INTEGRATED CIRCUIT CAPACITOR STRUCTURE
Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode and a second voltage, which is different from the first voltage, can be applied to the lower electrode. A wire layer, through which the first voltage is applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.
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This application is a Divisional of U.S. patent application Ser. No. 10/678,531, filed on Oct. 3, 2003, now pending, which claims priority from Korean Patent Application No. 2002-63477, filed Oct. 17, 2002, the disclosures of which are incorporated herein in their entirety by reference.
TECHNICAL FIELDThe present invention relates to an integrated circuit capacitor and, more specifically, to a metal-insulator-metal (MIM) capacitor structure. Such a structure is particularly advantageous to use in logic, analog, or circuits that include both Dynamic Random Access Memory (DRAM) and Merged DRAM and Logic (MDL) devices.
BACKGROUNDSeveral types of integrated circuit capacitors exist, which are classified according to their junction structures, such as metal-oxide-silicon (MOS) capacitors, pn junction capacitors, polysilicon-insulator-polysilicon (PIP) capacitors, and metal-insulator-metal (MIM) capacitors. In all of the above-listed capacitors except for MIM capacitors, at least one electrode is formed of monocrystalline silicon or polycrystalline silicon. However, physical characteristics of monocrystalline and polycrystalline silicon limit minimizing the amount of resistance of a capacitor electrode. In addition, when a bias voltage is applied to a monocrystalline or polycrystalline silicon electrode, depletion may occur, which can cause the applied voltage to become unstable. When this occurs, the capacitance of the silicon electrode cannot be maintained at a certain level.
Using MIM capacitors has been proposed to address the varying capacitance problem, since capacitance of MIM capacitors does not depend on a bias voltage or temperature. MIM capacitors have a lower voltage coefficient of capacitance (VCC) and a lower temperature coefficient of capacitance (TCC) than other capacitor types. The VCC indicates variation of capacitance according to the changes in voltage and the TCC indicates variation of capacitance according to the changes in temperature. Because of having a low VCC and TCC, MIM capacitors have been particularly useful for fabricating analog products. More recently, MIM capacitors have been used to make mixed mode signal products and system-on-a-chip (SOC) products. For example, MIM capacitors have been widely employed in analog capacitors and filters for analog or mixed mode signal applications in wired or wireless communications, as decoupling capacitors for main processing unit boards, as high frequency radio-frequency (RF) capacitors, and in embedded DRAMs.
In the MIM capacitor 10 shown in
In the MIM capacitor 12 shown in
In addition, there is a high probability of having a bad electrical contact occur due to byproducts, like polymer, generated during the formation of the contact holes C/H and the damascene regions D/R because they have a high aspect ratio. In other words, the manufacturing process of conventional MIM capacitors results in many disadvantages including limiting the capacitance of a capacitor.
Embodiments of the invention address this and other limitations in the prior art.
BRIEF DESCRIPTION OF THE DRAWINGSThe invention will be understood more fully from the detailed description given below and from the accompanying drawings of particular embodiments of the invention, which, however, should not be taken to limit the invention to the specific embodiments, but are to facilitate explanation and understanding.
In the following detailed descriptions, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode and a second voltage, which is different from the first voltage, can be applied to the lower electrode. A wire layer, through which the first voltage is applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.
The MIM capacitor 100 shown in
MIM capacitors formed using the layout diagram shown in
The second wire layer 114 is formed of a conductive layer in the same level as the first wire layer 112. The contact hole C/H1 is formed to expose the surface of the first wire layer 112 before the upper electrode 140 is formed. Therefore, the contact hole C/H1 is completely different from the contact hole C/H in the conventional MIM capacitor 10 shown in
According to embodiments of the present invention, the upper electrode and a dielectric layer do not need to be formed as thick as they formerly were in the conventional techniques. In other words, it is possible to minimize the thickness of the dielectric layer and to still form an MIM capacitor that has a high capacitance. In addition, since the thickness of the dielectric layer 130, in which the contact hole C/H1 is formed, is very small, the aspect ratio of the contact hole C/H1 is also very small. Accordingly, the problems accompanied by the contact holes C/H of
As shown in
The upper electrode 140 is covered with an upper interlayer dielectric layer so that it can be insulated from an upper structure (not shown). The upper interlayer dielectric layer is preferably a capping layer 150 for protecting the upper electrode 140 and an interlayer dielectric layer 155.
Connections between the first and second wire layers 112 and 114 and other wire layers and processes of manufacturing wire layers in a level higher than the Mn+1 level may vary depending on the application.
The sizes of the upper and lower electrodes 140 and 120 may also vary depending on the application, preferably, to maximize the effective area of a capacitor electrode, i.e., the surface area of the upper and lower electrodes 140 and 120 facing each other.
