METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION
Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch. Numerous other aspects are provided.
Latest APPLIED MATERIALS, INC. Patents:
The present application claims priority from U.S. Provisional Patent Application Ser. No. 60/939,228, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION” (Attorney Docket No. 11952/L), which is hereby incorporated by reference herein in its entirety.
CROSS-REFERENCE TO RELATED APPLICATIONSThe present application is related to the following commonly-assigned, co-pending U.S. patent applications, each of which is hereby incorporated herein by reference in its entirety for all purposes:
U.S. patent application Ser. No. 11/299,295, filed on Dec. 9, 2005 and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10121/PPC/CMP/CKIM);
U.S. patent application Ser. No. 11/298,555, filed on Dec. 9, 2005 and entitled “METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE” (Attorney Docket No. 10414/PPC/CMP/CKIM);
U.S. patent application Ser. No. 60/939,351, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING AN INFLATABLE POLISHING WHEEL” (Attorney Docket No. 10674/L);
U.S. patent application Ser. No. 60/939,353, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR FINDING A SUBSTRATE NOTCH CENTER” (Attorney Docket No. 11244/L);
U.S. patent application Ser. No. 60/939,343, filed May 21, 2007, entitled “METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF EPITAXIAL FILMS” (Attorney Docket No. 11417/L);
U.S. patent application Ser. No. 60/939,219, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A SHAPED BACKING PAD” (Attorney Docket No. 11483/L);
U.S. patent application Ser. No. 60/939,342, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS” (Attorney Docket No. 11564/L);
U.S. patent application Ser. No. 60/939,350, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR USING A BEVEL POLISHING HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT” (Attorney Docket No. 11565/L);
U.S. Patent Application Ser. No. 60/939,344, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING” (Attorney Docket No. 11566/L);
U.S. Patent Application Ser. No. 60/939,333, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR SUBSTRATE EDGE POLISHING USING A POLISHING ARM” (Attorney Docket No. 11567/L);
U.S. Patent Application Ser. No. 60/939,212, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR IDENTIFYING A SUBSTRATE EDGE PROFILE AND ADJUSTING THE PROCESSING OF THE SUBSTRATE ACCORDING TO THE IDENTIFIED EDGE PROFILE” (Attorney Docket No. 11695/L);
U.S. Patent Application Ser. No. 60/939,337, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR HIGH PERFORMANCE SUBSTRATE BEVEL AND EDGE POLISHING IN SEMICONDUCTOR MANUFACTURE” (Attorney Docket No. 11809/L); and
U.S. Patent Application Ser. No. 60/939,209, filed May 21, 2007, entitled “METHODS AND APPARATUS FOR CONTROLLING THE SIZE OF AN EDGE EXCLUSION ZONE OF A SUBSTRATE” (Attorney Docket No. 11987/L);
FIELD OF THE INVENTIONThe present invention relates generally to substrate processing, and more particularly to methods and apparatus for cleaning a notch in an edge of a substrate.
BACKGROUND OF THE INVENTIONSubstrates are used in semi-conductor device manufacturing. During processing, the notch and edge of a substrate may become dirty, which may negatively affect the semi-conductor devices formed on the substrate. Conventional systems may not be able to effectively clean a substrate notch in a cost-effective amount of time. Accordingly, improved methods and apparatus for cleaning or polishing notches in the edges of substrates are desired.
SUMMARY OF THE INVENTIONIn a first aspect of the invention, an apparatus for polishing a notch in a substrate edge is provided. The apparatus comprises a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch.
In another aspect of the invention, a system for polishing a notch in a substrate edge is provided. The system comprises a substrate support adapted to support a substrate; a polishing head adapted to press a polishing tape against a notch in an edge of the substrate; a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch to control polishing by the polishing head.
In yet another aspect of the invention, a method for polishing a notch in a substrate edge is provided. The method comprises supporting a substrate, wherein an edge of the substrate includes a notch; pressing a polishing head against a surface of the notch; and oscillating the substrate between first and second oscillatory positions while the polishing head is pressed against the notch.
Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.
Substrates used in semiconductor device processing often have films and/or surface defects which typically should be removed prior to subsequent processing steps. In some cases, these films and defects may occur on the edge of a substrate, including a notch formed thereon.
