Interrupted Or Composite Work Face (e.g., Cracked, Nonplanar, Etc.) Patents (Class 451/527)
  • Patent number: 10099343
    Abstract: An abrasive disc for use with a sanding tool having a plurality of dust collection holes includes a hole pattern consisting of six openings arranged for substantial alignment with the dust collection holes provided in the sanding tool.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: October 16, 2018
    Assignee: 3M Innovative Properties Company
    Inventor: Brian D. Goers
  • Patent number: 10081747
    Abstract: The invention relates to a multilayer abrasive particle (01) having a layer structure of stacked layers (02), each of the layers (02) being formed parallel to a plane (E). The exposed surfaces (04) of the layers (02) not covered by another layer and/or the edges (08) connecting the exposed surfaces (04) extend at least partially convexly or concavely in relation to the plane (E) and/or to a plane (E2) that is perpendicular thereto and comprises the direction (03) of the layer thickness.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: September 25, 2018
    Assignee: KLINGSPOR AG
    Inventors: Irene Bock, Thomas Kamps
  • Patent number: 10071461
    Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: September 11, 2018
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Duy K. Lehuu, Kenneth A. P. Meyer, Moses M. David
  • Patent number: 9949560
    Abstract: A filament for cosmetic brush is constituted by a polyester resin filament having many projections over its entire surface, wherein the polyester resin is polytrimethylene terephthalate and/or polybutylene terephthalate, the polyester resin contains glass particles of 1 to 2 ?m in average particle size by 0.3 to 1.0 percent by weight as the inorganic particles, the thermal conductivity of the glass particle is in a range of 5 to 7 times that of the resin, and the projections are formed over the entire surface of the cosmetic filament by the glass particles covered with the resin.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: April 24, 2018
    Inventors: Kenji Nakamura, Koji Nakamura
  • Patent number: 9849562
    Abstract: Methods and systems are provided for design and manufacture of a non-metallic polishing tool capable of polishing different surfaces and achieving a smooth and shiny finish. The polishing tool comprises an abrasive coated base surface, and a plurality of engravings in the base surface, forming cylindrical pillars. The pillars are arranged in concentric circular patterns to provide uniform polish and shine on a target material.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: December 26, 2017
    Assignee: SHINE-FILE LLC
    Inventors: Jaehee Sweeney, ChunSeob Hwang, Michael Patrick Sweeney
  • Patent number: 9718169
    Abstract: In order to provide a tool holder for holding a tool for treating the surface of a workpiece by means of which it is possible to treat workpieces in a low-vibratory and convenient manner, it is proposed that the tool holder comprise a disk-shaped base body which has an attachment section for the attachment of the tool holder to a machine tool and at least one resiliently flexible deformation section.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: August 1, 2017
    Assignee: Flex-Elektrowerkzeuge GmbH
    Inventors: Dirk Roeck, Udo Panzer, Nazim Sabuncuoglu
  • Patent number: 9683613
    Abstract: One exemplary aspect of the present disclosure relates to a method of forming a friction material. The method includes depositing a plurality of particles on a substrate such that the particles provide a plurality of projections and channels between adjacent projections. This disclosure also relates to the friction material itself, and a system including a mechanical component and the friction material.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: June 20, 2017
    Inventor: Paul A. Stefanutti
  • Patent number: 9669516
