Exposure apparatus and method for producing device
An exposure apparatus which performs an exposure while filling a space between a projection optical system and a substrate with liquid, and in which deterioration of a device caused by adherent liquid on the substrate is suppressed is provided. A device manufacturing system (SYS) includes a main body of an exposure apparatus (EX) which fills a space between a projection optical system (PL) and a substrate (P) with a liquid (50) and projects an image of a pattern onto the substrate (P) via the projection optical system (PL) and the liquid (50); an interface section (IF) arranged between the exposure apparatus main body (EX) and a coater/developer main body (C/D) which processes the substrate (P) after exposure; and a liquid-removing unit (100) which removes the liquid (50) adhering to the substrate (P) before the exposed substrate (P) is transferred into the coater/developer main body (C/D) through the interface section (IF).
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This application is a Division of application Ser. No. 11/147,356 filed Jun. 8, 2005, which in turn is a Continuation of International Application No. PCT/JP03/015587 filed Dec. 5, 2003 claiming the conventional priority of Japanese patent Application Nos. 2002-357957 filed on Dec. 10, 2002 and 2003-305279 filed on Aug. 28, 2003. The disclosures of these prior applications are incorporated herein by reference in their entireties.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to an exposure apparatus for exposing a substrate with a pattern image projected by a projection optical system while filling, with a liquid, at least a part of a space between the projection optical system and the substrate. The present invention also relates to a liquid-removing apparatus to be used for the exposure apparatus, and a method for producing a device based on the use of the exposure apparatus.
2. Description of the Related Art
Semiconductor devices and liquid crystal display devices are produced by the so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. The exposure apparatus, which is used in the photolithography step, includes a mask stage for supporting the mask and a substrate stage for supporting the substrate. The pattern on the mask is transferred onto the substrate via a projection optical system while successively moving the mask stage and the substrate stage. In recent years, it is demanded to realize the higher resolution of the projection optical system in order to respond to the further advance of the higher integration of the device pattern. As the exposure wavelength to be used becomes shorter, the resolution of the projection optical system is higher. As the numerical aperture of the projection optical system becomes larger, the resolution of the projection optical system is higher. Therefore, the exposure wavelength, which is used for the exposure apparatus, is shortened year by year, and the numerical aperture of the projection optical system is increased as well. The exposure wavelength, which is dominantly used at present, is 248 nm of the KrF excimer laser. However, the exposure wavelength of 193 nm of the ArF excimer laser, which is shorter than the above, is also practically used in some situations. When the exposure is performed, the depth of focus (DOF) is also important in the same manner as the resolution. The resolution R and the depth of focus 6 are represented by the following expressions respectively.
R=k1•λ/NA (1)
δ=±k2•λ/NA2 (2)
In the expressions, λ represents the exposure wavelength, NA represents the numerical aperture of the projection optical system, and k1 and k2 represent the process coefficients. According to the expressions (1) and (2), the following fact is appreciated. That is, when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to enhance the resolution R, then the depth of focus δ is narrowed.
If the depth of focus δ is too narrowed, it is difficult to match the substrate surface with respect to the image plane of the projection optical system. It is feared that the margin is insufficient during the exposure operation. Accordingly, the liquid immersion method has been suggested, which is disclosed, for example, in International Publication No. 99/49504 as a method for substantially shortening the exposure wavelength and widening the depth of focus. In this liquid immersion method, the space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or any organic solvent to utilize the fact that the wavelength of the exposure light beam in the liquid is 1/n as compared with that in the air (n represents the refractive index of the liquid, which is about 1.2 to 1.6 in ordinary cases) so that the resolution is improved and the depth of focus is magnified about n times.
When the substrate is subjected to the exposure process by using the liquid immersion method, the liquid remains in some cases on the surface of the substrate after the exposure process. If the substrate is transported in a state in which the remaining liquid adheres to the substrate, then the liquid falls from the substrate during the transport, and inconveniences arise, for example, such that respective apparatuses and members, which are disposed around the transport passage, become rusty due to the fallen liquid, and/or the cleanness cannot be maintained in the environment in which the exposure apparatus is arranged. In other cases, the environmental change (humidity change) is caused by the fallen liquid around the exposure apparatus. If the humidity change is caused, the following problems arise. That is, for example, any fluctuation arises in the air on the optical path of the optical interferometer which is to be used to measure the position of the stage. The position of the stage is not measured accurately, and it is impossible to obtain any desired pattern transfer accuracy. Further, for example, if the development process is executed in a state in which the liquid adheres to the substrate after the exposure process, it is feared that any device having desired performance cannot be produced.
SUMMARY OF THE INVENTIONThe present invention has been made taking the foregoing circumstances into consideration, an object of which is to provide an apparatus which is capable of suppressing the device deterioration caused by the liquid adhered to a substrate after the exposure when the exposure process is performed while filling the space between the projection optical system and the substrate with the liquid, an exposure apparatus in which the apparatus is incorporated, and a method for producing a device based on the use of the exposure apparatus.
In order to solve the problems as described above, the present invention adopts the following features corresponding to FIGS. 1 to 15 as illustrated in embodiments. However, parenthesized symbols affixed to respective elements merely exemplify the elements, with which it is not intended to limit the respective elements.
According to a first aspect of the present invention, there is provided an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the exposure apparatus (EX) comprising:
a projection optical system (PL) which projects the image of the pattern onto the substrate (P);
a connecting section (IF) which is connected to a processing apparatus (C/D) for processing the exposed substrate (P); and
a liquid-removing unit (100, 22, 33, 34) which removes the liquid (50) adhered to the substrate (P) before the substrate (P) is transported to the processing apparatus (C/D) through the connecting section (IF).
According to the present invention, the liquid-removing unit is provided, which removes the liquid adhered to the substrate before the substrate is transported to the processing apparatus which performs a predetermined process for the substrate to which the exposure process has been applied. Accordingly, the predetermined process can be performed for the substrate in a state in which the liquid is removed. Therefore, it is possible to produce a device having desired performance.
According to a second aspect of the present invention, there is provided an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the exposure apparatus (EX) comprising:
a projection optical system (PL) which projects the image of the pattern onto the substrate (P);
a liquid-removing unit (100, 22, 33, 34) which removes the liquid (50) adhered to the substrate (P);
a first transport member (H2, 43) which transports the exposed substrate (P) to the liquid-removing unit (100, 22, 33, 34); and
a second transport member (H3, 44) which transports, from the liquid-removing unit (100, 22, 33, 34), the substrate (P) from which the liquid (50) has been removed by the liquid-removing unit (100, 22, 33, 34).
