Edging Patents (Class 451/44)
  • Patent number: 10170344
    Abstract: A washing device includes: a plurality of spindles which holds a substrate and rotates the substrate about a central axis of the substrate as a rotary axis; and a single tube nozzle which discharges a washing liquid toward an upper surface of the substrate, wherein the single tube nozzle discharges the washing liquid so that the washing liquid lands in front of the center of the substrate and the landed washing liquid flows on the upper surface of the substrate toward the center of the substrate. A liquid flow on the upper surface of the substrate after landing of the washing liquid discharged from the single tube nozzle passes through the center of the substrate.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: January 1, 2019
    Assignee: EBARA CORPORATION
    Inventor: Tomoatsu Ishibashi
  • Patent number: 10031357
    Abstract: A display device includes a first substrate defining a top surface thereof, a bottom surface thereof facing the top surface, and side surfaces thereof connecting the top and bottom surfaces to each other. The side surfaces included: a first side surface defined by: a first patterned surface including a first pattern of which a length thereof extends in a diagonal direction in a plan view of the first patterned surface, and a second patterned surface which extends obliquely from an upper end of the first patterned surface, the second patterned surface including a second pattern of which a length thereof extends in a perpendicular direction from the upper end of the first patterned surface in a plan view of the second patterned surface.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: July 24, 2018
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Se Ki Park, Joo Young Kim, Dong Rak Ko, Young Woon Kho, Dong Kwon Kim, June Hyoung Park, Eun Ji Seo, Hee Kyun Shin, Seung Je Lee
  • Patent number: 9815167
    Abstract: A lens manufacturing method including a holding step of holding a lens in a lens holding fixture, and a machining step of machining a surface to be machined in the held lens. A reverse surface of the surface to be machined is machined into a non-planar shape with a first surface shape error. A lens holding surface of the lens holding fixture is machined into the same shape as the non-planar shape with a second surface shape error smaller than the first surface shape error. In the holding step, the reverse surface is brought into surface contact with the holding surface in imitation of the holding surface to correct the shape of the lens such that the reverse surface runs along the holding surface. In the machining step, the surface to be machined is machined in a state where the correction has been made by the holding step.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: November 14, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Yasuhito Hiraki, Kenji Ito, Seiichi Watanabe
  • Patent number: 9490326
    Abstract: The instant disclosure relates to a wafer formed by slicing an ingot. The wafer has at least one side surface adjacent to the slicing path and topped with a nanostructure layer.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: November 8, 2016
    Assignee: SINO-AMERICAN SILICON PRODUCTS INC.
    Inventors: Jian-Jhih Li, Wen-Ching Hsu
  • Patent number: 9451863
    Abstract: A wine-glass polisher includes a housing having at least one cleaning chamber defined by a bottom wall and at least one sidewall. Extending from the sidewall is a wine-glass holder including a horizontal arm having a C-shaped gripping member at a distal end for holding the stem of an inverted wine glass. Immediately above the gripping member is a motorized disc for engaging the base of a wine glass to rotate it during a cleaning and drying cycle. Mounted on the sidewall, below the wine-glass holder, is an upper dispensing nozzle for projecting either drying air or steam onto the exterior surface of a wine glass. Upwardly extending from the bottom wall of the cleaning chamber is a lower dispensing nozzle for projecting drying air or hot water onto the interior surface of a wine glass. Hot water and air are sequentially delivered to the nozzles to clean and subsequently dry a wine glass.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: September 27, 2016
    Inventors: Jeffrey Larson, Danielle L. W. Barringer, Jerry Vance Foster, III, David M. W. Hemming, Jonathan Schweiger, Noah McNeely
  • Patent number: 9293318
    Abstract: A method of manufacturing a semiconductor wafer includes: rough-polishing front and back surfaces of the semiconductor wafer; mirror-polishing a chamfered portion of the rough-polished semiconductor wafer; performing mirror finish polishing on the front surface or both the front and back surfaces of the semiconductor wafer having the mirror-polished chamfered portion; and forming an oxide film on an entire surface of the semiconductor wafer after the mirror-polishing of the chamfered portion and before the mirror finish polishing.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: March 22, 2016
    Assignee: SUMCO TECHXIV CORPORATION
    Inventor: Kenji Yamashita
  • Patent number: 9199352
    Abstract: A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: December 1, 2015
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Kenya Ito, Masayuki Nakanishi
  • Patent number: 9117856
    Abstract: A substrate separation chuck which is adapted to separate a substrate from an adhering surface. The substrate separation chuck has a support adapted to support the adhering surface. An air bearing surface is adapted to support the substrate, the air bearing surface axially moveable relative to the support. The air bearing surface has a first position adjacent the substrate with the substrate coupled to the adhering surface. The air bearing surface is moveable from the first position to a second position separating the substrate from the adhering surface without contact between the substrate and the air bearing surface.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: August 25, 2015
    Assignee: TEL NEXX, INC.