    Abstract: An apparatus includes an injection part, a transfer part, a pressure supply part, a collision part and an emission part. An object is injected through the injection part. The transfer part is connected to the injection part, and bended at a plurality of points thereof. The object passes through the transfer part. The pressure supply part is connected to the transfer part and supplies a pressure into the transfer part to move the object. The collision part collides with the object moving in the transfer part to treat a surface of the object. The emission part is connected to the transfer part, and the object having the treated surface is emitted through the emission part.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: June 6, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Choul Lee, Choul-Gue Park, Ki-Hong Jung
  • Patent number: 9555518
    Abstract: Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: January 31, 2017
    Assignee: NexPlanar Corporation
    Inventors: Ping Huang, Diane Scott, James P. LaCasse, William C. Allison
  • Patent number: 9373524
    Abstract: A method of polishing a wafer at the die level with a targeted slurry delivery system. The wafer is placed on a wafer carrier exposing the top side of the wafer, the wafer contains a die. The polishing apparatus will polish a portion of the die using a pad that is smaller than the die and the pad is located above the die. A slurry is applied to a portion of the die being polished. Embodiments of the invention provide multiple pads working on the same die.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: June 21, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Rishikesh Krishnan, Rajasekhar Venigalla
  • Patent number: 9308620
    Abstract: A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: April 12, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Christopher Lee Schutte, Prakash Lakshmikanthan
  • Patent number: 9299382
    Abstract: A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: March 29, 2016
    Assignee: HOYA CORPORATION
    Inventors: Hideo Sakai, Yoshihiro Tawara
  • Patent number: 9295502
    Abstract: A device for straightening and stabilizing the vertebral column, particularly for stabilizing broken vertebrae, includes a supporting implant which is plastically expandable by internal pressure. The supporting implant can be placed into the interior of a vertebral body which has been fractured under compression or between adjacent vertebral bodies. A pressure balloon to which pressure fluid can be admitted may be arranged in the interior of the supporting implant for producing the internal pressure.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: March 29, 2016
    Assignee: DePuy Synthes Products, Inc.
    Inventor: Sebastian Fuerderer
  • Patent number: 9288912
    Abstract: The method for producing a patterned layer of first material on a surface of a substrate comprises the following successive steps: arranging a particle on the surface of the substrate; depositing a resin by spin coating on the surface of the substrate so as to form the patterned layer of first material and a hole passing through the layer of first material and opening onto the particle; the material of the particle and the resin being chosen such that the particle exerts a repulsive interaction with respect to the resin.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: March 15, 2016
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Thomas Sebastien, Messaoud Bedjaoui, Aboubakr Ennajdaoui
  • Patent number: 9259819
    Abstract: A method of chemical mechanical polishing (CMP) a diamond containing surface includes providing a slurry including a plurality of particles, at least one oxidizer, and at least one acid, wherein the slurry has a pH?3 or pH greater than 11. At least an outer surface of the plurality of particles is softer than the diamond surface or the particles are diamond particles averaging less than (<) 2 ?m in size. The diamond surface is pressed with respect to a polishing pad providing a Shore D Hardness less than 99 having the slurry in between while rotating the polishing pad relative to the diamond surface to form a smooth diamond surface having a root mean square (rms) surface roughness less than 15 nm.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: February 16, 2016
    Assignees: Sinmat, inc., University of Florida Research Foundation, Inc.