According to the present invention, the liquid-removing unit is provided, which removes the liquid for the exposure adhered to the substrate after the exposure for the substrate. Therefore, it is possible to suppress the occurrence of inconveniences which would be otherwise caused, for example, such that the liquid falls from the substrate during the transport of the liquid, resulting in the environmental change. In this arrangement, the substrate, which has been subjected to the exposure process by the liquid immersion method and to which the liquid is adhered, can be transported to the liquid-removing unit by the first transport member. Further, the substrate, from which the liquid has been removed by the liquid-removing unit, is transported by the second transport member which is provided separately from the first transport member. Accordingly, it is possible to transport the substrate to a predetermined position in a state in which no liquid is adhered to the substrate. In the present invention, it is preferable that at least a part of a surface of the first transport member is liquid-repellent.
According to a third aspect of the present invention, there is provided an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the exposure apparatus (EX) comprising:
a projection optical system (PL) which projects the image of the pattern onto the substrate (P);
a transport system (H) which transports the exposed substrate (P); and
a liquid-removing unit (100, 22, 33, 34) which is provided on a transport passage for the substrate (P) and which removes the liquid (50) adhered to the substrate (P), wherein:
the liquid-removing unit (100, 22, 33, 34) has a cover (25, 30, 40) which covers at least a part of surroundings of the substrate (P) so that the liquid (50) is prevented from being scattered when the liquid (50) is removed.
According to the present invention, the liquid-removing unit, which removes the liquid for the exposure adhered to the substrate, is provided at an intermediate position of the transport passage of the transport system for transporting the substrate. Accordingly, it is possible to simultaneously perform the exposure process executed by the exposure apparatus (main body of exposure apparatus) and the liquid-removing process executed by the liquid-removing unit provided at the intermediate position of the transport passage. Therefore, it is possible to execute the respective processes without degrading the throughput. In this arrangement, the liquid-removing unit is provided with the cover which avoids the scattering of the liquid. Accordingly, it is possible to avoid the scattering of the liquid to the surroundings of the transport passage. Therefore, it is possible to avoid the environmental change such as the humidity change and the occurrence of rust or the like on the apparatus. In the present invention, it is preferable that the cover includes a chamber.
In the exposure apparatuses according to the first to third aspects described above, it is preferable that the liquid-removing unit includes a washing unit which washes the substrate after the exposure, and a washing liquid adhered to the substrate is removed after the substrate is washed by the washing unit.
According to a fourth aspect of the present invention, there is provided an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the exposure apparatus (SYS, EX) comprising:
a projection optical system (PL) which projects the image of the pattern onto the substrate (P);
a substrate stage (PST) which holds the substrate (P); and
a liquid-removing unit (22) which removes the liquid (50) adhered to the substrate (P) before the exposed substrate (P) is exported from the substrate stage (PST).
According to the present invention, the liquid, which is adhered to the substrate, is removed before the substrate is exported from the substrate stage on which the exposure process is performed. Accordingly, it is possible to suppress the occurrence of inconveniences which would be otherwise caused such that the liquid falls from the substrate during the transport of the substrate.
In the exposure apparatuses according to the first to fourth aspects described above, it is also preferable that the substrate, to which the liquid is adhered, is transported while being inclined by a predetermined angle with respect to a horizontal plane after the exposure. Further, the liquid-removing unit may remove the liquid from the substrate by blowing off, suction, and/or drying.
According to a fifth aspect of the present invention, there is provided an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the exposure apparatus (SYS, EX) comprising:
a projection optical system (PL) which projects the image of the pattern onto the substrate (P);
a transport system (H) which transports the exposed substrate (P); and
a liquid-processing mechanism which processes the liquid (50) fallen from the substrate (P) after the exposure and which is arranged under at least a part of a transport passage for the substrate (P).
According to the present invention, when the substrate after the exposure is transported by using the transport system, even if the liquid is adhered to the substrate, then the liquid, which has fallen from the substrate during the transport, is processed by using the liquid-processing mechanism, and thus it is possible to avoid the scattering of the liquid to the surroundings of the transport passage. Therefore, it is possible to avoid the environmental change such as the humidity change and the occurrence of rust or the like on the apparatus. The liquid-processing mechanism may include a gutter member which is arranged under at least a part of the transport passage, and a discharge mechanism which discharges the liquid recovered by the gutter member.
According to a sixth aspect of the present invention, there is provided an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the exposure apparatus (EX) comprising:
a projection optical system (PL) which projects the image of the pattern onto the substrate (P); and
a washing unit (150) which washes the exposed substrate (P) before the substrate (P) is exported to a processing apparatus (C/D) which processes the exposed substrate (P).
According to the present invention, foreign matters or the like, which adhere to the surface of the substrate during the liquid immersion exposure or during the transport of the substrate after the exposure, can be washed out. It is possible to feed the clean substrate. In particular, when the liquid, which is used for the liquid immersion exposure, is a liquid other than water, for example, any organic liquid such as cedarwood oil or fluorine-based oil, it is desirable to remove such a liquid by using the washing unit so as not to affect the process for the substrate to be performed thereafter.
According to a seventh aspect of the present invention, there is provided an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the exposure apparatus (SYS, EX) comprising:
a projection optical system (PL) which projects the image of the pattern onto the substrate (P);
a first transport member (H2, 43) which transports the substrate (P) to which the liquid is adhered; and
a second transport member (H1, H3, 44) which transports the substrate (P) to which the liquid is not adhered.
According to the present invention, the first transport member for transporting the substrate to which the liquid is adhered and the second transport member for transporting the substrate to which the liquid is not adhered are separately used. Therefore, it is possible to avoid the adhesion of the liquid to the second transport member and/or the adhesion of the liquid to the substrate transported by the second transport member. Thus, it is possible to suppress the diffusion and the scattering of the liquid.
According to an eighth aspect of the present invention, there is provided an exposure apparatus (EX) for exposing a substrate (P) by radiating an exposure light beam onto the substrate (P) via a liquid (50), the exposure apparatus (SYS, EX) comprising:
a first holding member (PST1) which is movable while holding the substrate;
a second holding member (PST2) which is movable while holding another substrate; and
a liquid-removing unit (10, 30) which removes the liquid adhered to the substrate for which the exposure is completed and which is held by the second holding member when the substrate, which is held by the first holding member, is subjected to the exposure.
According to the present invention, at least parts of the exposure process for the substrate held by one holding member and the liquid-removing process for the substrate after the exposure held by the other holding member are performed concurrently. Accordingly, it is possible to suppress the decrease in the throughput which would be otherwise accompanied by the liquid-removing process.
According to a ninth aspect of the present invention, there is provided a liquid-removing apparatus (100) to be used together with an exposure apparatus (EX) for transferring an image of a pattern via a liquid (50) onto a substrate (P) to expose the substrate (P) therewith, the liquid-removing apparatus comprising:
a holding section (21, 36, 43) which holds the exposed substrate (P); and
a liquid-removing mechanism (22, 33, 34, 37, 38) which removes the liquid (50) for the exposure existing on the substrate (P).
