VARIABLE CONDUCTANCE HEAT PIPE
A variable conductance heat pipe is provided. The variable conductance heat pipe includes a sealed container in which a working fluid and a noncondensable gas are sealed, the sealed container extending in an axial direction. The sealed container includes one end to be connected to a heating source and a part to be connected to a heat sink. On a cross section of the sealed container along a direction orthogonal to the axial direction, a portion having water conveying property better than other portions is provided. The portion having the better water conveying property extends in the axial direction.
Latest MITSUBISHI ELECTRIC CORPORATION Patents:
This application claims priority from Japanese Patent Application No. 2008-219549, filed on Aug. 28, 2008, the entire subject matter of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to a cooler for controlling the temperature of an electronic equipment and more particularly to a cooler which employs a variable conductance heat pipe.
2. Description of the Related Art
In a related-art electronic equipment cooler, in order to obtain a desired function in a stable manner, it has been regarded important to cool the electronic equipment to a temperature equal to or lower than its permissible temperature. Although as coolers for electronic equipment, radiational cooling type, natural air cooling type, forced air cooling type, liquid cooling type and boiling cooling type coolers have been used, in recent years, heat pipes have also been used in many cases. These coolers have thermal resistances which are specific thereto. When the coolers are actually used, as the heating amount of electronic equipment increases or as the ambient environmental temperature increases, the temperature of the electronic equipment increases, whereas the flow rate of a cooling medium (such as air, water or the like) which flows through a heat radiating or radiating portion increases, the temperature of the electronic equipment decreases. Consequently, the temperature of the electronic equipment varies as the operating factor or environmental factor varies, and it is inevitable in practice that a heat cycle occurs. This heat cycle generates an inner stress attributed to a difference in linear expansion coefficient between respective materials which make up the electronic equipment, which causes a failure of the electronic equipment, that is, shortens the life of the electronic equipment.
In view of the above-described background, in order to extend the life of electronic equipment, coolers which can suppress the heat cycle has been required, and as one of such cooling equipment, there has been proposed a variable conductance heat pipe in which a noncondensable gas such as helium, argon, nitrogen or the like is put in an interior of the heat pipe (for example, JP-A-10-122775 (page 2, FIG. 1)).
In such a variable conductance heat pile, although a working fluid (liquid and vapor) and a noncondensable gas are sealed in an interior of a sealed container which is made up of a heat receiving portion, a heat insulating portion (a transport portion), a heat radiating portion and a gas reservoir, since the variable conductance heat pipe takes various postures during production, storage, transportation and installation, the working fluid flows into an interior of the gas reservoir, or the working fluid flows into the interior of the gas reservoir due to a drastic change in temperature. Accordingly, the working fluid does not always reside within the heat receiving portion, which causes a problem with the stable actuation and stable operation of the variable conductance heat pipe. Therefore, it has been difficult to mass produce variable conductance heat pipes.
SUMMARY OF THE INVENTIONAccording to an aspect of the invention, there is provided a variable conductance heat pipe comprising a sealed container in which a working fluid and a noncondensable gas are sealed, the sealed container extending in an axial direction, the sealed container including one end to be connected to a heating source and a part to be connected to a heat sink, wherein, on a cross section of the sealed container along a direction orthogonal to the axial direction, a portion having water conveying property better than other portions is provided, and wherein the portion having the better water conveying property extends in the axial direction.
According to the above-configuration, irrespective of conditions of the variable conductance heat pipe during storage, transportation and installation, the stable actuation and stable operation thereof can be obtained.
