Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.

Abstract: Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate and a plurality of press-fit pins. The press-fit pins are molded into and fixedly coupled with the case. The pins are also electrically and mechanically coupled to the substrate.

Abstract: The invention relates to a method for manufacturing (S) an electronic board (1) comprising the following steps: forming (S1, S4) a cavity (20) in the conductive skin layer (C1) and in an underlying insulating layer (10), so that at least part of a solder pad (4) is exposed, filling (S5) the cavity (20) with a solder paste (24), placing (S6) an SMD (3) opposite the cavity (20), soldering the SMD (3) on the electronic board (1).

Abstract: A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.

Abstract: A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

Abstract: A compliant pin pre-screening, guiding and quality monitoring apparatus is provided. The compliant pin pre-screening, guiding and quality monitoring apparatus includes a fixed plate, a movable plate, a printed circuit board (PCB) and a press-fit connector. The fixed plate defines a through-hole and is disposable above a working table. The movable plate is disposable to be urged by a bias against a first surface of the fixed plate facing the working table and includes pin extendable through the through-hole. The PCB defines a via and is disposable on a second surface of the fixed plate opposite the first surface whereby the pin is extendable through the via with the via corresponding in position to the through-hole and the pin. The press-fit connector is disposable to be secured in position proximate to the PCB and to be inserted into the via with guidance provided by the pin against the bias.

Abstract: A method for bonding a plastic component to a printed circuit board includes the steps of: a) providing the plastic component, the printed circuit board, and at least one positioning member, b) disposing at least one welding layer, c) positioning the plastic component and the printed circuit board relative to each other, d) melting the at least one welding layer while the plastic component is maintained in a positioning position, and e) cooling the at least one welding layer while the plastic component is maintained in the positioning position.

Abstract: A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

Abstract: A battery assembly includes a battery cell, conductive bus bar, and printed circuit board assembly (PCBA). A cell tab of the battery assembly has a first portion extending from a perimeter edge of a pouch and a second portion arranged orthogonally with respect to the first portion. The bus bar defines a tab slot through which the first portion extends, and has a major surface adjacent to the second portion. The PCBA defines an elongated welding window orthogonal to a longitudinal axis of the PCBA. The PCBA is mounted over the bus bar such that surface area of the second portion is exposed through the welding window, and in turn is welded to the bus bar through and within the welding window. A spring element may be positioned between the carrier frame and the PCBA. A method of making the battery assembly is also provided.

Abstract: A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

Abstract: In an apparatus and method for multi mask alignment, a carrier is provided that includes apertures therethrough. For each aperture, a combination frame and shadow mask that includes alignment features is positioned on spacers supported by the carrier with the shadow mask of the combination in coarse alignment with the aperture. Next, each combination frame and shadow mask is moved to a position spaced from the spacers whereupon the alignment system, under the control of a controller, individually aligns each combination frame and shadow mask to align the alignment features of the combination with reference alignment features associated with the combination. Each combination frame and shadow mask is then returned to a position on the spacers whereafter each combination frame and shadow mask is secured to the carrier. In an example, all of the combination frames and shadow masks can be aligned simultaneously.

Abstract: A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer.

Abstract: An aspect of the disclosure includes a security system and method having a key with nanoscale features. The key includes a body. At least one pattern member disposed on the body, the pattern member formed using a directed self-assembly polymer to define a pattern of random feature structures thereon, the feature structures having a width of less than 100 nanometers.

Abstract: A package includes a metal core substrate, a first insulation layer formed along a periphery of a first surface of the metal core substrate, the first surface of the metal core substrate being exposed at an inner side of the first insulation layer, a second insulation layer formed along at least a periphery of a second surface of the metal core substrate, a first through-electrode penetrating the second insulation layer at a first part of the periphery of the metal core substrate, and a second through-electrode penetrating the first insulation layer, the metal core substrate and the second insulation layer at a second part of the periphery of the metal core substrate, the second through-electrode being electrically insulated from the metal core substrate via an insulation member.

Abstract: The invention relates to a device for conducting a cooling fluid for cooling an electrical component. The device comprises a fluid conducting chamber for conducting the cooling fluid, and an at least partially flexible cover, which seals the fluid conducting chamber in a fluid-tight manner and which forms a heat transmission zone for conducting heat between the cooling fluid and the electrical component.

Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

Abstract: In certain aspects of the invention, an isolator is configured by a reception circuit, a transmission circuit, and a transformer. In some aspects, the transmission circuit is disposed in an anterior surface of a semiconductor substrate. The transformer is disposed in a posterior surface of the semiconductor substrate and transmits in an electrically isolated state to the reception circuit, a signal input from the transmission circuit. The transformer is configured by a primary coil and a secondary coil. The primary coil can be configured by a metal film embedded in an oxide film inside a coil trench. The secondary coil can be disposed inside an insulating film covering the primary coil so as to oppose the primary coil and is insulated from the primary coil by the insulating film.