According to a tenth aspect of the present invention, there is provided an exposure system comprising the exposure apparatus of the present invention; and a processing apparatus which processes an exposed substrate. The processing apparatus may include at least one of a coating unit which coats a base member of the substrate with a photosensitive material, and a developing unit which develops the exposed substrate.
The present invention provides a method for producing a device, comprising using the exposure apparatus according to each of the aspects described above. According to the present invention, it is possible to suppress the change of the environment of the exposure process resulting from the liquid adhered to the substrate and the influence exerted on a predetermined process (for example, the developing process) for the substrate after the exposure process. Therefore, it is possible to produce a device having desired performance.
BRIEF DESCRIPTION OF THE DRAWINGS
The exposure apparatus and the method for producing the device according to the present invention will be explained below with reference to the drawings.
With reference to
As shown in
The transport system H includes a first transport unit H1 which imports (loads) the substrate P before being subjected to the exposure process to the substrate stage PST, a second transport unit H2 which exports (unloads) the substrate P after being subjected to the exposure process from the substrate stage PST and which transports the substrate P to the liquid-removing unit 100, and a third transport unit H3 which transports the substrate P between the liquid-removing unit 100 and the interface section IF. The first, second, and third transport units H1, H2, and H3 are provided in the first chamber unit CH1. The substrate P, which is subjected to the coating process of the photoresist by the main coater-developer body C/D (coating unit C), is delivered to the third transport unit H3 via the interface section IF. In this embodiment, an opening and a shutter for opening/closing the opening are provided at a portion of each of the first and second chamber units CH1, CH2 to face the interface section IF. The shutter is opened during the operation for transporting the substrate P to the interface section IF. The third transport unit H3 delivers the substrate P before being subjected to the exposure process to the first transport unit H1 via the liquid-removing unit 100. When the substrate P is delivered from the third transport unit H3 to the first transport unit H1, the substrate P may be delivered to the first transport unit H1 via an unillustrated another transport unit and/or a relay unit without passing through the liquid-removing unit 100. The first transport unit H1 loads the delivered substrate P to the substrate stage PST of the main body of exposure apparatus EX. The substrate P after being subjected to the exposure process is unloaded from the substrate stage PST by the aid of the second transport unit H2. The second transport unit H2 delivers the unloaded substrate P to the third transport unit H3 via the liquid-removing unit 100. The substrate P, which has been transported by the third transport unit H3, is carried to the main coater-developer body C/D (developing unit D) via the interface section IF. The developing unit D applies the developing process to the delivered substrate P.
The first transport unit H1, which imports the substrate P that is not wet before being subjected to the exposure process to the substrate stage PST, is used separately from the second transport unit H2 which exports the substrate P that is possibly wet after being subjected to the exposure process from the substrate stage PST. Therefore, the liquid is not adhered to the first transport unit (transport member) H1. It is possible to avoid the adhesion of the liquid, for example, to the back surface of the substrate P to be transported by the first transport unit H1.
The mask stage MST supports the mask M. The mask stage MST is two-dimensionally movable in the plane perpendicular to the optical axis AX of the projection optical system PL, i.e., in the XY plane, and it is finely rotatable in the OZ direction. The mask stage MST is driven by a mask stage-driving unit MSTD such as a linear motor. The mask stage-driving unit MSTD is controlled by the control unit CONT. The position in the two-dimensional direction and the angle of rotation of the mask M on the mask stage MST are measured in real-time by a laser interferometer. The result of the measurement is outputted to the control unit CONT. The control unit CONT drives the mask stage-driving unit MSTD on the basis of the result of the measurement obtained by the laser interferometer to thereby position the mask M supported on the mask stage MST.
The projection optical system PL projects the pattern on the mask M onto the substrate P at a predetermined projection magnification β to perform the exposure. The projection optical system PL includes a plurality of optical elements (lenses). The optical elements are supported by a barrel PK as a metal member. In this embodiment, the projection optical system PL is based on the reduction system having the projection magnification β which is, for example, ¼ or ⅕. The projection optical system PL may be any one of the 1× magnification system and the magnifying system. Alternatively, the projection optical system PL may be composed of mirrors. The optical element (lens) 60 is exposed from the barrel PK on the side of the tip (on the side of the substrate P) of the projection optical system PL of this embodiment. The optical element 60 is provided detachably (exchangeably) with respect to the barrel PK.
The substrate stage PST supports the substrate P. The substrate stage PST includes a Z stage 51 which retains the substrate P by the aid of a substrate holder, an XY stage 52 which supports the Z stage 51, and a base 53 which supports the XY stage 52. The substrate stage PST is driven by a substrate stage-driving unit PSTD such as a linear motor. The substrate stage-driving unit PSTD is controlled by the control unit CONT. When the Z stage 51 is driven, the substrate P, which is retained on the Z stage 51, is subjected to the control of the position (focus position) in the Z axis direction and the positions in the θX and θY directions. When the XY stage 52 is driven, the substrate P is subjected to the control of the position in the XY directions (position in the directions substantially parallel to the image plane of the projection optical system PL). That is, the Z stage 51 controls the focus position and the angle of inclination of the substrate P so that the surface of the substrate P is adjusted to match the image plane of the projection optical system PL in the auto-focus manner and the auto-leveling manner. The XY stage 52 positions the substrate P in the X axis direction and the Y axis direction. It goes without saying that the Z stage and the XY stage may be provided as an integrated body.
A movement mirror 54 is provided on the substrate stage PST (Z stage 51). A laser interferometer 55 is provided at a position opposed to the movement mirror 54. The angle of rotation and the position in the two-dimensional direction of the substrate P on the substrate stage PST are measured in real-time by the laser interferometer 55. The result of the measurement is outputted to the control unit CONT. The control unit CONT drives the substrate stage-driving unit PSTD on the basis of the result of the measurement of the laser interferometer 55 to thereby position the substrate P supported on the substrate stage PST.
In this embodiment, the liquid immersion method is applied in order that the resolution is improved by substantially shortening the exposure wavelength and the depth of focus is substantially widened. Therefore, the space between the surface of the substrate P and the tip surface (lower surface) 7 of the optical element (lens) 60 of the projection optical system PL on the side of the substrate P is filled with the predetermined liquid 50 at least during the period in which the image of the pattern on the mask M is transferred onto the substrate P. As described above, the lens 60 is exposed on the tip side of the projection optical system PL, and the liquid 50 is allowed to make contact with only the lens 60. Accordingly, the barrel PK composed of the metal is prevented from any corrosion or the like. In this embodiment, pure water is used for the liquid 50. The exposure light beam EL, which is not limited to only the ArF excimer laser beam, can be transmitted through pure water, even when the exposure light beam EL is, for example, the bright line (g-ray, h-ray, i-ray) in the ultraviolet region radiated, for example, from a mercury lamp or the far ultraviolet light beam (DUV light beam) such as the KrF excimer laser beam (wavelength: 248 nm).