    Inventors: Rajiv K. Singh, Deepika Singh, Arul Chakkaravarthi Arjunan
  • Patent number: 9254547
    Abstract: A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: February 9, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yin Yuan, Hung Chih Chen, Shou-Sung Chang
  • Patent number: 9181420
    Abstract: A thermoset composite material and composite railroad crosstie fabricated from the thermoset composite material that comprises a substantially homogeneous blend of an amount of vulcanized rubber particles, polyurea binding agent and urea melamine. The thermoset composite material may also contain a granulated silica material. The thermoset composite material may comprise about 30% to about 50% by weight of the vulcanized rubber particles, and it is subjected to compression molding at a predetermined temperature and pressure for a resident time period forming the composite railroad crosstie. The thermoset composite material and railroad crosstie may further comprise a fibrous glass material in the form of unbundled fibers and/or one more glass mats encapsulated within the thermoset composite material. In addition or alternatively, an elongated core insert may be encapsulated in the thermoset composite material.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: November 10, 2015
    Assignee: ENCELL COMPOSITES, LLC
    Inventors: Anthony M. Cialone, Michael Grubb
  • Patent number: 9183868
    Abstract: A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: November 10, 2015
    Assignee: HOYA CORPORATION
    Inventors: Hideo Sakai, Yoshihiro Tawara
  • Patent number: 9138858
    Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: September 22, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jimin Zhang, Thomas H. Osterheld, Boguslaw A. Swedek
  • Patent number: 9138870
    Abstract: A tool has disks or ring disks arranged for metal-cutting, which are stacked on top of each other in an overlapping fashion and engage into each other at their incisions which reach from the outer circumference up to the center point of the disks or the inner circumference of the ring disks. The incisions of the directly adjacent disks or ring disks are respectively angularly offset by 360°/n, with n being the number of the disks or ring disks. A production method is also provided for such a tool, in which the disks or ring disks are incised up to the center point or inner circumference, are completely slid into each other at the incisions, folded towards one another and displaced until an angular offset of the incisions of 360°/n is produced.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: September 22, 2015
    Assignee: Gerd Eisenblaetter GmbH
    Inventor: Gerd Eisenblaetter
  • Patent number: 9114501
    Abstract: A polishing pad includes at least a cushion layer and a polishing layer including a groove, on a polishing surface, having side surfaces and a bottom surface, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle ? with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle ? with a plane parallel to the polishing surface, the angle ? is larger than 90 degrees, the angle ? is not smaller than 85 degrees, and the angle ? is smaller than the angle ?, a bending point depth is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3×10?6 ?m/Pa and not more than 4.4×10?4 ?m/Pa.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: August 25, 2015
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Nana Takeuchi, Seiji Fukuda, Ryoji Okuda, Shigetaka Kasai
  • Publication number: 20150105002
    Abstract: A tool for the polishing of an optical surface has a base which has an active surface facing the optical surface. An intermediate layer is arranged on the active surface of the base. A polishing agent carrier is arranged on the elastic intermediate layer. The elastic intermediate layer projects radially beyond the active surface of the base and the polishing agent carrier projects radially beyond the elastic intermediate layer.
    Type: Application
    Filed: October 16, 2014
    Publication date: April 16, 2015
    Inventors: Gerd Nowak, Georg Michels
  • Patent number: 9004983
    Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: April 14, 2015
    Assignee: Corning Incorporated
    Inventors: Raymond Charles Cady, Michael John Moore, Mark Alex Shalkey, Mark Andrew Stocker
  • Publication number: 20150093977
    Abstract: Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
    Type: Application
    Filed: December 5, 2014
    Publication date: April 2, 2015
    Inventors: Manish Deopura, Hem M. Vaidya, Pradip K. Roy
  • Publication number: 20150079886
    Abstract: A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.
    Type: Application
    Filed: September 18, 2013
    Publication date: March 19, 2015
    Applicant: Texas Instruments Incorporated
    Inventors: Christopher Lee Schutte, Prakash Lakshmikanthan
  • Patent number: 8979618
    Abstract: A polishing tool for processing an optical surface of a spectacle lens, having a carrier body and a polishing film, an elastic layer being arranged between said polishing film and said carrier body. Further, there is provision for a surface of said polishing film, which surface is active during processing, to decrease in size in an edge region of said polishing film outwards in said radial direction. Furthermore, an apparatus is provided for polishing an optical surface of a spectacle lens having a polishing tool as described above.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: March 17, 2015
    Assignee: Carl Zeiss Vision GmbH
    Inventors: Gerd Nowak, Michael Zaiser
  • Patent number: 8980378
    Abstract: There is provided a system and method to spray viscous coating materials comprising abrasive particles, such as Silicium Carbide. Such coating materials are e.g. advanced ceramic composites formulated to protect equipment from corrosion and erosion. In particular the method and the system is able to spray and evenly coat a surface with two component materials based on modified epoxy resin and aliphatic curing agent loaded with abrasive ceramic particles.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: March 17, 2015
    Assignee: Pieter Mouritsen A/S
    Inventors: Thomas Soegaard Jensen, Michael Klaesoee
  • Publication number: 20150065012
    Abstract: A structured abrasive article comprises a structured abrasive layer adhered to a major surface of a backing, the structured abrasive layer comprising shaped abrasive composites adhered to the major surface, the shaped abrasive composites comprising milled polycrystalline ceramic abrasive particles retained in a polymeric binder, wherein the milled polycrystalline ceramic abrasive particles have a median particle size D50 of from 3 to 30 microns. In a method of finishing a stone surface, the structured abrasive layer is frictionally contacting with the stone surface; and moved relative to the stone surface under conditions sufficient to finish the stone surface.