Embodiments of the present invention will be described in detail based on the following figures, wherein:
The variable conductance heat pipe is configured such that three types of fluids such as liquid, vapor and noncondensable gas are sealed in the interior of the sealed container 1. Although the noncondensable gas preferably stays within the interior of the noncondensable gas reservoir portion 5 in principle, in reality, the vapor and noncondensable gas stay therein in a mixed manner due to molecular diffusion. In addition, when looking at the molecular weights of gases which can be used as a noncondensable gas, the molecular weight of neon is 20, nitrogen is 28, and argon is 40. In the event that for example, water is used as a working fluid, the molecular weight of water is 18, which is lighter than those of the gases which can be used as the noncondensable gas, and therefore, it becomes easy for the noncondensable gas 8 to stay in the heat receiving portion 2 which is normally placed in the lower position as a result of the effect of gravity, whereas it becomes easy for the vapor 7 to stay in the noncondensable gas reservoir portion 5 which is normally placed in the upper position. Further, due to the fact that the vapor may be condensed within the interior of the noncondensable gas reservoir portion 5 or the liquid may flow into the interior of the noncondensable gas reservoir portion 5 via the heat radiating portion 4, in reality, there may be such a case that the aforesaid three types of fluids coexist within the noncondensable gas reservoir portion 5. These facts of the noncondensable gas tending to stay in the heat receiving portion 2 and the liquid, vapor and noncondensable gas tending to coexist in the noncondensable gas reservoir portion 5 do not cause any particular problem with the storage, transportation and installation of the variable conductance heat pipe. However, in actually actuating and operating the variable conductance heat pipe as a heat radiating device, due to the liquid residing in the interior of the noncondensable gas reservoir portion 5, there occurs a shortage of liquid in the interior of the heat receiving portion 2, and the interior of the heat receiving portion 2 is caused to be dried out, causing a problem of thermorunaway of the temperature within the heat receiving portion 2. Consequently, the variable conductance heat pipe must have the configuration in which the liquid residing in the interior of the noncondensable gas reservoir portion 5 always returns to the heat receiving portion 2 whenever the variable conductance heat pipe is put in use.
In a variable conductance heat pipe shown in
Hereinafter, the configuration and operation of Embodiment 1 will be described in detail by the use of
On the other hand, the same advantage can also be provided in the heat receiving portion 2. In the variable conductance heat pipe having the related-art configuration as shown in
In addition to those shown in
The heating source 9 of Embodiment 1 may be such that heat can be applied to the heat receiving portion 2 thereby, and there is imposed no limitation on its dimensions and configuration. The heating source 9 may be made up of a heating portion of electronic equipment, a heater, a solid such as a heat radiating portion of a heat transport device, a heat pump or a heat exchanger, or a fluid such as a highly heated liquid and a highly heated gas. In addition, the heating source 9 may also be made up of an object which can apply heat to the heat receiving portion 2 through radiation, including the sun, a highly heated object and the like.
On the other hand, the heat sink 10 may be such that heat can be received thereby from the heat radiating portion 4, and there is no limitation on its dimensions and configuration. The heat sink 10 may be made up of a fluid such as water and air or a solid such as a heat receiving portion of a heat transport device, a heat pump or a heat exchanger, soil, and a structure. In addition, the heat sink 10 may also be made up of a substance lying far which can be reached by making use of radiation.
The sealed container 1 is an airtight container which stores liquid, vapor and noncondensable gas therein and may preferably be made of a metal which does not induce any chemical reaction between liquid and vapor and the inner wall of the sealed container 1. For example, in the case of water being used as the liquid, copper is preferably used as a material for the sealed container 1, and in the case of ammonia water being used as the liquid, it is recommendable to use a material such as aluminum or stainless steel which does not produce a noncondensable gas through a chemical reaction with the ammonia water as a material for the sealed container 1.
The heat from the light source 9 is applied to and received by the heat receiving portion 2 and has a function to conduct the heat to the liquid. In addition, the heat receiving portion 2 may have a structure (a porous material or a configuration provided on the surface by which vapor is trapped) which promotes the boiling of the liquid within in the heat receiving portion 2 provided on an inner surface thereof.
