Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing
A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a media is disclosed.
The present invention relates to magnetic hard drive manufacturing. More specifically, the present invention relates to a system for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during electrical testing.
In a continuing effort to improve magnetic hard drive performance, efficiency, and reliability, different methods are utilized to improve quality control. One method in the art includes cleaning and burnishing a hard disk following the deposition of thin film layers to remove debris and asperities from the surface. To support ever-increasing areal-density requirements, parameters such as flying height, disc roughness, and carbon thickness are continually reduced. The successful manufacture of disks capable of meeting these parameters requires improvements to hard disk preparation.
In the art, a burnishing head, which replaces the slider of a hard drive suspension such as a head gimbal assembly (HGA), is used to swab the disk surface on-line during dynamic electrical testing (DET) of magnetic heads. Such burnishing heads are typically created by diamond-grinding means, which provides a burnishing surface that can result in a dispersal of unwanted head particles as well as a propensity to chip. Further, the typical burnishing head design can cause abrupt takeoffs as well as high dynamic pitch angles, being unable to provide a burnishing surface substantially parallel to the media surface (hard disk) as is needed for optimal polishing.
Several different burnishing head designs are currently utilized in media manufacture (e.g. U.S. Pat. No. 6,267,645; U.S. Pat. No. 6,249,945; and U.S. Pat. No. 5,782,680). Some heads have a burnishing ridge providing a burnishing edge that extends across the entire widthwise surface of the head. Other head designs have burnishing pads only on various points of the burnishing surface, but have a lengthwise channel between two members.
An ineffective burnishing head may result in a lower glide yield, while an overly aggressive glide head may result in scratches and damage to the disk surface, which can lead to disk corrosion. The most commonly used burnishing head has a polyangular design, such as rectangular and triangular, with a grinding wheel-cut waffle pattern.
Such heads are designed for media manufacture to burnish rough surfaces and are too aggressive to adapt to swab the testing surface of media during DET of magnetic heads. It is therefore desirable to have a system for treating (e.g. polishing to remove defects) the surface of a media such as a magnetic hard disk while on-line without the aforementioned problems.
BRIEF DESCRIPTION OF THE DRAWINGS
In one embodiment of the present invention, the burnishing head 302 is made from a dummy magnetic wafer or conventional ceramic, such as by recycling waste wafers. The ion-etching process provides a wide range of burnish head design possibilities. In combination with photolithography, ion-etching can produce a vast array of elliptical geometric shapes. Also, as stated, the elliptical shapes capable of being produced with ion-etching can provide improved performance, reduced chipping, and a lower level of disc damage when compared to typical grinding methods.
In one embodiment, the burnishing head 302 is made from a dummy magnetic wafer (row bar) or a rectangular body of ceramic material (recycled material). The pads 304 are carved out by ion milling (IM). IM is utilized instead of reactive ion etch (RIE) because of the dangers associated with performing RIE upon alumina layers, e.g. danger of core metal exposure. By contrast, the process of IM is performed on all material at almost the same rate.
As stated, in one embodiment, the burnishing head 302 includes no tapering on the leading edge 308 or trailing edge 310 of the air bearing surface (ABS) to avoid fast takeoff or high dynamic pitch. The placement of the pads 304, in combination with the flat ABS, provides substantially parallel flight over the media to be polished. This ensures light (gentle) media contact to remove surface defects. Further, utilizing the entire ABS for polishing avoids stress concentration. Heavy contact by the burnishing head 302 upon the disk may cause head vibration and could damage the carbon overcoat. Further, during ‘loading and unloading’ (LUL), any dynamic pitch and roll of the burnishing head 302 could cause an edge of the burnishing head 302 to gouge the media. Further, as stated, to improve the HDI in one embodiment, the burnishing surface of the head 302 is coated with silicon & DLC for lubrication and to enhance durability. The silicon/DLC coating is provided after IM to settle loose particles due to re-deposition.
In an embodiment, the burnishing head 302 size is about the same as current sliders (1.235×1.0×0.3 millimeter), and taking advantage of head gimbal assembly (HGA) assembly processes, the burnishing head 302 is mounted on a related suspension 312 so as to be used on-line without fixture limitation during the DET of the project.
In an embodiment, the elliptical pad design causes the area between the pads 502 to be partially evacuated with respect to the surrounding pressure during movement over a media surface. This vacuum is created by the airflow's increased surface velocity (compared to airflow surface velocity). In an embodiment, the generated vacuum provides an evenly distributed suction force lightly holding the burnishing head to the media surface. (See
In one embodiment, the angle, θ, of the air grooves (paths) 502 (typical) is more than 25° in order to avoid any burnishing gaps when the head seeks to specific tracks causing large skew angles (See
To further explain, ‘crown’ is parabolic deformation of the slider in the length direction. A positive crown indicates a convex deformation (smaller spacing at slider center), while negative crown indicates a concave deformation (larger spacing at slider center). Crown is calculated as follows:
Where L is the slider length and R is crown.
‘Camber’ is parabolic deformation of the slider in the width direction. A positive camber indicates a convex deformation (smaller spacing at slider center), while negative camber indicates a concave deformation (larger spacing at slider center). Camber is calculated as follows:
where W is the slider width and A is camber.
‘Twist’ is parabolic deformation of the slider causing equal displacement of diagonal corners. A positive twist indicates the inner leading edge and outer trailing edge are recessed (larger spacing), while the outer leading and inner trailing edges are railed (smaller spacing). Twist is defined as follows:
where L is the slider length, W is the slider width, and T is twist.
