Method and apparatus for improving power gain and loss for interconect configurations
The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.
This is a non provisional application of a provisional application Ser. No. 61/215,369 by James V. Russell filed May 4, 2009
BACKGROUND1. Field
In attaching an electrical component to the bottom side and/or the top side of a printed circuit board (PCB), there is the problem of power loss or due to the distance of the capacitance to the points on a corresponding integrated circuit (IC) for which it is intended. It is not possible to physically locate the capacitance directly to the contact pads on the printed circuit which correspond to the input output points of an integrated circuit or in the case of a test board the corresponding points of the test socket. Similarly there is the problem of inadequate dissipation due to the distance of a resistance to the electrical component. Again, it is not very likely to physically locate the resistance at the contact pads on the printed circuit board.
It would therefore be desirable to have a method and apparatus that provides for close proximate placement of the capacitance or of the resistance which shall be referred to as a power modification component since it either better dissipates power (power loss) (resistance) or better distributes power (power gain) (capacitance) to the IC or other electrical component on a PCB to provide better power gain or distribution or power loss or dissipation.
SUMMARYThe present disclosure provides for attaching and embedding a capacitance or a resistance directly to the bottom side of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded power modification component (capacitance or resistance) is located beyond where the visa are located. Each of the pads will be connected to the endpoints of the power modification component located underneath it through an opening in the dielectric material under the pads to permit conduction through the opening. In this way the capacitance and the resistance will have a closer contact point with the electrical component.
Referring now to the drawings,
While certain embodiments have been shown and described, it is distinctly understood that the present disclosure is not limited thereto but may be otherwise embodied within the scope of the appended claims.
Claims
1. A method for providing improved power distribution or power dissipation to an electrical component on a printed circuit board (PCB), the steps comprising:
- embedding a power modification component inside of one or more pads;
- locating said one or more embedded pads to extend over and beyond the vias or blinds of said PCB so that a portion of the pad containing the embedded power modification component is located beyond where the visa or blinds are located, said one or more pads include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening so that said power modification component will have a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.
2. The method according to claim 1 wherein said power modification component is a capacitance.
3. The method according to claim 1 wherein said power modification component is a resistance.
4. An apparatus for improved power distribution or power dissipation to an electrical component on a printed circuit board (PCB), comprising:
- a power modification component embedded inside of one or more pads;
- a PCB having one or more vias or blinds, said one or more embedded pads being located to extend over and beyond the vias or blinds of said PCB so that a portion of the pad containing the embedded power modification is located beyond where the vias or blinds are located, said one or more pads include an opening that is located over a given one of the vias or blinds to permit that via or blind to conduct through the opening so that said power modification component will have a closer contact point to said electrical component thereby increasing power distribution or power dissipation, respectively.
5. The apparatus according to claim 4 wherein said power modification component is a capacitance.
6. The apparatus according to claim 4 wherein said power modification component is a resistance.
Type: Application
Filed: Jan 8, 2010
Publication Date: Nov 4, 2010
Inventor: James V. Russell (Whitehouse Station, NJ)
Application Number: 12/655,858
International Classification: H05K 1/16 (20060101); H05K 3/30 (20060101);