One method of cleaning and polishing a substrate notch includes applying an abrasive film or tape to the notch, and moving the abrasive tape relative to the notch, while the substrate is fixed in a particular position. The force, or pressure, applied to the abrasive tape while contacting the notch, as well as the degree of contact between the abrasive tape and the notch, may contribute to polishing efficiency. Another factor that may contribute to polishing efficiency is the degree of movement of the abrasive tape relative to the substrate notch. In some embodiments, the relative movement may be provided by advancing the abrasive tape over a surface of the notch. However, the degree of relative movement between the abrasive tape and the substrate notch may be increased by moving the substrate as the abrasive tape is advanced over the notch surface, thereby increasing the notch polishing efficiency and the cost-effectiveness thereof.
The present invention provides apparatus and methods that enhance contact between the polishing or abrasive tape and all sections of a substrate notch region to efficiently and cost-effectively remove thin films and surface defects from the substrate notch. In one or more embodiments, a notch backing pad may be provided. The notch backing pad may be adapted to press a moving polishing tape against the substrate notch. In some embodiments, the notch backing pad may include a protruding portion that substantially conforms to the shape of the substrate notch. The protruding portion may be made of an elastically deformable material adapted to effectively conform the notch backing pad to the shape of the notch (e.g., when pressed against the notch), and to press the polishing tape into contact with all surfaces of the notch. The notch backing pad may include slots to guide the polishing tape over the notch backing pad.
In some embodiments, the substrate may be rotated and/or oscillated about a center of rotation as the polishing tape is advanced over the notch. The rotation and/or oscillation may increase the degree of relative movement between the polishing tape and the substrate notch, thereby increasing the polishing efficiency and cost-effectiveness thereof.
The system 100 of
The system 100 may also include a programmed or user operated controller 106. The controller 106 may direct the operation and movement of the one or more heads 104, as well as the other system components, as will be further described below.
In one or more embodiments, the polishing tape 228 may be made from many different materials, such as aluminum oxide, silicon oxide, silicon carbide, etc. Other materials may also be used. In some embodiments, abrasives used may range from about 0.5 microns up to about 3 microns in size, although other sizes may be used. Different widths of polishing tape 228 ranging from about 0.2 inches to about 1.5 inches may be used, although other polishing tape widths may be used. In one or more embodiments, the polishing tape 228 may be about 0.002 to about 0.02 inches thick and withstand about 1 to 5 lbs. in tension. Other tapes having different thicknesses and tensile strengths may be used. The spools 230, 232 may have a diameter of approximately 1 inch and be capable of holding about 500 inches of polishing tape 228. Other spool dimensions may be used. The spools 230, 232 may be constructed from materials such as polyurethane, polyvinyl difluoride (PVDF), etc. Other materials may also be used.
As described above, the notch backing pad 226 may be moved toward, or away from, the substrate 216 by an actuator (not shown). Any other suitable means to move the notch backing pad 226 may be used. When the notch backing pad 226 is moved toward the substrate 216, the protruding portion 242 of the notch backing pad 226 may be pressed into the substrate notch 244. As the protruding portion 242 is pressed into the notch 244, the section of polishing tape 228 conforming to the shape of the protruding portion 242 of the notch backing pad 226 is also pressed into, and conforms to, the substrate notch 244, and thereby contacts the entire substrate notch 244 surface. As the polishing tape 228 may contact the entire surface of the substrate notch 244, as the polishing tape 228 is advanced, it may clean and polish the entire surface of the substrate notch 244.
With reference to
Turning to
In some embodiments, as the polishing tape 228 is advanced, the substrate 216 may be rotated or oscillated sinusoidally or otherwise about its center 218. For example, the controller 106 (
The force or pressure at which the polishing tape 228 is pressed against the notch 244, as well as the relative movement of the polishing tape 228 and the notch 244 may account for the degree and/or efficiency of polishing. The advancement of the polishing tape 228, for example, in a direction perpendicular to the major surface of the substrate 216, as it contacts the notch 244 may provide relative movement between the polishing tape 228 and the notch 244, thereby aiding in the polishing process. In addition, oscillation of the substrate 216 about the substrate center 218 during the advancement of the polishing tape 228 may provide further relative movement between the polishing tape 228 and a surface of the notch 244, thereby aiding in the polishing process. In some embodiments, the combination of substrate oscillation with polishing tape advancement may result in more effective notch polishing than the use of polishing tape advancement alone, as the oscillation creates greater contact between the polishing tape 228 and the notch surfaces.
