping region with the second dosage formed in the substrate adjacent to the edge of the second side of the gate structure to serve as a source region;
- a channel region formed in the substrate between the first and third doping regions by turning on the high-voltage MOS transistor to pass current between the source and drain regions, where a resistance per unit length of the channel region is substantially equal to a resistance per unit length of the first doping region.
9. The device as claimed in claim 8, wherein the gate structure is composed of a gate, a gate dielectric layer, and a gate spacer.
10. The device as claimed in claim 8, wherein the first dosage is about 7.0 to 9.0E12 ions/cm2.
11. The device as claimed in claim 10, wherein the second dosage is about 2.0 to 4.0E15 ions/cm2.
12. A method for fabricating a high-voltage MOS transistor, comprising the steps of:
- providing a substrate;
- forming a masking layer overlying the substrate;
- ion implanting the substrate using the masking layer as a mask to form a pair of first doping regions with a first dosage in the substrate;
- removing the masking layer;
- forming a gate structure overlying the substrate between the pair of first doping regions and partially covering each first doping region; and
- ion implanting the substrate using the gate structure as a mask to form a pair of second doping regions with a second dosage within the pair of first doping regions to serve as source and drain regions.
13. The method as claimed in claim 12, wherein the masking layer is a photoresist layer.
14. The method as claimed in claim 12, further comprising the step of performing a drive in process on the first doping region.
15. The method as claimed in claim 14, wherein the drive in process is performed at 1000 to 1100° C.
16. The method as claimed in claim 14, wherein the drive in process is performed for 6 to 8 hours.
17-23. (canceled)
Type: Application
Filed: Mar 16, 2004
Publication Date: Sep 22, 2005
Patent Grant number: 7196375
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd. (Hsin-Chu)
Inventors: Fu-Hsin Chen (Hsinchu County), Ruey-Hsin Liu (Hsin-Chu)
Application Number: 10/801,234