Abstract: Provided is a method for mounting a Printed Circuit Board (PCB). The method includes providing a solder cream on a predetermined region of a bottom surface of the PCB except for a region requiring insulation, mounting the PCB on a mounting region of a housing on which the PCB is to be mounted, and fixedly coupling the PCB to the housing by melting and hardening the solder cream provided on the bottom surface of the PCB.

Abstract: A universal DC power adaptor for a PRC-148 radio, a PRC-152 radio, and a Handheld ISR Transceiver, and a method of using same, is disclosed. The presently disclosed universal DC power adaptor includes mounting and locking features that are common to both the PRC-148 radio and the PRC-152 radio. The universal DC power adaptor further includes certain mounting and locking features that are unique to the PRC-148 radio and other mounting and locking features that are unique to the PRC-152 radio. The universal DC power adaptor also provides an output voltage suitable for both the PRC-148 and PRC-152 radios. Such features also are compatible with the Handheld ISR Transceiver, making the universal DC power adaptor compatible with the ISR Transceiver as well. Additionally, the universal DC power adaptor includes programmable control electronics.

Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.

Abstract: An improved process for wire harness assembly using air pressure to seat and manufacture wiring harnesses.

Abstract: An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower heat spreader surface, an upper heat spreader surface parallel to the lower heat spreader surface, and at least one heat spreader side, the heat spreader disposed on the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the heat spreader side and lower heat spreader surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.

Abstract: Electronic devices are provided with housing components that have improved aesthetics. One or more holes may be formed through a portion of the housing and then the housing portion may be anodized. The anodization process may increase or decrease the geometries of each hole. The holes may be formed through the housing portion from a cosmetic side of the housing portion to an interior side of the housing portion.

Abstract: The present invention discloses an electronic component embedded substrate and a manufacturing method thereof. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core board having a cavity formed therein; an electronic component being embedded in the cavity; and a circuit pattern formed on one surface of the core board and configured for fixing the electronic component in the cavity by pressing the electronic component.

Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a chuck unit which chucks one of the plurality of leads of the electronic component to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

Abstract: An electronic module (20, 39, 60, 80, 132, 140, 144) includes a substrate (21), which includes a dielectric material having a cavity (40, 42, 134, 142) formed therein. First conductive contacts (44) within the cavity are configured for contact with at least one first electronic component (32) that is mounted in the cavity. Second conductive contacts (44) on a surface of the substrate that surrounds the cavity are configured for contact with at least a second electronic component (28, 30) that is mounted over the cavity. Conductive traces (36, 48) within the substrate are in electrical communication with the first and second conductive contacts.

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Abstract: This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

Abstract: A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.

Abstract: A method for manufacturing a probe card prepares a plurality of probes, each having a metal layer on an attaching portion, and hot-melt material covering the metal layer. Each probe is attached to a probe substrate by inserting its attaching portion into a different through hole of the probe substrate so that at least a part of the metal layer is located in the through hole. The hot-melt material of each attaching portion is melted and thereafter solidified such that the hot-melt material contacts the metal layer and a part of a wall surface of the through hole, to fix each probe to the probe substrate.

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract: The present invention relates to an electronic component embedded printed circuit board and a method for manufacturing the same. An electronic component embedded printed circuit board of the present invention includes a core having a cavity therein and internal circuit layers on upper and lower surfaces thereof; an electronic component inserted in the cavity and having an elastic body on an outer peripheral surface thereof; insulating layers laminated on the top and bottom of the core; external circuit layers patterned on the insulating layers; and vias formed in the insulating layers to electrically connect the internal circuit layers and the external circuit layers, wherein among the vias, the via in contact with the electronic component is connected through the elastic body.

Abstract: According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.

Abstract: The present invention can reduce warpage while minimizing unnecessary wiring of an electronic component embedded substrate by including an electronic component; a first wiring layer; and a second wiring layer, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer and a first insulating portion is made of a material having a lower coefficient of thermal expansion than a second insulating portion.

Abstract: An electrochemical test sensor being adapted to assist in determining information relating to an analyte in a fluid sample and includes a base and a second layer. The base includes a plurality of electrodes, a working conductive lead and a counter conductive lead thereon. The electrodes include a working electrode and a counter electrode. The second layer assists in forming a channel in which the channel includes a reagent therein. Auto-calibration information of the test sensor is performed by a plurality of auto-calibration segments connected to one of the following: the working conductive lead, the counter conductive lead, or neither of the conductive leads, at least one of the plurality of auto-calibration segments being connected to the working conductive lead and at least one of the plurality of auto-calibration segments being connected to the counter conductive lead.

Abstract: Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is characterized in that an insulation layer 16 is formed on either the top or bottom side of a metal core 11, while an opening 12 formed in the metal core 11 is used as a cavity area 15a for mounting a component, wherein a reinforcement pattern 30 is formed on the surface of an insulation layer facing the bottom of the cavity area 15a in the insulation layer 16. The reinforcement pattern 30 is made of the same material as the wiring patterns 28c, 29c formed on the insulation layer 16, and also formed simultaneously with these wiring patterns 28c, 29c.