    Inventors: Daniel Goodman, Arthur Keigler, Freeman Fisher
  • Patent number: 9099510
    Abstract: In one embodiment, a flipping module operable to flip a workpiece delivered by a robot in a vacuum transfer chamber (VTC) includes a gripper disposed outside a working envelope of the robot in a parked position in a vacuum environment of the VTC, and an actuator operable to move the gripper from the parked position to a receiving position, and to rotate the gripper and workpiece to thereby flip the workpiece.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 4, 2015
    Assignee: Genmark Automation, Inc.
    Inventors: Alexander Todorov, Zlatko Manolov Sotirov
  • Patent number: 9039492
    Abstract: An enclosed polishing apparatus include a housing, a fixing seat, a guiding mechanism, and a chain-driven polishing mechanism. The housing includes a bottom housing and a top housing connected to the bottom housing. The fixing seat is securely placed in the bottom housing. The guiding mechanism is placed in the top housing above the fixing seat. The polishing mechanism is movably mounted on the guiding mechanism above the fixing seat. The polishing mechanism is driven and guided by the guiding mechanism to follow a desired polishing contour on a workpiece.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: May 26, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zhi-Guo Sun, Jun-Lin Peng, Yu-Lun Li
  • Patent number: 9028296
    Abstract: Methods of shaping a glass sheet each include a step of removing a first portion of the glass sheet to form a first beveled surface. The methods further include the step of removing a second portion of the glass sheet to form a second beveled surface. The methods still further include the step of removing a third portion of the glass sheet comprising a remainder of an end surface of an edge portion of the glass sheet. In further examples, glass sheets are also provided with a first bevel surface intersecting a first glass-sheet surface and an apex surface, and a second bevel surface intersecting a second glass-sheet surface and the apex surface. The glass sheet exhibits a probability of failure of less than 5% at an edge stress of 135 MPa.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: May 12, 2015
    Assignee: Corning Incorporated
    Inventors: Siva Venkatachalam, Liming Wang
  • Patent number: 8998682
    Abstract: An apparatus includes: a cleaver configured to automatically cleave a bare fiber extending from an end face of a terminus or connector of a fiber optic cable, the cleaver including a bending element configured to bend the bare fiber and a defect-formation device configured to create a surface defect in surface of the bare fiber under tension when the bare fiber is bent by the bending element; and an abrader configured to automatically finish the end face of the terminus or connector after the bare fiber is cleaved.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: April 7, 2015
    Assignee: kSARIA Corporation
    Inventors: Anthony J. Christopher, George Ciolfi
  • Patent number: 8974268
    Abstract: A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the article has a second edge strength and the second edge strength is greater than the first edge strength.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: March 10, 2015
    Assignee: Corning Incorporated
    Inventors: Charles Michael Darcangelo, Steven Edward DeMartino, Joseph Fabian Ellison, Richard A Nasca, Aric Bruce Shorey, David Alan Tammaro, John Christopher Thomas
  • Patent number: 8944887
    Abstract: An apparatus for performing both edge trimming and surface grinding includes two spindles for holding two workpieces, a bridge element laterally movable relative to the spindles, and two grinding wheels coupled to the bridge element. The apparatus may be a surface grinding apparatus that includes a system for enabling the surface grinding apparatus to additionally perform edge trimming. A method for processing the workpieces entails placing the two workpieces on the two spindles of the apparatus, directing the bridge element to move laterally to an edge trimming position to trim the outer edge of one workpiece using one of the grinding wheels, to move laterally to another edge trimming position to trim the outer edge of the other workpiece using one of the grinding wheels, and to move laterally to surface grinding positions to perform surface grinding on both of the workpieces using one or both of the grinding wheels.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: February 3, 2015
    Assignee: Axus Technology, LLC
    Inventors: Daniel R. Trojan, Richard Ciszek, Clifford Daniel
  • Patent number: 8926402
    Abstract: A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: January 6, 2015
    Assignee: Ebara Corporation
    Inventors: Masayuki Nakanishi, Masaya Seki, Kenji Kodera
  • Publication number: 20140370240
    Abstract: An edge narrowing method for a display panel is disclosed. The method includes the steps of providing the display panel, a grinding apparatus and a polishing apparatus; tilting the display panel so that the first substrate and a grinding member of the grinding apparatus have a first grinding angle therebetween; grinding the first substrate and the light-shielding area with the grinding apparatus while the display panel is tilted at the first grinding angle, thereby forming a first grinding end surface; stopping grinding of the first substrate and the light-shielding area when the width of the light-shielding area is between 0.35 and 1 mm; and polishing the first grinding end surface with the polishing apparatus to form a first end surface.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 18, 2014
    Inventors: YU CHEN LIU, CHUNG WEI LIU, SHU CHIH WANG, CHIA SHIN WENG
  • Publication number: 20140357160
    Abstract: A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 4, 2014
    Applicant: CORNING PRECISION MATERIALS CO., LTD.
