Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

Abstract: Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.

Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.

Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.

Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.

Abstract: Embodiments herein generally relate to chemical mechanical polishing (CMP) systems and methods for reducing non-uniform material removal rate at or near the peripheral edge of a substrate when compared to radially inward regions therefrom. In one embodiment, a polishing system includes a substrate carrier comprising an annular retaining ring which is used to surround a to-be-processed substrate during a polishing process and a polishing platen. The polishing platen includes cylindrical metal body having a pad-mounting surface. The pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone. A surface of the second zone is recessed from surfaces of the first and third zones adjacent thereto, and a width of the second zone is less than an outer diameter of the annular retaining ring.

Abstract: A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding mechanism, a polishing head, and a head cleaning device configured to supply the cleaning liquid to the polishing head to clean the polishing head during polishing and/or after polishing of the substrate.

Abstract: Methods of making polymer bond abrasive articles and their precursors using powder bed jetting are disclosed. Polymer bond abrasive articles prepared by the method include abrasive articles having arcuate or tortuous cooling channels, unitary structured abrasive discs, abrasive segments, shaped abrasive particles, and abrasive wheels.

Abstract: A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.

Abstract: Provided is a polishing pad that comprises a plurality of first grooves that have a shape of geometric figures that share a center; and a plurality of second grooves that radially extend from the center to the outer perimeter, wherein the depth of the second grooves is equal to, or deeper than, the depth of the first grooves. It is possible for the polishing pad to rapidly discharge any debris generated during the polishing process to reduce such defects as scratches on the surface of a wafer.

Abstract: Devices and methods for cleaning an array of solar panels in side-by-side relation employ one or more elongated flexible elements, preferably implemented as translucent strips (14a, 14b, 14c, 14d), anchored at their ends relative to the array of solar panels (12). Each strip spans two or more solar panels, and is wind-displaceable so as to contribute to cleaning of at least two of the solar panels (12).

Abstract: A carbon material has at least either a peak related to diamond bonds, or a peak related to diamond-like bonds, appearing in a range of 1250 to 1400 cm?1 in a spectrum measured by Raman scattering spectrometry, and a full width at half maximum of a maximum peak, or each of full widths at half maximum of the maximum peak and a second largest peak, among peaks appearing in the range of 1250 to 1400 cm?1, has a signal less than 100 cm?1.

Abstract: A patterning sheet, or the like, is suitable when a complex etching target is to be etched in a simple manner to produce an etched structure. This patterning sheet comprises a base sheet formed from an etching-solution permeable first polymer, and particles dispersed in the base sheet and formed from a second polymer, which absorbs and holds the etching solution.

Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing successive layers by droplet ejection to form the polishing pad. The polishing pad includes a polishing surface having one or more partitions separated by one or more grooves. Depositing a layer of the successive layers includes dispensing first regions corresponding to edges of the one or more partitions by a first droplet ejection process. After curing the first regions, a second region corresponding to interior of the one or more partitions is dispensed between the edges by a different second droplet ejection process.

Abstract: An herb or tobacco grinder is provided in which the cutting surfaces line a series of elongated, curved grooves. The slots or grooves are laterally elongated such as to easily receive leaf material, as well as stem, seed or the like. The slots or grooves are slightly curved in opposite directions and intersect to form an impingement cutting region.

Abstract: A bonded abrasive article can include a body including a bond material, abrasive particles contained within the bond material, and pores contained within the body. At least a portion of the pores of the body can include a coating. In one aspect, the coating can be a poly(p-xylylene) polymer applied via vapor deposition. The coated abrasive body can maintain a high permeability and pore volume after coating, and the coating can provide an increase in flexural strength and corrosion resistance to the abrasive article, thereby greatly enhancing its life time.

Abstract: The present application relates to an encapsulating composition, an organic electronic device, a method for evaluating reliability of the organic electronic device and a method for preparing the organic electronic device, and provides an encapsulating composition which can improve flatness and adhesion of an organic layer sealing an organic electronic element to effectively block moisture or oxygen introduced into an organic electronic device from the outside, thereby securing the lifetime of the organic electronic device.

Abstract: Disclosed herein are spandex fibers having reduced friction. The spandex fibers have a sheath-core cross-section with a lubricating additive is included in the sheath. A fusing additive is optionally included where a coalesced multifilament spandex yarn is desired.

Abstract: A supporting stand for supporting a panel is provided. The supporting stand comprises a base, a first force module, a one-way bearing, a rotating element, and a second force module. The base includes a bottom board and a first connecting board. The first force module is disposed on the first connecting board and includes a mandrel. The one-way bearing includes a shaft hole for the mandrel disposed therethrough. The rotating element connects with the one-way bearing and the panel so that the panel is capable of rotating at the mandrel along a first rotating direction or a second rotating direction opposite to the first rotating direction. The second force module is disposed on the base and actuated together with the rotating element. When the panel and the rotating element rotate along the first rotating direction, the one-way bearing refrains the first force module from providing a first backward torque to the rotating element.