The main body of the exposure apparatus EX includes a liquid supply unit 1 which supplies the predetermined liquid 50 to the space 56 between the substrate P and the tip surface (end surface of the lens 60) 7 of the projection optical system PL, and a liquid recovery unit 2 which recovers the liquid 50 from the space 56. The liquid supply unit 1 is provided to fill at least a part of the space between the projection optical system PL and the substrate P with the liquid 50. The liquid supply unit 1 includes, for example, a tank for accommodating the liquid 50, and a pressurizing pump. One end of a supply tube 3 is connected to the liquid supply unit 1. Supply nozzles 4 are connected to the other end of the supply tube 3. The liquid supply unit 1 supplies the liquid 50 to the space 56 via the supply tube 3 and the supply nozzles 4.
The liquid recovery unit 2 includes, for example, a suction pump, and a tank for accommodating the recovered liquid 50. One end of a recovery tube 6 is connected to the liquid recovery unit 2. Recovery nozzles 5 are connected to the other end of the recovery tube 6. The liquid recovery unit 2 recovers the liquid 50 from the space 56 via the recovery nozzles 5 and the recovery tube 6. When the space 56 is filled with the liquid 50, then the control unit CONT drives the liquid supply unit 1 so that the liquid 50, which is in a predetermined amount per unit time, is supplied to the space 56 via the supply tube 3 and the supply nozzles 4, and the control unit CONT drives the liquid recovery unit 2 so that the liquid 50, which is in a predetermined amount per unit time, is recovered from the space 56 via the recovery nozzles 5 and the recovery tube 6. Accordingly, the liquid 50 is arranged in the space 56 between the substrate P and the tip surface 7 of the projection optical system PL.
The lens 60, which is disposed at the lowest end of the projection optical system PL, is formed to have a rectangular shape which is long in the Y axis direction (non-scanning direction) while remaining only the portion required for the end portion 60A in the scanning direction. During the scanning exposure, a pattern image of a part of the mask M is projected onto the rectangular projection area disposed just under the end portion 60A. The mask M is moved at the velocity V in the −X direction (or in the +X direction) with respect to the projection optical system PL, in synchronization with which the substrate P is moved at the velocity β•V (β is the projection magnification) in the +X direction (or in the −X direction) by the aid of the XY stage 52. After the completion of the exposure for one shot area, the next shot area is moved to the scanning start position in accordance with the stepping of the substrate P. The exposure process is successively performed thereafter for each of the shot areas in the step-and-scan manner. This embodiment is designed so that the liquid 50 is allowed to flow in the same direction as the movement direction of the substrate in parallel to the movement direction of the substrate P.
When the scanning exposure is performed by moving the substrate P in the scanning direction (−X direction) indicated by the arrow Xa (see
Next, an explanation will be made with reference to
The holder 21 is provided movably upwardly and downwardly with respect to the upper surface of the stage unit 20 together with the shaft 23. When the holder 21, which holds the substrate P, is moved upwardly with respect to the stage unit 20, then the substrate P is separated from the stage unit 20, and the substrate P is movable in accordance with the driving of the rotating mechanism 22. On the other hand, when the holder 21 is moved downwardly, the substrate P is retained by a second holder 24 which is provided on the upper surface of the stage unit 20.
The chamber 25 is provided with a first opening 26 which is formed on the side of the second transport unit H2, and a second opening 27 which is formed on the side of the third transport unit H3. A first shutter 26A, which opens/closes the first opening 26, is provided for the first opening 26. A second shutter 27A, which opens/closes the second opening 27, is provided for the second opening 27. The opening/closing operations of the first and second shutters 26A, 27A are controlled by the control unit CONT. When the first shutter 26A is opened, the second transport unit H2 is accessible to the stage unit 20 of the liquid-removing unit 100 via the first opening 26. That is, the second transport unit H2 is capable of transporting (importing) the substrate P to the stage unit 20 of the liquid-removing unit 100 via the first opening 26. The third transport unit H3 is accessible to the stage unit 20 of the liquid-removing unit 100 via the second opening 27. That is, the third transport unit H3 is capable of transporting (exporting) the substrate P to the stage unit 20 of the liquid-removing unit 100 via the second opening 27. On the other hand, when the first and second shutters 26A, 27A are closed, the interior of the chamber 25 is tightly closed.
Next, an explanation will be made with reference to
The substrate P, which is held by the substrate stage PST1 in the main body of exposure apparatus EX, is subjected to the exposure by using the liquid immersion method, concurrently with which the alignment mark is detected and the surface information (AF (autofocus)/AL (autoleveling) information) is measured for the substrate P retained by the substrate stage PST2.
When the supply of the liquid is started from the liquid supply unit 1 onto the substrate P retained on the substrate stage PST2, then the substrate stage PST1 may be only moved without performing any substantial measuring operation with the substrate stage PST1, or the substrate stage PST1 may be simply stopped. By doing so, it is possible to avoid the influence on the measuring operation for the substrate stage PST1 in the measuring station, which would be otherwise exerted by the vibration generated when the supply of the liquid is started from the liquid supply unit 1 onto the substrate stage PST2. When the supply of the liquid onto the substrate stage PST2 is stopped, if the measuring operation for the substrate stage PST1 has not been completed in the measuring station, then the substrate stage PST1 may be only moved, or the substrate stage PST1 may be simply stopped, without performing any substantial measuring operation for the substrate stage PST1 when the supply of the liquid is stopped.
The control unit CONT opens the first shutter 26A as the second transport unit H2 approaches the liquid-removing unit 100 (see
After the second transport unit H2 delivers the substrate P to the stage unit 20, the second transport unit H2 is retracted from the chamber 25 via the first opening 26. When the second transport unit H2 is retracted from the chamber 25, the control unit CONT closes the first shutter 26A. Accordingly, the interior of the chamber 25 is tightly closed. When the interior of the chamber 25 is tightly closed, the control unit CONT moves the holder 21 upwardly. As the holder 21 is moved upwardly, the substrate P, which is attracted and retained by the holder 21, is also moved upwardly with respect to the stage unit 20. The control unit CONT drives the rotating mechanism 22 to rotate the holder 21 in the θZ direction together with the substrate P. As the rotating mechanism 22 rotates the substrate P, the liquid 50, which is adhered to the both upper and lower surfaces of the substrate P, blown off from the substrate P in accordance with the action of the centrifugal force. Accordingly, the liquid 50, which is adhered to the substrate P, is removed from the substrate P. In this arrangement, the substrate P is arranged in the chamber 25 which serves as the cover mechanism. Therefore, the liquid 50, which is blown off from the substrate P, is not scattered to the surroundings.