Abstract: A spherical bearing comprising: a race; a ball; a wear lining; and a capacitive sensor positioned within or behind the wear lining to gauge wear of said wear lining.

Abstract: A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main surface. An insulation layer disposed on the main surface of the component has via conductors formed therein which are connected to the side surfaces and the main surfaces of the respective terminal electrodes. The via conductors are tapered, such that their via diameter decreases in a direction toward the terminal electrode, and their via diameter at a position where they connect to the main surface is greater than a length of the main surface. Accordingly, the area of connection between the via conductors and the corresponding terminal electrodes is increased, improving connection reliability through enhancement of tolerance for positional deviation.

Abstract: Disclosed herein is a printed circuit board capable of implementing slimness by decreasing the number of entire layers through an asymmetrical build-up structure in which an electric device is embedded, the printed circuit board including: a core layer including a cavity formed therein so that an electric device is embedded and a circuit pattern and a pad formed on upper and lower surfaces thereof; a through via formed in the core layer so as to connect the upper and the lower pads of the core layer to each other; a plurality of insulating layers built-up on the core layer and including a plurality of vias so as to be electrically connected to the through via; and a solder resist layer applied onto a lower portion of the core layer so that a lower surface of the through via is partially exposed.

Abstract: The present invention relates to circuit boards and, more specifically, a process for providing electrical connections with reduced via capacitance on circuit boards. In one embodiment, the present invention provides a method for providing an electrical connection between traces disposed on different layers of a circuit board, the method comprising forming in the board a via hole that extends between the different layers and interconnects a pair of electrically conductive traces disposed on the different layers. An inner sidewall of the via hole includes electrically conductive material thereon. The method further comprises removing a first portion of the conductive material from the inner sidewall by removing a first portion of the inner sidewall. A remaining portion of the conductive material on a remaining portion of the inner sidewall interconnects the pair of traces and has a corresponding width that is substantially similar to a width of each trace.

Abstract: A device with low dielectric absorption includes a printed circuit board (PCB), a component connection area including a first conductor layered on a top surface of the component connection area and a second conductor layered on a bottom surface of the component connection area, an aperture surrounding the component connection area, a low-leakage component connecting the component connection area to the PCB across the aperture, and a guard composed of a third conductor at least substantially surrounding the aperture on a top surface of the PCB and a fourth conductor at least substantially surrounding the aperture on a bottom surface of the PCB.

Abstract: A Z-directed component for mounting in a mounting hole in a printed circuit board according to one example embodiment includes a body having a top surface, a bottom surface and a side surface. The body has a cross-sectional shape that is insertable into the mounting hole in the printed circuit board. A first portion of the body is composed of a first dielectric material having a first dielectric constant and a second portion of the body is composed of a second dielectric material having a second dielectric constant that is higher than the first dielectric constant. A conductive channel extends through a portion of the body forming a signal path.

Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.

Abstract: A wiring board includes a core substrate including an insulative substrate and a first inner conductive-circuit layer formed on first surface of the insulative substrate, an electronic component positioned in a penetrating hole formed in the insulative substrate and having a positive electrode terminal on first end portion and a negative electrode terminal on second end portion on the opposite side, a first interlayer insulative resin layer formed on first surface of the core such that the first insulative layer is positioned over the core and component in the penetrating hole, and an outer conductive-circuit layer formed on surface of the first insulative layer such that thicknesses of the first insulative layer between the outer conductive-circuit layer and the terminals are less than thickness of the first insulative layer between the first inner conductive-circuit layer and the outer conductive-circuit layer.

Abstract: A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin.

Abstract: Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.

Abstract: A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card.

Abstract: There is provided a component mounting method for fitting a component including downwardly-extending insertion pins on a substrate by sucking the component by a suction nozzle and moving the suction nozzle such that the insertion pins of the sucked component are inserted into pin insertion holes formed in a substrate. The component mounting method includes: positioning the insertion pins and the pin insertion holes, and then pushing the component against the substrate by the suction nozzle, thereby fitting the component on the substrate such that the insertion pins are inserted into the pin insertion holes; and pushing again the component against the substrate after the component is fitted on the substrate, so as to push the insertion pins into the pin insertion holes.

Abstract: Embodiments of the invention provide a method of manufacturing an electronic component-embedded printed circuit board. The method includes the steps of providing a base plate, which has a cavity formed in a thickness direction thereof and to one side of which tape is adhered, and disposing an electronic component in the cavity, such that an active surface of the electronic component is flush with one side of the base plate. The method further includes forming an insulating material layer on the other side of the base plate to bury the electronic component, and removing the tape from the one side of the base plate and then forming a first circuit layer including connection patterns coming into contact with connecting terminals of the electronic component on the one side of the base plate.