Abstract: The present disclosure provides for preparing formulations to clear and clean paint deposits from surfaces. In some examples, the paint deposits may be spray paint deposits on concrete, brick and metal surfaces amongst others. In some examples, the formulations may include active salt agents comprising molybdenum and aluminum cations.

Abstract: A porous ceramic structure includes one sheet, and a plurality of porous ceramic particles bonded on the sheet. A gap d formed between adjacent ones of the porous ceramic particles is 10˜80 ?m.

Abstract: A process can include forming at least one precursor abrasive component on a core and infiltrating at least a portion of the precursor abrasive component. The precursor abrasive component can include a body including a metal bond matrix and abrasive particles. Infiltrating can be performed after forming the precursor abrasive component with an infiltrant material. The infiltrant material can include a metal element, an alloy or a combination thereof. In an embodiment, forming at least one precursor abrasive component can include simultaneously joining the precursor abrasive component to the core.

Abstract: A planarization method includes a grinding step of holding the opposite side to a separation surface in an SiC ingot by a rotatable chuck table and rotating a grinding wheel having plural grinding abrasives disposed in a ring manner to grind the separation surface of the SiC ingot held by the chuck table, and a flatness detection step of irradiating the separation surface of the SiC ingot exposed from the grinding wheel with light and detecting reflected light to detect the degree of flatness. The grinding step is ended when that the separation surface of the SiC ingot has become flat is detected in the flatness detection step.

Abstract: The method generally involves the steps of filling the cavities in a production tool each with an individual abrasive particle. Aligning a filled production tool and a resin coated backing for transfer of the abrasive particles to the resin coated backing. Transferring the abrasive particles from the cavities onto the resin coated backing and removing the production tool from the aligned position with the resin coated backing. Thereafter the resin layer is cured, a size coat is applied and cured and the coated abrasive article is converted to sheet, disk, or belt form by suitable converting equipment.

Abstract: One exemplary aspect of the present disclosure relates to a method of forming a friction material. The method includes depositing a plurality of particles on a substrate such that the particles provide a plurality of projections and channels between adjacent projections. This disclosure also relates to the friction material itself, and a system including a mechanical component and the friction material.

Abstract: Curable compositions are provided comprising: (a) an isocyanate-functional prepolymer having a weight average molecular weight of 4000 to 15,000; (b) a curing agent comprising a mixture of polyamines, wherein at least one polyamine has an amine equivalent weight of 125 to 250; and (c) an abrasion resistant additive comprising organic and inorganic particles. The isocyanate-functional prepolymer is (i) a reaction product of a polyisocyanate and a polyamine having primary and/or secondary amino groups; and/or (ii) a reaction product of a polyisocyanate and a polyol. Upon application of the composition to a substrate as a coating and after curing to form a coated substrate, the coated substrate demonstrates a coating loss of less than 0.33 cm3 after being subjected to 1000 cycles of a TABER Abrasion Test using S-42 sandpaper strips and two 1000 gram weights. Coated substrates and footwear components prepared from the compositions are also disclosed.

Abstract: Described herein is an improved abrasive material (300) in which the cutting performance is orientation-independent. The abrasive material (300) comprises an abrasive structure (310) including a plurality of elongate abrasive elements (320, 330) aligned to be define a first open square. A plurality of pyramidal abrasive elements (340, 350) arranged in a second open square are located within the first open square defined by the elongate elements (320, 330).

Abstract: A polishing sheet includes a sheet including one side having a surface, a plurality of convex portions provided to project from the surface of the one side of the sheet, a plurality of first abrasive grains provided on an upper surface of each of the convex portions, and a plurality of second abrasive grains provided on the surface of the sheet. The second abrasive grains each have hardness higher than that of the first abrasive grains.

Abstract: An abrasive disc for use with a sanding tool having a plurality of dust collection holes includes a hole pattern consisting of six openings arranged for substantial alignment with the dust collection holes provided in the sanding tool.

Abstract: The invention relates to a multilayer abrasive particle (01) having a layer structure of stacked layers (02), each of the layers (02) being formed parallel to a plane (E). The exposed surfaces (04) of the layers (02) not covered by another layer and/or the edges (08) connecting the exposed surfaces (04) extend at least partially convexly or concavely in relation to the plane (E) and/or to a plane (E2) that is perpendicular thereto and comprises the direction (03) of the layer thickness.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: A filament for cosmetic brush is constituted by a polyester resin filament having many projections over its entire surface, wherein the polyester resin is polytrimethylene terephthalate and/or polybutylene terephthalate, the polyester resin contains glass particles of 1 to 2 ?m in average particle size by 0.3 to 1.0 percent by weight as the inorganic particles, the thermal conductivity of the glass particle is in a range of 5 to 7 times that of the resin, and the projections are formed over the entire surface of the cosmetic filament by the glass particles covered with the resin.

Abstract: Methods and systems are provided for design and manufacture of a non-metallic polishing tool capable of polishing different surfaces and achieving a smooth and shiny finish. The polishing tool comprises an abrasive coated base surface, and a plurality of engravings in the base surface, forming cylindrical pillars. The pillars are arranged in concentric circular patterns to provide uniform polish and shine on a target material.