The liquid 50, which is blown off from the substrate P, is recovered by the liquid-sucking unit 29 which is connected to the chamber 25. The liquid-sucking unit 29 recovers the liquid 50 blown off from the substrate P by sucking the gas contained in the chamber 25 together with the scattered liquid 50. In this procedure, the liquid-sucking unit 29 continuously performs the operation for sucking the gas contained in the chamber 25 and the scattered liquid 50. Accordingly, the liquid 50 does not stay in the chamber 25 including, for example, the inner wall and the bottom of the chamber 25. Therefore, the humidity in the chamber 25 is not greatly varied. Any wet gas contained in the chamber 25 does not outflow to the outside of the chamber 25, when the shutters 26A, 27A are opened as well.
When the substrate P is rotated for a predetermined period of time (or by a predetermined number of revolutions), then the control unit CONT stops the driving of the rotating mechanism 22, and the substrate P is moved downwardly together with the holder 21. Subsequently, the control unit CONT opens the second shutter 27A. When the second shutter 27A is opened, the third transport unit (second transport member) H3 makes the access to the stage unit 20 via the second opening 27 to retain the substrate P which is disposed on the stage unit 20 and from which the liquid 50 has been removed. The third transport unit H3, which retains the substrate P from which the liquid 50 has been removed by the liquid-removing unit 100, exports the substrate P from the interior of the chamber 25 via the second opening 27.
As shown in
As explained above, the liquid 50, which is adhered to the substrate P, is removed by the liquid-removing unit 100 before the substrate P, to which the exposure process has been applied by the main body of exposure apparatus EX, is transported to the coater-developer apparatus C/D-SYS (developing unit D). Therefore, it is possible to exclude the influence of the liquid 50 on the developing process. When the liquid 50, which is adhered to the substrate P, is removed by the liquid-removing unit 100, it is possible to suppress the occurrence of inconveniences which would be otherwise caused, for example, such that the liquid falls from the substrate P during the transport of the substrate P, the humidity change (environmental change) is caused in the first chamber unit CH1, and the rust appears on the members and the respective units or apparatuses disposed on the transport passage.
The substrate P, to which the liquid 50 is adhered, is transported by the second transport unit H2, and the substrate P, from which the liquid 50 has been removed, is transported by the third transport unit H3 which is provided separately from the second transport unit H2. Therefore, the third transport unit H3 is not exposed to the liquid 50. Therefore, the liquid 50 is not adhered to the substrate P which is transported by the third transport unit H3. Further, it is possible to reliably avoid the scattering of the liquid 50 on the transport passage of the third transport unit H3.
The liquid-removing unit 100 is provided at the intermediate position of the transport passage of the transport system H. Therefore, it is possible to simultaneously perform the exposure process with the main body of exposure apparatus EX and the liquid-removing process with the liquid-removing unit 100. Therefore, it is possible to execute the respective processes without degrading the throughput. Further, the liquid-removing process is performed in the chamber 25. Therefore, it is possible to avoid the scattering of the liquid 50 to the surroundings.
This embodiment has been explained such that the transport is performed via the interface section IF as the connecting section when the substrate P after the exposure process is transported to the coater-developer apparatus C/D-SYS as the processing apparatus. However, the opening of the first chamber unit CH1 serves as the connecting section for the exposure apparatus EX-SYS, for example, when the interface section IF is provided for the coater-developer apparatus C/D-SYS, when the coater-developer apparatus C/D-SYS is directly connected to the exposure apparatus EX-SYS without using the interface section IF, or when the processing apparatus is a substrate-accommodating apparatus, and the substrate P after the exposure process is transported to the substrate-accommodating apparatus without using the interface section IF.
As described above, the liquid 50 is composed of pure water in this embodiment. Pure water is advantageous in that pure water is available in a large amount with ease, for example, in the semiconductor production factory, and pure water exerts no harmful influence, for example, on the optical element (lens) and the photoresist on the substrate P. Further, pure water exerts no harmful influence on the environment, and the content of impurity is extremely low. Therefore, it is also expected to obtain the function to wash the surface of the substrate P and the surface of the optical element provided at the tip surface of the projection optical system PL.
It is approved that the refractive index n of pure water (water) with respect to the exposure light beam EL having a wavelength of about 193 nm is approximately in an extent of 1.44 to 1.47. When the ArF excimer laser beam (wavelength: 193 nm) is used as the light source of the exposure light beam EL, then the wavelength is shortened on the substrate P by 1/n, i.e., to about 131 to 134 nm, and a high resolution is obtained. Further, the depth of focus is magnified about n times, i.e., about 1.44 to 1.47 times as compared with the value obtained in the air. Therefore, when it is enough to secure an approximately equivalent depth of focus as compared with the case of the use in the air, it is possible to further increase the numerical aperture of the projection optical system PL. Also in this viewpoint, the resolution is improved.
In this embodiment, the lens 60 is attached to the tip of the projection optical system PL. However, the optical element, which is attached to the tip of the projection optical system PL, may be an optical plate which is usable to adjust the optical characteristics of the projection optical system PL, for example, the aberration (for example, spherical aberration and comatic aberration). Alternatively, the optical element may be a parallel plane plate through which the exposure light beam EL is transmissive. When the optical element, which makes contact with the liquid 50, is the parallel plane plate which is cheaper than the lens, it is enough that the parallel plane plate is merely exchanged immediately before supplying the liquid 50 even when any substance (for example, any silicon-based organic matter), which deteriorates the transmittance of the projection optical system PL, the illuminance of the exposure light beam EL on the substrate P, and the uniformity of the illuminance distribution, is adhered to the parallel plane plate, for example, during the transport, the assembling, and/or the adjustment of the exposure apparatus EX. An advantage is obtained such that the exchange cost is lowered as compared with the case in which the optical element to make contact with the liquid 50 is the lens. That is, the surface of the optical element to make contact with the liquid 50 is dirtied, for example, due to the adhesion of scattered particles generated from the resist by being irradiated with the exposure light beam EL or any impurity contained in the liquid 50. Therefore, it is necessary to periodically exchange the optical element. However, when the optical element is the cheap parallel plane plate, then the cost of the exchange part is low as compared with the lens, and it is possible to shorten the time required for the exchange. Thus, it is possible to suppress the increase in the maintenance cost (running cost) and the decrease in the throughput.
When the pressure, which is generated by the flow of the liquid 50, is large between the substrate P and the optical element disposed at the tip of the projection optical system PL, it is also allowable that the optical element is tightly fixed so that the optical element is not moved by the pressure, without allowing the optical element to be exchangeable.
This embodiment is constructed such that the space between the projection optical system PL and the surface of the substrate P is filled with the liquid 50. However, the space may be filled with the liquid 50, for example, in a state in which a cover glass composed of a parallel plane plate is attached to the surface of the substrate P.