    Inventor: MyeongBo HAN
  • Publication number: 20140335764
    Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 13, 2014
    Inventors: James William Brown, Babak Robert Raj
  • Publication number: 20140295739
    Abstract: The present invention provides a method for polishing edge of glass substrate of display panel, which includes (1) conveying a glass substrate of a display panel to be polished to a polishing device and positioning the glass substrate for being subsequently polished by a grindstone of the polishing device; (2) providing first and second stop boards; (3) moving the first stop board to contact an upper surface of the glass substrate and moving the second stop board to contact a lower surface of the glass substrate; and (4) carrying out an edge polishing operation. By arranging the stop boards between the polished area and the non-polished area of the glass substrate, the glass chips generated during the polishing operation are prevented from flying and attaching to the surfaces of the non-polished area of the glass substrate during the polishing operation.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 2, 2014
    Inventors: Jie Chen, Chunliang Lee, Changcheng Lo
  • Patent number: 8814633
    Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: August 26, 2014
    Assignee: Corning Incorporated
    Inventors: James William Brown, Babak Robert Raj
  • Patent number: 8814635
    Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: August 26, 2014
    Assignees: Sanshin Co., Ltd., Nihon Micro Coating Co., Ltd.
    Inventors: Nobukazu Hosokai, Isamu Oguro, Jun Watanabe, Tetsujiro Tada
  • Publication number: 20140213155
    Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
    Type: Application
    Filed: January 29, 2014
    Publication date: July 31, 2014
    Inventors: Tetsuji TOGAWA, Atsushi YOSHIDA, Toshifumi WATANABE
  • Publication number: 20140213154
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
    Type: Application
    Filed: January 29, 2014
    Publication date: July 31, 2014
    Applicant: EBARA CORPORATION
    Inventors: Masaya SEKI, Tetsuji TOGAWA
  • Publication number: 20140213152
    Abstract: A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 31, 2014
    Inventor: Taiwan Semiconductor Manufacturing Company, Ltd.
  • Publication number: 20140213153
    Abstract: An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 31, 2014
    Inventor: Taiwan Semiconductor Manufacturing Company, Ltd.
  • Publication number: 20140206262
    Abstract: An aspect of the present embodiment, there is provided a polishing apparatus, including a stage configured to be placed a semiconductor wafer thereon and to be rotated with the semiconductor wafer, a first polishing unit configured to contact a polishing tape to one portion of the semiconductor wafer on the stage, a second polishing unit configured to contact to other portion of the semiconductor wafer, the other portion being different from the one portion, a feed unit configured to feeding the polishing tape, and a recovery unit configured to recovery the polishing tape.
    Type: Application
    Filed: September 5, 2013
    Publication date: July 24, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Katsuyuki OONO
  • Patent number: 8784157
    Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: July 22, 2014
    Assignee: Bando Kiko Co., Ltd.