The heat insulating portion 3 is a passage through which the liquid, the vapor and the noncondensable gas move. The heat insulating portion 3 may have its periphery exposed to a fluid such as air or brought into contact with a structure to radiate heat thereto. On the contrary, the heat insulating portion 3 may have a heat insulating material provided thereon to insulate itself against the loss of heat. The heat radiating portion 4 has a function to get vapor condensed to be liquefied and radiate latent heat emitted at that time to the heat sink 10. As shown in
The noncondensable gas reservoir portion 5 has a function to accommodate the noncondensable gas therein. There may be a case where the noncondensable reservoir portion 5 accommodates therein the liquid, vapor and noncondensable gas when the variable conductance heat pipe is not in operation. The noncondensable gas reservoir portion 5 is provided at an end portion of the variable conductance heat pipe which lies farthest from the heat receiving portion 2 with respect to the fluid passageway of the variable conductance heat pipe. Preferably, a configuration may be adopted in which the noncondensable gas reservoir portion 5 is provided at an uppermost portion of the constituent part of the variable conductance heat pipe, so that the liquid that has flowed thereinto is allowed to flow downwards.
The liquid is a liquid which can boil, evaporate and condense and may consist of a single-component fluid such as water and ammonia or a multi-component fluid such as an anti-freeze. The vapor is a gas resulting from vaporization of the liquid or part thereof. The noncondensable gas is a gas which does not condense in the working environment, and under the normal environment, helium, argon, neon and nitrogen is used as the noncondensable gas. Preferably, the noncondensable gas is a gas which does not chemically react with the material of the sealed container 1, the liquid, and the vapor, and an inactive gas is further preferably used. In addition, a non-condensable gas may be used which is generated by challengingly causing the sealed container 1 to react with the liquid in an initial stage of sealing the liquid, vapor and noncondensable gas into the sealed container 1.
Embodiment 2On the other hand, the same advantage is also provided in the interior of the heat receiving portion, and being different from the variable conductance heat pipe having the related-art configuration which is shown in
The insertion member 19 only has to be inserted into the interior of the sealed container 1 in such a manner that the non-equilibrium state of capillary force is formed within the same cross section of the sealed container 1, that an exclusive passage for the liquid 6 is provided in such a manner as to extend along the inner wall of the sealed container 1, and that the insertion member 19 has openings 18 which extends axially along the full length or part of the exclusive passage to function as noncondensable gas discharge passages and circumferential liquid suction ports, and the insertion member 19 may be made up of a board which is inserted eccentrically into the sealed container 1. It is noted that in the event that an exclusive passage for the liquid 6 which does not have the openings 18 is provided in the cross section of the sealed container 1 in such a manner as to completely partition the cross section, the noncondensable gas flows into in an interior of the exclusive passage to stay therein so as to produce a gas-liquid interface between the liquid and the noncondensable gas within the exclusive passage, whereby the liquid 6 cannot flow through the exclusive passage due to a capillary force acting on the interface, and consequently, the variable conductance heat pipe becomes out of operation.
It is noted that while in
Further, while in
An oxygen free copper is preferably used as the material of the insertion member 19 shown in Embodiments 2 and 3, and when an oxygen free copper is used which is washed using acetone to remove deposits on a surface thereof and is thereafter subjected to an oxidation treatment under a high temperature the water conveying property of the smaller cross-sectional area flow path 21 can be improved further.
In addition, in Embodiments 2 and 3, grooves may be provided axially on the inner wall of the sealed container 1 so as to produce an irregular surface thereon. The grooves may be provided uniformly in the circumferential direction or may be provided non-uniformly, and moreover, the grooves may be provided in a spiral manner.
As has been described heretofore, the portion having better water conveying property according to the invention can be realized by, as is described in Embodiment 1, providing partially the irregularities on the inner wall of the sealed container or deforming part of the inner wall so as to form on part of the surface of the inner wall the portion where liquid expands axially better than the other portions on the surface of the inner wall. In addition, the portion having better water conveying property can also be realized by applying to part of the surface of the inner wall a treatment which improves the hydrophilic nature. Further, as has been described in Embodiments 2 and 3, the portion having better water conveying property can also be realized by inserting the insertion member into the sealed container so as to define the narrow space between the insertion member and the inner wall of the sealed container. Note that to determine whether or not a specific portion on the inner wall has better water conveying property than the other portions thereon, liquid is dropped on to the specific portion to see whether or not the liquid expands axially longer than on the other portions, and if this is determined true, the specific portion can be determined as having the better water conveying property.