In the embodiment described above, the shape of the nozzle is not specifically limited. For example, the liquid 50 may be supplied or recovered by using two pairs of nozzles for the long side of the end portion 60A. In this arrangement, the supply nozzles and the recovery nozzles may be arranged and aligned vertically in order to supply and recover the liquid 50 from any one of the directions of the +X direction and the −X direction.
Second Embodiment Next, an explanation will be made with reference to
With reference to
As explained above, the cover 30, which covers the surroundings of the substrate P, can be also used as the cover mechanism. Accordingly, it is possible to avoid the scattering of the liquid 50 to the surroundings by the simple structure as compared with the chamber 25 explained in the first embodiment.
Third Embodiment Next, an explanation will be made with reference to
With reference to
As explained above, the liquid-removing unit 100 can be also provided in the substrate stage PST. When the liquid adhered to the substrate P is removed before the substrate P is exported from the substrate stage PST on which the exposure process is performed, it is possible to suppress the occurrence of any inconvenience which would be otherwise caused such that the liquid 50 falls from the substrate P during the transport of the substrate P. In this embodiment, the main body of exposure apparatus EX adopts the twin-stage system. Therefore, it is possible to simultaneously perform the exposure process on the first substrate stage PST1 and the liquid-removing process on the second substrate stage PST2. It is possible to execute the entire process without degrading the throughput.
The third embodiment adopts the mechanism for rotating the substrate P in order to remove the liquid adhered to the substrate P before the substrate P after the exposure process is transported from the substrate stage PST. Alternatively, it is also allowable to provide a blower to blow off the liquid. Further alternatively, it is also allowable to provide a mechanism for sucking the remaining liquid on the substrate P separately from the liquid recovery unit 2. These alternatives may be used in combination.
Fourth Embodiment Next, an explanation will be made with reference to
With reference to
The substrate P held by the holding unit 36 and the first and second blow sections 33, 34 are provided relatively movably. In this embodiment, the first and second blow sections 33, 34 make scanning movement in the X axis direction with respect to the substrate P held by the holding unit 36. Alternatively, a driving unit may be provided for the holding unit 36 to move the substrate P with respect to the first and second blow sections 33, 34. Further alternatively, both of the first and second blow sections 33, 34 and the holding unit 36 may be moved.
Next, an explanation will be made about the operation of the liquid-removing unit 100 constructed as described above. The second transport unit H2 delivers, to the holding unit 36, the substrate P to which the liquid 50 is adhered. The control unit CONT allows the gas to blow from the first and second blow sections 33, 34 against the substrate P held by the holding unit 36. In this embodiment, the gas, which is supplied from the first and second blow sections 33, 34, is blown in the inclined directions with respect to the front and back surfaces of the substrate P. The control unit CONT allows the gas to blow against the substrate P held by the holding unit 36 while moving the first and second blow sections 33, 34 in the X axis direction. In this embodiment, the length of the nozzle main section of each of the first and second blow sections 33, 34 is sufficiently larger than that of the substrate P. Therefore, the gas is blown uniformly against the entire front and back surfaces of the substrate P. When the gas is blown out, the liquid 50, which is adhered to the substrate P, is blown off and removed. The liquid 50, which has been blown off, is recovered by the liquid-sucking unit 29. The substrate P, from which the liquid 50 has been removed, is delivered to the third transport unit H3.
Fifth Embodiment Next, an explanation will be made with reference to
It is also allowable to simultaneously execute the sucking operation for sucking the liquid 50 on the substrate P as explained with reference to
Next, an explanation will be made with reference to
The arm 43 moves the substrate P with respect to the first and second blow sections 33, 34 in a state in which the inclination of the substrate P is maintained. The first and second blow sections 33, 34 allow the gas to blow against the moving substrate P. The liquid 50, which is adhered to the substrate P, is removed by the gas blow. In this procedure, the substrate P is inclined. Therefore, the liquid 50 is easily moved by its self-weight toward the lower side in the direction of inclination of the substrate P. The removal of the liquid 50 from the substrate P is facilitated. The liquid 50, which is removed from the substrate P, stays in the chamber 40, and the liquid 50 is recovered by the liquid-sucking unit 29 as the recovery unit. Alternatively, the liquid 50 may be moved by the self-weight toward the downward side in the direction of inclination of the substrate P in a state in which the substrate P is inclined, and the gas may be allowed to blow against the liquid 50 collected on the downward side in the direction of inclination. Further alternatively, the drying operation as described above may be simultaneously used. That is, when the liquid is removed with the liquid-removing unit 100, it is also allowable to use any one of the methods of the rotation of the substrate P, the inclination of the substrate P, the sucking operation, the drying operation, and the gas-blowing operation (liquid-blowing off operation), or it is also allowable to appropriately combine them.
One end of the substrate P from which the liquid 50 has been removed protrudes to the outside of the chamber 40 from the second opening 42. An arm (second transport member) 44, which serves as a third transport unit H3, is provided in the vicinity of the second opening 42. The substrate P, from which the liquid 50 has been removed, is directly delivered from the arm 43 to the arm 44.
This embodiment has been explained such that the substrate P is transported while being inclined when the substrate P is inserted into the chamber 40. However, the substrate P, to which the liquid 50 is adhered, may be transported at any position other than those disposed in the chamber 40 in a state in which the substrate P is inclined by a predetermined angle with respect to the horizontal plane. Accordingly, the liquid 50 adhered to the substrate P falls from the substrate P by the self-weight. In this case, a recovery unit, which recovers the liquid 50 separated from the substrate P by the self-weight, is provided in the transport passage. The angle of inclination with respect to the horizontal plane, which is used when the substrate P is transported, can be arbitrarily established, which may be 90 degrees. That is, it is also possible to transport the substrate P in a state in which the substrate P is allowed to stand vertically.
In the respective embodiments described above, it is preferable that the surfaces of the arm 43 and the second transport unit H2 for transporting the substrate P to which the liquid 50 is adhered are liquid-repellent. Accordingly, even if the liquid 50 adhered to the substrate P is adhered to the second transport unit H2 (arm 43) when the substrate P is transported, the liquid 50 can be immediately and easily removed from the second transport unit H2 (arm 43). Therefore, it is possible to avoid the occurrence of such an inconvenience that the liquid 50 adhered to the second transport unit H2 (arm 43) is adhered (adhered again) to the substrate P. The liquid-repelling treatment (water-repelling treatment) for making the surface of the second transport unit H2 (arm 43) to be liquid-repellent includes, for example, a coating treatment in which a material having liquid repellence is used. The material having the liquid repellence includes, for example, fluorine-based compounds, silicon compounds, and synthetic resins such as polyethylene and acrylic resins. The thin film, which is to be used for the surface treatment, may be a single layer film or a film composed of a plurality of layers. The liquid-repelling treatment may be applied to the entire surface of the second transport unit H2 (arm 43), or the liquid-repelling treatment may be applied to a part thereof.