In
Referring to
Referring to
Referring to
An MIM capacitor shown in
The MIM capacitor 200 according to this embodiment of the invention may be embodied using layouts such as example layout diagrams shown in
The cross-sections of MIM capacitors formed using the layouts shown in
Referring to
The MIM capacitor 300 according to this embodiment may be embodied using the layouts such as the example layouts shown in
The cross-sections of MIM capacitors embodied using the layouts shown in
Referring to
In terms of minimizing a step difference, it is preferable that the top surfaces of the lower electrode 320 and the first wire layer 322 are level with each other. In
An MIM capacitor shown in
Referring to
Next, an example method for manufacturing the MIM capacitor shown in
Referring to
The conductive layer 111 may be formed of any low-resistance material that is appropriate for a damascene processes. For example, the conductive layer 111 may be formed of a copper (Cu) layer. In particular, a copper seed layer is formed on the barrier layer 110 which is formed at the inner walls and the bottom of the trenches T1 and T2. Next, the conductive layer 111 comprised of a copper layer is formed on the copper seed layer to completely fill the trenches T1 and T2 using electroplating.
Thereafter, as shown in
Next, a conductive level at a Mn level is deposited on the entire surface of the substrate and is patterned using conventional photolithography so that a lower electrode 120 is formed to directly contact the second wire layer 114. The lower electrode 120 may be formed of a metal layer, a metal compound layer, or a combination thereof, for instance. For example, the lower electrode 120 may be formed of an Al layer, a Ta layer, a TaN layer, a TaSiN layer, a TiN layer, a TiSiN layer, a WN layer, a WSiN layer, or any combination thereof. Alternatively, the lower electrode 120 may be formed of a double layer of a Ta layer and a Cu layer, a double layer of a TaN layer and a Cu layer, a triple layer of a Ta layer, a TaN layer, and a Cu layer, or a triple layer of a TiN layer, a AlCu layer, and a TiN layer and so on.
Next, as shown in
Next, as shown in
As shown in
As shown in
Next, a method for manufacturing a portion of the MIM capacitor according to the third embodiment of the present invention, which is shown in
A conductive layer in a Mn level is formed on a lower interlayer dielectric layer 302 and is patterned using conventional photolithography, thus forming a lower electrode 320 and a first wire layer 322. Next, a dielectric layer 330 is deposited and is patterned, thus forming a contact hole C/H1 through which the first wire layer 322 is exposed. Subsequent processes may be performed using methods which are well known to the one in the art, thus forming an MIM capacitor having the cross-section shown in
Those skilled in the art recognize that the MIM capacitor described herein can be implemented in many different variations. Therefore, although various embodiments are specifically illustrated and described herein, it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appending claims without departing from the spirit and intended scope of the invention.
Claims
1. A method for forming a metal-insulator-metal capacitor in a semiconductor process, the method comprising:
- forming an insulating layer on a semiconductor substrate;
- forming a first connection wire and a second connection wire;
- forming a bottom electrode on the insulating layer and disposed over the first connection wire;
- forming a dielectric layer over the bottom electrode;
- forming a top electrode disposed over the bottom electrode; and
- forming a contact from the second connection wire to a bottom surface of the top electrode.
2. The method of claim 1, wherein forming the first and second connection wire comprises:
- forming a first and a second trench in the insulating layer;
- forming a metal layer within the first trench and the second trench; and
- planarizing the metal layer to form a first connection wire in the first trench and a second connection wire in the second trench.
3. The method of claim 2, further comprising forming a barrier layer in the first and second trenches prior to forming the metal layer within the first and second trenches.
4. The method of claim 3 wherein forming a barrier layer comprises forming a layer from a material selected from a group consisting essentially of a transition metal, a transition metal alloy, a transition metal compound, and any combination thereof.
5. The method of claim 2 wherein forming the metal layer comprises forming a copper layer.
6. The method of claim 1, wherein forming the first and second connection wire comprises:
- forming a conductive layer on the insulating layer;
- patterning the conductive layer to form a first wire connection and a second wire connection;
- depositing an interlayer dielectric layer on the first and second wire connections; and
- planarizing the first and second wire connections and the interlayer dielectric layer.
7. The method of claim 6 wherein planarizing the first and second wire connections and the interlayer dielectric layer comprises perfonning a CMP process.
8. The method of claim 1, wherein forming the first and second connection wire comprises:
- forming a conductive layer on the insulating layer; and
- patterning the conductive layer to form a first wire connection and a second wire connection.