Abstract: In order to provide a tool holder for holding a tool for treating the surface of a workpiece by means of which it is possible to treat workpieces in a low-vibratory and convenient manner, it is proposed that the tool holder comprise a disk-shaped base body which has an attachment section for the attachment of the tool holder to a machine tool and at least one resiliently flexible deformation section.

Abstract: One exemplary aspect of the present disclosure relates to a method of forming a friction material. The method includes depositing a plurality of particles on a substrate such that the particles provide a plurality of projections and channels between adjacent projections. This disclosure also relates to the friction material itself, and a system including a mechanical component and the friction material.

Abstract: An apparatus includes an injection part, a transfer part, a pressure supply part, a collision part and an emission part. An object is injected through the injection part. The transfer part is connected to the injection part, and bended at a plurality of points thereof. The object passes through the transfer part. The pressure supply part is connected to the transfer part and supplies a pressure into the transfer part to move the object. The collision part collides with the object moving in the transfer part to treat a surface of the object. The emission part is connected to the transfer part, and the object having the treated surface is emitted through the emission part.

Abstract: Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.

Abstract: A method of polishing a wafer at the die level with a targeted slurry delivery system. The wafer is placed on a wafer carrier exposing the top side of the wafer, the wafer contains a die. The polishing apparatus will polish a portion of the die using a pad that is smaller than the die and the pad is located above the die. A slurry is applied to a portion of the die being polished. Embodiments of the invention provide multiple pads working on the same die.

Abstract: A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.

Abstract: A device for straightening and stabilizing the vertebral column, particularly for stabilizing broken vertebrae, includes a supporting implant which is plastically expandable by internal pressure. The supporting implant can be placed into the interior of a vertebral body which has been fractured under compression or between adjacent vertebral bodies. A pressure balloon to which pressure fluid can be admitted may be arranged in the interior of the supporting implant for producing the internal pressure.

Abstract: A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.

Abstract: The method for producing a patterned layer of first material on a surface of a substrate comprises the following successive steps: arranging a particle on the surface of the substrate; depositing a resin by spin coating on the surface of the substrate so as to form the patterned layer of first material and a hole passing through the layer of first material and opening onto the particle; the material of the particle and the resin being chosen such that the particle exerts a repulsive interaction with respect to the resin.

Abstract: A method of chemical mechanical polishing (CMP) a diamond containing surface includes providing a slurry including a plurality of particles, at least one oxidizer, and at least one acid, wherein the slurry has a pH?3 or pH greater than 11. At least an outer surface of the plurality of particles is softer than the diamond surface or the particles are diamond particles averaging less than (<) 2 ?m in size. The diamond surface is pressed with respect to a polishing pad providing a Shore D Hardness less than 99 having the slurry in between while rotating the polishing pad relative to the diamond surface to form a smooth diamond surface having a root mean square (rms) surface roughness less than 15 nm.

Abstract: A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.

Abstract: A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.

Abstract: A thermoset composite material and composite railroad crosstie fabricated from the thermoset composite material that comprises a substantially homogeneous blend of an amount of vulcanized rubber particles, polyurea binding agent and urea melamine. The thermoset composite material may also contain a granulated silica material. The thermoset composite material may comprise about 30% to about 50% by weight of the vulcanized rubber particles, and it is subjected to compression molding at a predetermined temperature and pressure for a resident time period forming the composite railroad crosstie. The thermoset composite material and railroad crosstie may further comprise a fibrous glass material in the form of unbundled fibers and/or one more glass mats encapsulated within the thermoset composite material. In addition or alternatively, an elongated core insert may be encapsulated in the thermoset composite material.

Abstract: A tool has disks or ring disks arranged for metal-cutting, which are stacked on top of each other in an overlapping fashion and engage into each other at their incisions which reach from the outer circumference up to the center point of the disks or the inner circumference of the ring disks. The incisions of the directly adjacent disks or ring disks are respectively angularly offset by 360°/n, with n being the number of the disks or ring disks. A production method is also provided for such a tool, in which the disks or ring disks are incised up to the center point or inner circumference, are completely slid into each other at the incisions, folded towards one another and displaced until an angular offset of the incisions of 360°/n is produced.

Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.

Abstract: A polishing pad includes at least a cushion layer and a polishing layer including a groove, on a polishing surface, having side surfaces and a bottom surface, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle ? with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle ? with a plane parallel to the polishing surface, the angle ? is larger than 90 degrees, the angle ? is not smaller than 85 degrees, and the angle ? is smaller than the angle ?, a bending point depth is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3×10?6 ?m/Pa and not more than 4.4×10?4 ?m/Pa.

Abstract: A tool for the polishing of an optical surface has a base which has an active surface facing the optical surface. An intermediate layer is arranged on the active surface of the base. A polishing agent carrier is arranged on the elastic intermediate layer. The elastic intermediate layer projects radially beyond the active surface of the base and the polishing agent carrier projects radially beyond the elastic intermediate layer.