Seventh Embodiment In the embodiment having been explained with reference to
The Z stage 51 is inclined by a leveling mechanism provided for the Z stage 51 before the substrate P is transported (unloaded) from the Z stage 51 (substrate stage PST) shown in
In the embodiment described above, the liquid on the substrate P is removed by inclining the substrate P in accordance with the inclination of the substrate stage PST (Z stage 51). However, as disclosed in Japanese Patent Application Laid-open No. 1-214042, when a substrate support member, which is movable upwardly and downwardly while holding the substrate P in order to load and unload the substrate P, is carried on the substrate stage PST, the substrate P may be inclined in accordance with the inclination of the substrate support member. The substrate P may be dried by allowing the dry air or the warm air to blow thereagainst, before the substrate P is exported from the substrate stage PST. That is, when the liquid is removed before the substrate P is exported from the substrate stage PST, it is also allowable to use any one of the methods of the rotation of the substrate P, the blowing off of the liquid, the suction of the liquid, the inclination of the substrate P, and the drying by allowing the gas to blow, or it is also allowable to appropriately combine and use them.
Eighth Embodiment Next, an explanation will be made with reference to
With reference to
In the present invention, any liquid other than water can be used as the liquid 50 for the exposure process performed by the main body of exposure apparatus EX based on the liquid immersion method. In this embodiment, a fluorine-based oil is used as the liquid 50. For example, when the light source of the exposure light beam EL is the F2 laser, the F2 laser beam is not transmitted through water. Therefore, the exposure process can be performed by using the fluorine-based oil as the liquid 50 through which the F2 laser beam is transmissive. As described above, it is possible to use, as the liquid 50, those other than water. Alternatively, for example, it is also possible to use, as the liquid 50, cedar oil which has the transmittance with respect to the exposure light beam EL, which has the refractive index as high as possible, and which is stable against the photoresist applied to the surface of the substrate P and the projection optical system PL. When the liquid other than water is used as the liquid 50, the liquid-removing process can be performed after performing the washing process for the substrate P with the washing unit 150. As described above, when the substrate P is washed, it is possible to wash out, for example, foreign matters adhered to the substrate P during the liquid immersion exposure or during the transport of the substrate P. The removal of the liquid is performed smoothly thereafter. It is possible to feed, from the exposure apparatus, the clean substrate P to which the liquid and the foreign matters are not adhered.
Any one of the liquid-removing units 100 provided for the exposure apparatuses according to the first to sixth embodiments may be used as the liquid-removing unit 100. The washing of the substrate P and the removal of the liquid adhered to the substrate P may be performed at an identical place. For example, the washing and the liquid removal may be performed in the chamber 25.
Ninth Embodiment Next, an explanation will be made with reference to
With reference to
There is such a possibility that the liquid 50 may fall from the substrate P during the transport of the substrate P to which the liquid 50 is adhered after the exposure by using the second transport unit H2. The fallen liquid 50 can be recovered with the gutter member 161. When the fallen liquid 50 is recovered with the gutter member 161, for example, it is possible to avoid such an inconvenience that the liquid 50 is scattered to the surroundings of the transport passage. The liquid-sucking unit 162 sucks the liquid 50 on the gutter member 161 provided in the chamber unit CH1, and thus the liquid 50 is discharged to the outside of the chamber unit CH1 and the liquid 50 cannot stay on the gutter member 161 in the chamber unit CH1. It is possible to avoid any inconvenience which would be otherwise caused such that the humidity change (environmental change) occurs in the chamber unit CH1. The liquid-sucking unit 162 can continuously perform the operation for sucking the liquid 50 recovered by the gutter member 161. Alternatively, the liquid-sucking unit 162 can intermittently perform the sucking operation in only a preset predetermined period. When the sucking operation is continuously performed, the liquid 50 does not stay on the gutter member 161. Therefore, it is possible to more reliably avoid the humidity change in the chamber unit CH1. On the other hand, when the sucking operation (discharge operation) by the liquid-sucking unit 162 is not performed, for example, during the exposure for the substrate P by the main body of exposure apparatus EX, and the sucking operation is performed in only the period other than the exposure, then it is possible to avoid any inconvenience which would be otherwise caused such that the vibration, which is generated by the sucking operation, affects the exposure accuracy.
It is desirable that the gutter member 161 is provided over an entire area under the transport passage for transporting the substrate P which has a possibility of adhesion of the liquid. However, the gutter member 161 may be provided partially and/or separately at any place which tends to be affected by the liquid fallen from the substrate P. The liquid-processing mechanism 160, which is disposed under the transport passage, is not limited to the gutter member 161 and the liquid-sucking unit 162. It is also allowable to adopt any system capable of recovering the liquid fallen from the substrate P or the like.
Any liquid-removing unit 100, which is provided for any one of the exposure apparatuses according to the first to sixth embodiments, may be employed as the liquid-removing unit 100. It is also possible to provide, in the transport passage, the washing unit as used in the first to sixth embodiments.
In the embodiment described above, the liquid-removing unit 100 is provided in order to remove the liquid which cannot be completely recovered by the liquid recovery unit 2 and which adheres to (remains on) the substrate P. However, it is not necessarily indispensable to provide the liquid recovery unit 2.
The substrate P, which is usable in the respective embodiments described above, is not limited to the semiconductor wafer for producing the semiconductor device. Those applicable include, for example, the glass substrate for the display device, the ceramic wafer for the thin film magnetic head, and the master plate (synthetic quartz, silicon wafer) for the mask or the reticle to be used for the exposure apparatus.
The embodiment described above adopts the exposure apparatus in which the space between the projection optical system PL and the substrate P is locally filled with the liquid. However, the present invention is also applicable to the liquid immersion exposure apparatus in which the stage for retaining the exposure objective substrate is moved in the liquid bath and the liquid immersion exposure apparatus in which the liquid pool having the predetermined depth is formed on the stage and the substrate is retained therein. The liquid immersion exposure apparatus in which the stage for retaining the exposure objective substrate is moved in the liquid bath is disclosed in detail, for example, in Japanese Patent Application Laid-open No. 6-124873, and the liquid immersion exposure apparatus in which the liquid pool having the predetermined depth is formed on the stage and the substrate is retained therein are disclosed in detail, for example, in Japanese Patent Application Laid-open No. 10-303114 and U.S. Pat. No. 5,825,043. These patent documents are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
As for the exposure apparatus (main body of the exposure apparatus) EX, the present invention is applicable to the scanning type exposure apparatus (scanning stepper) based on the step-and-scan system for performing the scanning exposure for the pattern of the mask M by synchronously moving the mask M and the substrate P as well as the projection exposure apparatus (stepper) based on the step-and-repeat system for performing the full field exposure for the pattern of the mask M in a state in which the mask M and the substrate P are allowed to stand still, while successively step-moving the substrate P. The present invention is also applicable to the exposure apparatus based on the step-and-stitch system in which at least two patterns are partially overlaid and transferred on the substrate P.