    Type: Application
    Filed: August 27, 2013
    Publication date: March 5, 2015
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: James L. McArdle
  • Patent number: 8968058
    Abstract: Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: March 3, 2015
    Assignee: NexPlanar Corporation
    Inventors: Robert Kerprich, William C. Allison, Diane Scott
  • Publication number: 20150056900
    Abstract: Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 26, 2015
    Inventors: Rajeev Bajaj, Ping Huang, Robert Kerprich, William C. Allison, Richard Frentzel, Diane Scott
  • Publication number: 20150044951
    Abstract: Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.
    Type: Application
    Filed: August 8, 2014
    Publication date: February 12, 2015
    Inventors: Rajeev BAJAJ, Craig E. BOHN, Fred Conrad REDEKER
  • Publication number: 20150038066
    Abstract: Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 5, 2015
    Inventors: Ping Huang, William C. Allison, Richard Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott
  • Patent number: 8939818
    Abstract: An object of the invention is to provide a polishing pad which has a polishing layer with a phase-separated structure and can provide high polishing rate and high planarization property and with which scratching can be suppressed. The polishing pad comprises the polishing layer. The polishing layer comprises a product of curing reaction of a polyurethane-forming raw material composition containing: (A) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (a) containing an isocyanate component and a polyester-based polyol; (B) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (b) containing an isocyanate component and a polyether-based polyol; and a chain extender, wherein the product of curing reaction has a phase-separated structure.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: January 27, 2015
    Assignee: Toyo Tire & Rubber Co. Ltd.
    Inventors: Shinji Shimizu, Atsushi Kazuno
  • Publication number: 20150020369
    Abstract: A hand sander and sanding disc fixture for attaching a sanding disc to a hand sander includes a table having a top with a sander storage station and an application station thereon. The storage station has a holder capable of holding a hand sander having a sander pad on the top of the table. The application station has at least two datum pegs extending from the top of the table that are capable of passing through two corresponding datum holes in the sanding disc. The at least two datum pegs having datum surfaces configured to be received in datum notches in an outer diameter of the sander pad. The datum pegs are capable of aligning the sander pad with the sanding disc when the sander pad is pressed against an attaching side of the sanding disc.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 22, 2015
    Applicants: Honda Motor Co., Ltd., Tool Technologies by Van Dyke, LLC, Starcke Abrasive USA, Inc.