    Inventor: Kazuaki Bando
  • Publication number: 20140187126
    Abstract: A polishing apparatus 100 includes a holding stage 4 that holds a central portion of a back surface of a substrate W, a motor M1 that rotates the holding stage 4, a front surface nozzle 36 that feeds a rinse liquid to a front surface of the substrate W, a back surface nozzle 37 that feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control section 110 that feeds the rinse liquid through the back surface nozzle 37 after a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzle 36 and a polishing head assembly 1A that polishes a peripheral portion of the substrate installed on the holding stage 4 after the rinse liquid control section 110 feeds the rinse liquid to the substrate W.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: EBARA CORPORATION
    Inventors: Masayuki NAKANISHI, Kenji KODERA, Nobuhiro YANAKA
  • Publication number: 20140170388
    Abstract: A glass plate includes two main flat surfaces, and a side surface adjacent to the two main flat surfaces. At least one edge part of the side surface includes a chamfered part in a thickness direction of the glass plate. The side surface includes a predetermined portion. In a case where the predetermined portion is etched with a depth of 10 ?m, an etched surface of the predetermined portion includes no pit having a depth greater than or equal to 1 ?m. The predetermined portion is a portion of the side surface in which a distance from one of the two main flat surfaces adjacent to the chamfered part in the thickness direction of the glass plate is less than or equal to ? of the thickness of the glass plate.
    Type: Application
    Filed: February 25, 2014
    Publication date: June 19, 2014
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Izuru Kashima, Yusuke Kobayashi
  • Patent number: 8753173
    Abstract: During grinding of mutually parallel edges of glass plates every edge of the glass plate is ground using a grinding tool or two grinding tools disposed one behind the other and cooling agent is directed from a side of the glass plate toward the grinding tool and supplied using a supply line divided via a redirection and separating segment into a plurality of fine streams of cooling agent, and a position of the grinding tool can be adjusted such that at least the position of the grinding tools relative to the assigned edge of the glass plate, which is passing through, is calibrated and the corners of the glass plate are ground to form a chamfer.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: June 17, 2014
    Assignee: Benteler Maschinenbau GmbH
    Inventors: Christoph Linnenbruegger, Joachim Korswird, Martin Schnitker
  • Patent number: 8747187
    Abstract: A method of shaping an ophthalmic lens to have a desired outline with a machining device including a blocking support for the ophthalmic lens and at least one first machining tool, the method includes: obtaining an inner cutting limit for the first machining tool; defining an initial blocking position for the ophthalmic lens and its desired outline; calculating whether at least a portion of the desired outline presents a non-zero intersection with the inner cutting limit; defining as the final blocking position either the unchanged initial blocking position if the calculated intersection is zero, or else a blocking position that is modified relative to the initial blocking position so that the desired outline as repositioned using the modified blocking position does not present an intersection with the inner cutting limit associated with the first tool; and blocking and shaping the ophthalmic lens with the desired outline.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: June 10, 2014
    Assignee: Essilor International (Compagnie Generale d'Optique)
    Inventors: Cédric Lemaire, Philippe Pinault, David Tang
  • Patent number: 8721392
    Abstract: A method for finishing an edge of a glass sheet comprising a first grinding step and a second polishing step using different abrasive wheels. The method results in consistent finished edge quality and improved edge quality in term of sub-surface damage (SSD). The method can be advantageously utilized to finish the edges of a thin glass substrate for use as substrates of display devices, such as LCD displays and the like.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: May 13, 2014
    Assignee: Corning Incorporated
    Inventors: James William Brown, Siva Venkatachalam
  • Patent number: 8721389
    Abstract: A grinder including a grinding unit including a grinding surface and a shaft connected to the grinding unit for rotating the grinding unit. The grinding unit includes polyurethane and a mixture of a repairer and an abrasive, and an angle ? between a plane perpendicular to a rotational axis of the shaft and the grinding surface satisfies 1°???7°.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: May 13, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jong-Sub Jung, Weon-Woo Choi, Dong-Wok Seo, Kwan-Su Kim
  • Publication number: 20140106648
    Abstract: A glass-plate working apparatus includes a glass-plate supporting portion 20a of a feed conveyor 7, a glass-plate supporting portion 20b of a cutting section 2, a glass-plate supporting portion 20c of a bend-breaking section 4, a glass-plate supporting portion 20d of a grinding section 3, and a glass-plate supporting portion 20e of a discharge conveyor 8; a cutting head 9, a bend-breaking device 66, and a grinding head 10 for processing glass plates 5 which are respectively supported by the supporting portions 20b, 20c, and 20d; and a transporting device 89 for transporting the glass plate 5 on the supporting portion 20a onto the supporting portion 20b, the glass plate 5 on the supporting portion 20b onto the supporting portion 20c, the glass plate 5 on the supporting portion 20c onto the supporting portion 20d, and the glass plate 5 on the supporting portion 20d onto the supporting portion 20e, respectively.