In an embodiment, the elliptical pad design 902 causes the area between the pads 904 to be partially evacuated with respect to the surrounding pressure during movement over a media surface. This vacuum is created by the airflow's increased surface velocity (compared to airflow surface velocity). In an embodiment, the generated vacuum provides an evenly distributed suction force lightly holding the burnishing head to the media surface. This characteristic aids in absorbing and removing contaminants, as well as maintaining flight stability.
In one embodiment, a row bar 1002 or a strip of ceramic material is wholly covered with photo-film 1004. In an embodiment, a chrome mask 1006, defining the pad configuration, is utilized. The film coating 1004 is then exposed to ultra-violet light through the mask 1006. In an embodiment, a developer (0.75% Na2CO3) removes the unexposed area while the exposed area forms the film pattern attached on the surface of row bar 1002, which is the photo resistance 1008 to protect the area from ion-etching 1010. The depth of the air grooves (height of the pads) is generally controlled by the amount of time ion-etching 1010 is performed.
Next, in one embodiment, a carbon-thin film overcoating is formed on the entire burnishing surface (including the air groove). Utilizing sputtering 1012 techniques, the surface of the burnishing head is coated with silicon & DLC. As stated, this is done after ion milling (IM) in order to settle loose particles due to re-deposition and for interface lubrication and head durability. In one embodiment, this entire process is done in a relative vacuum.
Next, in an embodiment, the individual burnishing heads are separated, cleaned, and inspected (with a device such as an optical interferometry instrument; e.g., a Vecco™ device) to determine the ABS flatness.
Although several embodiments are specifically illustrated and described herein, it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention.
Claims
1. A method to affect a surface of a media comprising:
- providing physical interference between a plurality of elliptical pads of a component and said media surface as the media and the component move with respect to each other.
2. The method of claim 1, said elliptical pads are located on said component with a distribution that is substantially symmetrical with respect to an axis of said component, said axis being generally parallel to a motion vector of the component; and wherein
- said pad distribution provides a plurality of airflow pathways between said plurality of pads.
3. The method of claim 2, wherein the elliptical pads are located on the component with a sizing and distribution such that, as the component passes over the media surface, a substantially uninterrupted area of physical interference is provided generally equal to the width of the slider.
4. The method of claim 3, wherein the component is used to polish the media surface and the plurality of elliptical pads form a burnishing surface.
5. The method of claim 4, wherein the burnishing surface is substantially flat in all planar directions; and wherein
- the pads are designed and distributed such that at least one low-pressure region is created in the plurality of pathways by airflow between said pads.
6. The method of claim 5, wherein the component is a ceramic dummy slider of waste wafer material.
7. The method of claim 5, wherein the component is a burnishing head and the media is a magnetic hard disk.
8. The method of claim 7, wherein said burnishing head is to polish said hard disk by moving from an inner diameter to an outer diameter of the disk as the disk rotates, said hard disk having a rate of angular velocity and said slider having a rate of radial velocity such that the slider forms a spiral path covering generally the entire surface of the hard disk.
9. The method of claim 8, wherein said burnishing head is to polish the surface of the disk while flying slightly above the disk surface.
10. The method of claim 9, wherein said burnishing head is to polish the surface of the disk while flying substantially flatly above the disk surface.
11. The method of claim 8, wherein each elliptical pad has a leading edge which is a first arc, said first arc having an axis perpendicular to the disk surface, and a trailing edge which is a second arc, said second arc having an axis perpendicular to the disk surface and a diameter greater than the first arc.
12. The method of claim 11, wherein each elliptical pad is teardrop-shaped.
13. The method of claim 8, wherein said plurality of elliptical pads is formed in the burnishing head by ion etching and lubricant overcoating.
14. The method of claim 13, wherein each elliptical pad is to contact the disk with a rounded pad surface and wherein lubricant overcoating includes applying silicon and diamond-like carbon (DLC).
15. The method of claim 13, wherein said burnishing head includes a substantially uniform distribution of sixteen elliptical pads with rows of pads ordered from a leading edge to a trailing edge with the following quantities:
- a leading edge row having three pads;
- a second row having four pads;
- a third row having three pads;
- a fourth row having four pads; and
- a trailing edge row having two pads;
- said distribution providing a generally crisscrossed pattern of elliptical pads.
16. A method to manufacture a burnishing head comprising:
- covering, with a photo-reactive film coating, a row bar;
- directing light from a specific range of wavelengths through a mask to said film coating;
- removing, with a developer, an unexposed area of said film coating, which leaves an exposed area of said film coating as a photo-resistant surface of said row bar; and
- etching said row bar by ion-milling to form a burnishing surface.
17. The method of claim 16, wherein
- said row bar is made with recycled wafer material;
- said mask is a chrome mask;
- said light is ultra-violet light; and
- said developer is 0.75% Na2CO3.
18. The method of claim 16, further comprising:
- applying a carbon-thin film overcoating to said burnishing surface.
19. The method of claim 18, wherein
- said burnishing surface is overcoated with silicon and diamond-like carbon (DLC);
- said overcoating is applied via sputtering techniques;
- said burnishing surface includes a plurality of raised elliptical pads; and
- said method to manufacture a burnishing head is performed in a relative vacuum.
International Classification: B24B 51/00 (20060101); B24B 49/00 (20060101);