The invention described based on Embodiments 1 to 3 is largely advantageous particularly for a thin sealed container in which the movement of a working fluid is made difficult due to the surface tension of the working fluid. For example, in the case of the working fluid being water, the invention is advantageous when the diameter of the sealed container is on the order of 10 mm or smaller and is more advantageous particularly for a sealed container having a small diameter of the order of 6 mm or smaller. Consequently, the invention is suitable for an application where the quantity of heat is small which can be transported by a single variable conductance heat pipe and is suitable for cooling, for example, a semiconductor laser whose output is on the order of several watts. In the semiconductor laser, since the oscillation frequency and output of the semiconductor laser is largely affected by a change in temperature when it is actuated, the property of a variable conductance heat pipe in which a change in temperature at a heat receiving portion is small when a heating source is actuated can effectively be made use of, and from this view point, such a variable conductance heat pipe can be said to configure a suitable application for the invention.
While the present invention has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims
1. A variable conductance heat pipe comprising a sealed container in which a working fluid and a noncondensable gas are sealed, the sealed container extending in an axial direction, the sealed container including one end to be connected to a heating source and a part to be connected to a heat sink,
- wherein, on a cross section of the sealed container along a direction orthogonal to the axial direction, a portion having water conveying property better than other portions is provided, and
- wherein the portion having the better water conveying property extends in the axial direction.
2. The variable conductance heat pipe according to claim 1, further comprising an insertion member inserted eccentrically into the interior of the sealed container so as to configure the portion having the better water conveying property between an inner wall of the sealed container and the insertion member.
3. The variable conductance heat pipe according to claim 2,
- wherein the insertion member is inserted eccentrically so that a flow path having a larger cross-sectional area and a flow path having a smaller cross-sectional area are configured along the axial direction of the sealed container between the inner wall of the sealed container and the inserted insertion member, and
- wherein the larger cross-sectional area flow path and the smaller cross-sectional area flow path communicate with each other at least partially.
4. The variable conductance heat pipe according to claim 3,
- wherein the insertion member is a board or a wire mesh.
5. The variable conductance heat pipe according to claim 3, further comprising a spacer so that the insertion member is kept separate from the inner wall of the sealed container.
6. The variable conductance heat pipe according to claim 2,
- wherein the insertion member includes a portion having a larger cross-sectional area than other portions.
7. The variable conductance heat pipe according to claim 2,
- wherein a rod is inserted eccentrically in the interior of the sealed container.
8. The variable conductance heat pipe according to claim 1,
- wherein a spiral fine wire is provided to extend along an inner wall of the sealed container to configure the portion having better water conveying property.
9. The variable conductance heat pipe according to claim 1,
- wherein a treatment for improving water conveying property is applied to a part of an interior wall of the sealed container to configure the portion having better water conveying property.
10. The variable conductance heat pipe according to claim 9,
- wherein irregularities including a recessed portion and a raised portion extending in the axial direction are provided at a part of the inner wall of the sealed container to configure the portion having better water conveying property.
11. The variable conductance heat pipe according to claim 1,
- wherein a part of an inner wall of the sealed container in cross section is deformed, so that the deformed portion configures the portion having better water conveying property.
12. The variable conductance heat pipe according to claim 1,
- wherein the heating source is a semiconductor laser.
Type: Application
Filed: Aug 27, 2009
Publication Date: Mar 4, 2010
Applicant: MITSUBISHI ELECTRIC CORPORATION (Chiyoda-ku)
Inventors: Shigetoshi IPPOSHI (Tokyo), Tetsuya Nagayasu (Tokyo), Shingo Hironaka (Tokyo), Kuraki Kitazaki (Tokyo), Yukio Sato (Tokyo)
Application Number: 12/548,861
International Classification: F28D 15/02 (20060101);