9. A method for forming a metal-insulator-metal capacitor in a semiconductor process, the method comprising:
- forming an insulating layer on a semiconductor substrate;
- forming a first wire connection and a second wire connection;
- forming a first interlayer dielectric layer on the first wire connection and the second wire connection;
- forming a first contact hole in the first interlayer dielectric layer to expose the first wire connection;
- forming a bottom electrode on the first interlayer dielectric layer and within the first contact hole to contact the first wire connection;
- forming a dielectric layer on the bottom electrode;
- forming a second contact hole in the dielectric layer and in the first interlayer dielectric layer to contact the second wire connection; and
- forming a top electrode disposed over the bottom electrode and within the second contact hole to contact the second wire connection.
10. The method of claim 9, wherein forming the first and second wire connection comprises:
- forming a first and a second trench in the insulating layer;
- forming a conductive layer within the first trench and the second trench; and
- planarizing the conductive layer to form a first wire connection in the first trench and a second wire connection in the second trench.
11. The method of claim 9, wherein forming the first and second connection wire comprises:
- forming a conductive layer on the insulating layer;
- patterning the conductive layer to form a first wire connection and a second wire connection;
- depositing an interlayer dielectric layer on the first and second wire connections; and
- planarizing the first and second wire connections and the interlayer dielectric layer.
12. The method of claim 9, wherein forming the first and second wire connection comprises:
- forming a conductive layer on the insulating layer; and
- patterning the conductive layer to form a first wire connection and a second wire connection.
13. The method of claim 9 wherein forming the first contact hole comprises forming a plurality of separate contact holes.
14. The method of claim 9 wherein forming the second contact hole comprises forming a second plurality of separate contact holes.
15. A method for forming a metal-insulator-metal capacitor in a semiconductor process, the method comprising:
- forming an insulating layer on a semiconductor substrate;
- forming a first wire connection and a bottom electrode;
- forming a dielectric layer on the first wire connection and the bottom electrode;
- forming a first contact hole in the dielectric layer and disposed over the first wire connection;
- forming a top electrode disposed over the dielectric layer and within the first contact hole to contact the first wire connection;
- forming a interlayer dielectric layer disposed over the top electrode, the dielectric layer, and the bottom electrode;
- forming a second contact hole in the interlayer dielectric layer and in the dielectric layer to expose the bottom electrode; and
- forming a contact plug within the second contact hole and structured to contact a top surface of the bottom electrode.
16. The method of claim 15, wherein forming the first wire connection and the bottom electrode comprises:
- forming a first and a second trench in the insulating layer;
- forming a conductive layer within the first trench and the second trench; and
- planarizing the conductive layer to form a first wire connection in the first trench and a bottom electrode in the second trench.
17. The method of claim 15, wherein forming the first wire connection and the bottom electrode comprises:
- forming a conductive layer on the insulating layer;
- patterning the conductive layer to form a first wire connection and a bottom electrode;
- depositing an interlayer dielectric layer on the first wire connection and the bottom electrode; and
- planarizing the first wire connection, the bottom electrode, and the interlayer dielectric layer.
18. The method of claim 15, wherein forming the first wire connection and the bottom electrode comprises:
- forming a conductive layer on the insulating layer; and
- patterning the conductive layer to form a first wire connection and a bottom electrode.
19. A method for forming a metal-insulator-metal capacitor in a semiconductor process and on a semiconductor substrate having an insulating layer formed thereon, the method comprising:
- forming a connection line on the insulating layer;
- forming a bottom electrode on the insulating layer;
- forming a capacitor dielectric layer disposed on the bottom electrode;
- forming a top electrode disposed on the capacitor dielectric layer; and
- coupling the connection line to a bottom surface of the top electrode.
20. The method of claim 19 wherein forming the connection line comprises:
- forming a first and second trench in the insulating layer;
- forming a barrier layer in the first and second trench;
- forming a metal layer on the barrier layer; and
- planarizing the metal layer.
21. The method of claim 18 wherein forming a metal layer comprises electroplating the barrier layer.
22. The method of claim 18 wherein forming a barrier layer comprises forming a layer including titanium.
23. The method of claim 19 wherein forming the connection line comprises:
- forming a metal layer on the insulating layer;
- patterning the metal layer to form a connection line;
- forming a second insulating layer on the connection line; and
- planarizing the metal layer and the second insulating layer by chemical-mechanical-polishing.
Type: Application
Filed: Nov 13, 2006
Publication Date: Mar 29, 2007
Applicant: SAMSUNG ELECTRONICS CO., LTD. (Gyeonggid-do)
Inventors: Jeong-Hoon AHN (Seoul), Kyungtae LEE (Gyeonggi-do), Mu-Kyung JUNG (Suwon), Yong-Jun LEE (Gyeonggi-do)
Application Number: 11/559,317
International Classification: H01L 21/66 (20060101); H01L 21/331 (20060101); G01R 31/26 (20060101);