    Type: Application
    Filed: December 17, 2013
    Publication date: April 17, 2014
    Applicant: BANDO KIKO CO., LTD.
    Inventor: Kazuaki BANDO
  • Publication number: 20140099866
    Abstract: The present invention provides a dust protection method for glass substrate edge polishing machine, which includes (1) providing an edge polishing machine and a glass substrate to be polished, wherein a dust protection board is arranged above a platform bearing a glass substrate to form a first gap therebetween and an air blow tube is provided in front of a grind stone; (2) fixing the glass substrate on the edge polishing machine; (3) introducing cooling water from the dust protection board to form a water curtain at the first gap; (4) activating the air blow tube to form an air curtain region; and (5) activating the grindstone to set out a grinding operation. The dust protection board and the water curtain block particles generated in grinding and the air curtain region blows residual water that contains particles off edges of the glass substrate.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 10, 2014
    Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventor: Xindi Zhang
  • Patent number: 8690640
    Abstract: A complex geographical edge finishing system includes a fixture that holds an external part having a complex three-dimensional edge, a track disposed around the fixture and surrounding the edge of the part held in the fixture, and one or more finishing apparatuses that can sand, polish, buff, paint and/or apply coatings to the complex three-dimensional edge. The finishing apparatuses move about the track such that the three-dimensional edge of the part can be polished. The path of the track can substantially match, mimic or otherwise correspond to the path of the three-dimensional edge, such that special requirements for the finishing apparatuses are not required.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: April 8, 2014
    Assignee: Apple Inc.
    Inventor: Thomas Johannessen
  • Publication number: 20140094095
    Abstract: A polishing method includes rotating a substrate, performing a first polishing process of pressing a polishing tape against an edge portion of the substrate by a pressing member, with a portion of the polishing tape projecting from the pressing member inwardly in a radial direction of the substrate, to polish the edge portion of the substrate and bend the portion of the polishing tape along the pressing member, and performing a second polishing process of pressing the bent portion of the polishing tape inwardly in the radial direction of the substrate by the pressing member to further polish the edge portion of the substrate.
    Type: Application
    Filed: September 23, 2013
    Publication date: April 3, 2014
    Applicant: EBARA CORPORATION
    Inventors: Tetsuji TOGAWA, Atsushi YOSHIDA, Michiyoshi YAMASHITA
  • Patent number: 8684795
    Abstract: An eyeglass lens processing apparatus is provided with: a lens chuck shaft that holds an eyeglass lens; and a beveling tool for forming a bevel on the periphery of the lens. The beveling tool includes a first processing part for forming a rear bevel on the lens rear side; and a second processing part for forming a bevel foot coupled to the rear bevel. In the second processing part, the distance from a line parallel to the lens chuck shafts and passing through a point of border with the first processing part gradually increases from the point of border as the starting point to the endpoint of the second processing surface and the increase rate of the distance gradually increases at least in two steps toward the endpoint.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: April 1, 2014
    Assignee: Nidek Co., Ltd.
    Inventor: Ryoji Shibata
  • Publication number: 20140087627
    Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
    Type: Application
    Filed: September 23, 2013
    Publication date: March 27, 2014
    Inventors: Tetsuji TOGAWA, Masaya SEKI, Hiroyuki TAKENAKA
  • Publication number: 20140073223
    Abstract: A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 13, 2014
    Applicant: AXUS TECHNOLOGY, LLC
    Inventors: Daniel R. Trojan, Richard Ciszek, Clifford Daniel
  • Publication number: 20140073228
    Abstract: A silicon carbide single-crystal substrate includes a first surface, a second surface opposite to the first surface, and a peripheral edge portion sandwiched between the first surface and the second surface, A plurality of grinding traces are formed in a surface of the peripheral edge portion. A chamfer width as a distance from an outermost peripheral end portion of the peripheral edge portion to one of the plurality of grinding traces which is located on an innermost peripheral side of the peripheral edge portion in a direction parallel to the first surface is not less than 50 ?m and not more than 400 ?m. Thereby, a silicon carbide single-crystal substrate capable of suppressing occurrence of a crack, and a method for manufacturing the same can be provided.