As for the type of the exposure apparatus EX, the present invention is not limited to the exposure apparatus for the semiconductor production apparatus for exposing the substrate P with the semiconductor device pattern. The present invention is also widely applicable, for example, to the exposure apparatus for producing the liquid crystal display device or for producing the display as well as the exposure apparatus for producing, for example, the thin film magnetic head, the image pickup device (CCD), the reticle, or the mask.
When the linear motor is used for the substrate stage PST and/or the mask stage MST, it is allowable to use any one of those of the air floating type based on the use of the air bearing and those of the magnetic floating type based on the use of the Lorentz's force or the reactance force. Each of the stages PST, MST may be either of the type in which the movement is effected along the guide or of the guideless type in which no guide is provided. An example of the use of the linear motor is disclosed in U.S. Pat. Nos. 5,623,853 and 5,528,118, contents of which are incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
As for the driving mechanism for each of the stages PST, MST, it is also allowable to use a plane motor in which a magnet unit provided with two-dimensionally arranged magnets and an armature unit provided with two-dimensionally arranged coils are opposed to one another, and each of the stages PST, MST is driven by the electromagnetic force. In this arrangement, any one of the magnet unit and the armature unit may be connected to the stage PST, MST, and the other of the magnet unit and the armature unit may be provided on the side of the movable surface of the stage PST, MST.
The reaction force, which is generated in accordance with the movement of the substrate stage PST, may be mechanically released to the floor (ground) by using a frame member so that the reaction force is not transmitted to the projection optical system PL. The method for handling the reaction force is disclosed in detail, for example, in U.S. Pat. No. 5,528,118 (Japanese Patent Application Laid-open No. 8-166475), a content of which is incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application. The reaction force, which is generated in accordance with the movement of the mask stage MST, may be mechanically released to the floor (ground) by using a frame member so that the reaction force is not transmitted to the projection optical system PL. The method for handling the reaction force is disclosed in detail, for example, in U.S. Pat. No. 5,874,820 (Japanese Patent Application Laid-open No. 8-330224), a content of which is incorporated herein by reference within a range of permission of the domestic laws and ordinances of the state designated or selected in this international application.
As described above, the exposure apparatus EX according to the embodiment of the present invention is produced by assembling the various subsystems including the respective constitutive elements as defined in claims so that the predetermined mechanical accuracy, the electric accuracy, and the optical accuracy are maintained. In order to secure the various accuracies, those performed before and after the assembling include the adjustment for achieving the optical accuracy for the various optical systems, the adjustment for achieving the mechanical accuracy for the various mechanical systems, and the adjustment for achieving the electric accuracy for the various electric systems. The steps of assembling the various subsystems into the exposure apparatus include, for example, the mechanical connection, the wiring connection of the electric circuits, and the piping connection of the air pressure circuits in correlation with the various subsystems. It goes without saying that the steps of assembling the respective individual subsystems are performed before performing the steps of assembling the various subsystems into the exposure apparatus. When the steps of assembling the various subsystems into the exposure apparatus are completed, the overall adjustment is performed to secure the various accuracies as the entire exposure apparatus. It is desirable that the exposure apparatus is produced in a clean room in which, for example, the temperature and the cleanness are managed.
As shown in
According to the present invention, it is possible to avoid the change of the environment for the exposure process and the scattering of the liquid to the surroundings. Therefore, it is possible to avoid the decrease in the exposure process accuracy which would be otherwise caused by the environmental change and the liquid scattering, and it is possible to produce the device having desired performance. The substrate, to which the liquid and the foreign matters are not adhered, can be fed from the exposure apparatus. Therefore, it is possible to produce the device having desired performance.
Claims
1. A method of transferring a pattern to a thin film of radiation-sensitive material on a substrate using photolithography comprising:
- exposing said thin film to a radiation source in a liquid immersion lithography system; and
- drying said substrate following said exposure in said liquid immersion lithography system to remove an immersion fluid from said substrate.
2. The method of claim 1, wherein said drying comprises rotating said substrate.
3. The method of claim 1, wherein said exposing comprises exposing a radiation-sensitive material.
4. A method of treating an exposed thin film on a substrate following liquid immersion lithography comprising:
- drying said substrate to remove immersion liquid from said exposed thin film on said substrate.
5. The method of claim 4, wherein said drying comprises rotating said substrate.
6. The method of claim 4, wherein said exposing comprises exposing a radiation-sensitive material.
7. The method of claim 1, further comprising:
- forming a thin film of radiation-sensitive material on said substrate prior to said exposing; and
- developing thin film on said substrate to form said pattern.
8. The method of claim 7, wherein said forming comprises: coating said substrate with said thin film.
9. A system for patterning a thin-film of radiation-sensitive material on a substrate for semiconductor manufacturing comprising:
- a liquid immersion lithography system configured to expose said thin film to a pattern; and
- a drying system coupled to said liquid immersion lithography system and configured to dry said thin film following exposure by substantially removing immersion fluid from said thin film.
10. The system of claim 9, further comprising a track system coupled to said liquid immersion lithography system and configured to coat said substrate with said thin film prior to said exposure, and develop said pattern in said thin film following said exposure, wherein said drying system is coupled to at least one of said liquid immersion system and said track system.
11. The system of claim 10, wherein said liquid immersion lithography system comprises at least one of a radiation source, an imaging system, a scanning system, a projection lens system, and a substrate holder.
12. The system of claim 10, wherein said drying system is configured to substantially remove water.
13. The system of claim 10, wherein said track system comprises at least one of a coating system, and a developing unit.
14. The system of claim 10, wherein said drying system facilitates drying said substrate to remove immersion fluid from said substrate following said exposure in said liquid immersion lithography system.
15. The system of claim 10, wherein said drying system is configured to rotate said substrate.
16. The system of claim 10, wherein said system is configured to pattern a photoresist.
17. A semiconductor integrated circuit produced from a method claimed in claim 1.
18. A semiconductor integrated circuit produced from a method claimed in claim 2.
19. A semiconductor integrated circuit produced from a method claimed in claim 3.
20. A semiconductor integrated circuit produced from a method claimed in claim 4.
21. A semiconductor integrated circuit produced from a method claimed in claim 5.
22. A semiconductor integrated circuit produced from a method claimed in claim 6.
23. A semiconductor integrated circuit produced from a method claimed in claim 7.
24. A semiconductor integrated circuit produced from a method claimed in claim 8.
Type: Application
Filed: Mar 2, 2006
Publication Date: Jul 13, 2006
Applicant: NIKON CORPORATION (TOKYO)
Inventor: Nobutaka Magome (Kumagaya-shi)
Application Number: 11/365,869
International Classification: G03F 7/00 (20060101);