    Inventors: Cheryl Ann Ryan, Anthony Mudd, Steven Ray Van Dyke, Jerry Douglas Horn
  • Patent number: 8932116
    Abstract: Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: January 13, 2015
    Assignee: NexPlanar Corporation
    Inventors: Manish Deopura, Hem M. Vaidya, Pradip K. Roy
  • Publication number: 20150004886
    Abstract: When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide member 130 is inserted into a guide hole 109 with an attachment surface of a polishing pad 108 downward, the polishing pad 108 is positioned on and attached to a polishing table 110. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so as to match the upper surface of the polishing table 110 with the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad 108, the portion where the release paper is peeled off is attached to the polishing table 110.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 1, 2015
    Inventors: Kaoru HAMAURA, Takeshi SAKURAI, Suguru OGURA
  • Publication number: 20150004888
    Abstract: A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
    Type: Application
    Filed: September 12, 2014
    Publication date: January 1, 2015
    Inventors: Boguslaw A. Swedek, Manoocher Birang
  • Patent number: 8920219
    Abstract: Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: December 30, 2014
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Rajeev Bajaj
  • Patent number: 8920220
    Abstract: This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: December 30, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Ah-Ram Kim, Byeong-In Ahn, Dong-Mok Shin
  • Publication number: 20140357170
    Abstract: A chemical mechanical polishing pad is provided containing: a polishing layer; a plug in place endpoint detection window block; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 4, 2014
    Inventors: Bainian Qian, Michelle K. Jensen, Marty W. DeGroot, Angus Repper, James Murnane, Jeffrey James Hendron, John G. Nowland, David B. James, Fengji Yeh
  • Publication number: 20140357169
    Abstract: A chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 4, 2014
    Inventors: James Murnane, Bainian Qian, John G. Nowland, Michelle K. Jensen, Jeffrey James Hendron, Marty W. DeGroot, David B. James, Fengji Yeh
  • Publication number: 20140357163
    Abstract: A multilayer chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 4, 2014
    Inventors: James Murnane, Bainian Qian, John G. Nowland, Michelle K. Jensen, Jeffrey James Hendron, Marty W. DeGroot, David B. James, Fengji Yeh
  • Publication number: 20140342646
    Abstract: A polishing pad at least includes a polishing layer, and a cushion layer, in which a plurality of holes is provided in the polishing layer, the holes passing through the polishing layer in a thickness direction, and a plurality of grooves is provided in a polishing surface of the polishing layer, a through hole ratio is from 0.13% or more to 2.1% or less, and angles made by the polishing surface and side surfaces of the groove, which continue to the polishing surface, is from 105 degrees or more to 150 degrees or less.
    Type: Application
    Filed: September 14, 2012
    Publication date: November 20, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Tomoyuki Honda, Seiji Fukuda, Ryoji Okuda
  • Patent number: 8888568
    Abstract: A system and method providing improved capability for inspecting and repairing threads of bolts and threaded holes is disclosed. Polishing stones comprised of epoxy and metallic oxide are used in conjunction with dye to identify threads in need of repair and make them visible to a maintenance worker.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: November 18, 2014
    Inventor: Ronald B. Stein
  • Patent number: 8858298
    Abstract: A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: October 14, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Boguslaw A. Swedek, Manoocher Birang
  • Publication number: 20140302759
    Abstract: The invention is a new napped mesh abrasive cloth that is made with a gray cloth that is a napped fabric. It is used in the coated abrasives industry. Its uniqueness is in the construction. It is formed by a base material, an abrasive layer and a multilayer adhesive. On the bottom surface of the material there is nap, on the top surface of base material, there is an abrasive layer that is attached by a layer of primer. Finally, the surface of the abrasive layer is then coated with a multilayer adhesive.
    Type: Application
    Filed: October 30, 2013
    Publication date: October 9, 2014
    Applicant: Zibo Riken MT Coated Abrasives Co., LTD
    Inventors: Jianchang Zhai, Gang Yao, Guihua Fu
  • Publication number: 20140273762
    Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
  • Publication number: 20140273777
    Abstract: Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: NexPlanar Corporation
    Inventors: Paul Andre Lefevre, William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns, James Richard Rinehart, Robert Kerprich
  • Publication number: 20140256226
    Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises an olefin copolymer; wherein the olefin copolymer, comprises, as initial components: ethylene, a branched or straight chain C3-30 ?-olefin; a silane; and, optionally, a polyolefin; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ?60%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 11, 2014
    Inventors: Angus Repper, Mary A. Leugers, David B. James
  • Publication number: 20140256225
    Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises a cyclic olefin addition polymer; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ?40%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 11, 2014
    Applicants: DOW GLOBAL TECHNOLOGIES LLC, Roham and Haas Electronic Materials CMP Holdings Inc
    Inventors: Angus Repper, David B. James, Mary A. Leugers