Turning to
In addition, in step S712, the polishing head 222 may be vertically rotated or rocked about the notch 244, e.g., the polishing head 222 may rotate about an axis tangential to the substrate 216 (and hence notch 244), as the polishing tape 228 is advanced, in order to more effectively clean and polish parts of the notch 244 adjacent to major surfaces 103 (shown in
The foregoing description discloses only exemplary embodiments of the invention. Modification of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art.
Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claim.
Claims
1. An apparatus for polishing a notch in a substrate edge comprising:
- a substrate support adapted to support a substrate;
- a polishing head adapted to contact a notch in an edge of the substrate; and
- a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch.
2. The apparatus of claim 1 wherein the polishing head includes a backing pad.
3. The apparatus of claim 2 further comprising a polishing tape, wherein the backing pad is adapted to contact the substrate notch with the polishing tape.
4. The apparatus of claim 3 further comprising a motor adapted to advance the polishing tape, thereby creating relative movement between the polishing tape and the substrate notch.
5. The apparatus of claim 2 wherein the backing pad includes a protruding member.
6. The apparatus of claim 5 wherein the protruding member is adapted to be pressed into the substrate notch.
7. The apparatus of claim 5 wherein the protruding member is conformable to the shape of the substrate notch.
8. The apparatus of claim 1 wherein the first oscillatory position is at a first oscillatory angle to a neutral radius of the substrate when the substrate is stationary.
9. The apparatus of claim 8 wherein the second oscillatory position is at a second oscillatory angle to a neutral radius of the substrate when the substrate is stationary.
10. The apparatus of claim 9 wherein the first oscillatory angle is the same as the second oscillatory angle.
11. The apparatus of claim 9 wherein the frequency of oscillation between the first and second oscillatory positions is varied.
12. The apparatus of claim 1 wherein the polishing head is adapted to rock about an axis tangential to the substrate notch.
13. A system for polishing a notch in a substrate edge comprising:
- a substrate support adapted to support a substrate;
- a polishing head adapted to press a polishing tape against a notch in an edge of the substrate;
- a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch and to control polishing by the polishing head.
14. The system of claim 13 wherein the polishing head includes a backing pad.
15. The system of claim 14, wherein the backing pad is adapted to contact the substrate notch with the polishing tape.
16. The system of claim 15 further comprising a motor, wherein the motor is adapted to advance the polishing tape, thereby creating relative movement between the polishing tape and the substrate notch.
17. The system of claim 13 wherein the first oscillatory position is at a first oscillatory angle to a neutral radius of the substrate when the substrate is stationary.
18. The system of claim 19 wherein the second oscillatory position is at a second oscillatory angle to a neutral radius of the substrate when the substrate is stationary.
19. The system of claim 13 wherein the substrate oscillates at a first amplitude for a first period of time and at a second amplitude for a second period of time.
20. A method for polishing a notch in a substrate edge comprising:
- supporting a substrate, wherein an edge of the substrate includes a notch;
- pressing a polishing head against a surface of the notch; and
- oscillating the substrate between first and second oscillatory positions while the polishing head is pressed against the notch.
21. The method of claim 20 further comprising pressing a polishing tape against the notch via the polishing head.
22. The method of claim 21 further comprising advancing the polishing tape as the polishing tape is pressed against the notch.
23. The method of claim 20 further comprising rocking the polishing head about the notch.
24. The method of claim 20 further comprising conforming the polishing head to the shape of the notch.
25. The method of claim 20, wherein the polishing head includes a backing pad adapted to conform to the shape of the notch.
Type: Application
Filed: May 20, 2008
Publication Date: Nov 27, 2008
Applicant: APPLIED MATERIALS, INC. (Santa Clara, CA)
Inventors: Zhenhua Zhang (San Jose, CA), Sen-Hou Ko (Sunnyvale, CA)
Application Number: 12/124,133
International Classification: B24B 1/00 (20060101);