    Type: Application
    Filed: November 18, 2013
    Publication date: March 13, 2014
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kyoko OKITA, Keiji ISHIBASHI
  • Publication number: 20140065376
    Abstract: Methods of shaping a glass sheet each include a step of removing a first portion of the glass sheet to form a first beveled surface. The methods further include the step of removing a second portion of the glass sheet to form a second beveled surface. The methods still further include the step of removing a third portion of the glass sheet comprising a remainder of an end surface of an edge portion of the glass sheet. In further examples, glass sheets are also provided with a first bevel surface intersecting a first glass-sheet surface and an apex surface, and a second bevel surface intersecting a second glass-sheet surface and the apex surface. The glass sheet exhibits a probability of failure of less than 5% at an edge stress of 135 MPa.
    Type: Application
    Filed: August 30, 2012
    Publication date: March 6, 2014
    Inventors: Siva Venkatachalam, Liming Wang
  • Patent number: 8658937
    Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: February 25, 2014
    Assignee: UVTech Systems, Inc.
    Inventors: Kenneth J. Harte, Ronald P. Millman, Jr., Victoria M. Chaplick, David J. Elliott, Eugene O. Degenkolb, Murray L. Tardif
  • Publication number: 20140051336
    Abstract: A grinding wheel for wafer edge trimming includes a head having an open side and an abrasive end bonded around an edge of the open side of the head. The abrasive end is arranged to have multiple simultaneous contacts around a wafer edge during the wafer edge trimming.
    Type: Application
    Filed: September 28, 2012
    Publication date: February 20, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Xin-Hua HUANG, Ping-Yin LIU, Yuan-Chih HSIEH, Lan-Lin CHAO, Chia-Shiung TSAI
  • Patent number: 8641480
    Abstract: A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: February 4, 2014
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Masayuki Nakanishi, Tetsuji Togawa, Kenya Ito, Masaya Seki, Kenji Iwade, Takeo Kubota, Takeshi Nishioka
  • Publication number: 20140030959
    Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.
    Type: Application
    Filed: October 4, 2013
    Publication date: January 30, 2014
    Applicant: Corning Incorporated
    Inventors: James William Brown, Babak Robert Raj
  • Publication number: 20130344775
    Abstract: A wafer processing method of processing a wafer having an epitaxial film formed on the front side. The wafer processing method includes a holding step of holding the wafer on a holding table having a holding surface for holding the wafer and a rotational axis extending perpendicularly to the holding surface and passing through the center of the holding surface, and a removing step of pressing a grinding member on a ridge portion formed along the peripheral edge of the wafer held on the holding table and rotating the holding table about the rotational axis, thereby removing the ridge portion.
    Type: Application
    Filed: July 18, 2013
    Publication date: December 26, 2013
    Inventor: Kazuma SEKIYA
  • Patent number: 8585467
    Abstract: The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding unit applies a predetermined force normal to the edge. An air bearing slide system is coupled to the grinding unit. The air bearing slide system is configured to slide along a predetermined axis on a thin film of pressurized air that provides a zero friction load bearing interface. A linear actuation motor is coupled to the air bearing slide system. The linear actuation motor is configured to control the movement of the air bearing slide system such that the grinding unit is moved from a non-aligned position to the aligned position.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: November 19, 2013
    Assignee: Corning Incorporated
    Inventors: James William Brown, Babak Robert Raj
  • Publication number: 20130288010
    Abstract: A strengthened glass sheet or article having an edge profile that provides improved edge strength, particularly when the strengthened glass sheet is subjected to a four point bend test, and a method of making a glass sheet having such an edge. The edge is formed by cutting or other separation methods and then ground to a predetermined profile such as a pencil or bullet profile, a bull nose profile, or the like. In some embodiments, the edge is polished and/or etched following grinding to reduce flaw size.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 31, 2013
    Inventors: Ravindra Kumar Akarapu, Michael Patrick Donovan, Aize Li
  • Publication number: 20130273810
    Abstract: A method of finishing glass sheets includes forming a stack comprising alternating layers of unfinished glass sheets and spacer pads. The stack is such that there is no physical contact between any two adjacent unfinished glass sheets and outer edges of the spacer pads are recessed relative to outer edges of the unfinished glass sheets. The stack is secured by clamping the unfinished glass sheets and spacer pads together and then supported on a working surface. The unfinished glass sheets of the stack are finished simultaneously while the stack is supported on the working surface. After the finishing, the stack comprises alternating layers of finished glass sheets and spacer pads.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 17, 2013
    Applicant: Corning Incorporated
    Inventors: Tzu-Hen Hsu, James Guy Oliver, Yuyin Tang, Qing Ya Wang, Xinhao Zhang