Abstract: According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.

Abstract: A surface mount device having features on contacts to prevent the surface mount device from tombstoning. The feature may be channel defined by the contact that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process. The feature may also be a solder mask that helps balance a torque/force applied on each side of the surface mount device during a reflow soldering process.

Abstract: A method for manufacturing a connection body, and a method for connecting a component, which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. The method includes a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first electrode and a second component having a second electrode; a temporary fixing step of pressing the first component or the second component to sandwich the filler-aligned layer; and a final compression boding step of further pressing the first component or the second component after the temporary fixing step to connect the first electrode and the second electrode.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and a pair of external electrodes disposed on opposing ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein the external electrodes respectively include a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrode and a band portion extending from the connection portion to a portion of a neighboring surface of the capacitor body, a conductive resin layer covering a corner of the connection portion of the conductive layer and having a cutout portion so that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer due to the cutout portion.

Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first portion arranged around the electrical connection pin and a second portion located radially outward of the first portion.

Abstract: A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with each of the plurality of dielectric layers interposed therebetween, and an external electrode disposed on the capacitor body to be connected to the internal electrode. At least one intermetallic compound layer is disposed in a region in which the plurality of internal electrodes and the external electrode are connected, and a total number of the at least one intermetallic compound layer is more than or equal to 55% and less than 100% of a total number of the plurality of internal electrodes.

Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers include a nickel-plated layer and a tin-plated layer on an outer periphery thereof. The two interposers each include a non-plated region without the nickel-plated layer on an end surface at which the two interposers face each other.

Abstract: A wiring substrate includes a substrate, a first metal and a second metal. The substrate has a first surface, a second surface opposite the first surface, and a side surface connected to the first surface and the second surface. The first metal film is disposed so as to extend from the first surface to the side surface. The second metal film is disposed so as to extend from the second surface to the first metal film disposed on the side surface.

Abstract: A wiring board includes an insulating layer, a thin film capacitor laminated on the insulating layer, an interconnect layer electrically connected to the thin film capacitor, and an encapsulating resin layer laminated on the thin film capacitor. The interconnect layer includes a pad protruding from the thin film capacitor. The encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is ‘a’, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is ‘b’, ‘b/a’ is 0.07 or more.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes an end surface facing in a first direction, and internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction. The external electrode is provided on the end surface and includes two protrusions that are formed along two peripheral portions of the end surface and protrude in the first direction, the two peripheral portions being disposed in a third direction orthogonal to the first direction and the second direction.

Abstract: A display apparatus includes a base substrate, a plurality of data lines disposed in a display area on the base substrate, wherein at least a portion of the data lines extend to a first peripheral area adjacent to the display area, a plurality of detour lines disposed in the display area, wherein at least a portion of the detour lines extend to the first peripheral area, and a data driver electrically connected to the data lines and the detour lines, wherein at least one of the data lines electrically contacts at least one of the detour lines in the first peripheral area.

Abstract: A display device includes: a substrate including a display area and a peripheral area outside the display area, the display area including a first display area and a second display area; a first fan-out portion in a portion of the peripheral area outside the first display area; a second fan-out portion outside the first fan-out portion; a first power supply line in the peripheral area corresponding to one side of the display area and overlapping at least a portion of the first fan-out portion; and a second power supply line in the peripheral area outside the display area and overlapping at least a portion of the second fan-out portion.

Abstract: An electronic component includes at least one first multilayer capacitor and at least one second multilayer capacitor alternatively laminated in a first direction perpendicular to one surface of the first multilayer capacitor, such that an external electrode of the first multilayer capacitor is connected to an external electrode of the second multilayer capacitor. In the first multilayer capacitor, a plurality of internal electrodes are laminated in a first direction, and in the second multilayer capacitor, a plurality of internal electrodes are laminated in a second direction perpendicular to the first direction.

Abstract: A component-embedded substrate includes: insulating layers each including a wiring pattern; an embedded component including a connection terminal; a plurality of vias that electrically connect the connection terminal to the wiring patterns adjacent to each other in a lamination direction. Each of the vias is composed of a via hole in the insulating layer and a conductive material in the via hole. One of the vias is a connection via connected to the connection terminal, and another of the vias is an adjacent via adjacent to the connection via in the lamination direction. The connection via and adjacent via overlap in a plan view. S1/A1?0.61 and S1/A2?0.61 are satisfied, where A1 is an average cross-sectional area of the connection via, A2 is an average cross-sectional area of the adjacent via, and S1 is an overlapping area of the connection via and adjacent via in the plan view.

Abstract: A substrate structure is disclosed. The substrate structure includes a carrier, a dielectric layer on the carrier, a patterned organic core layer in the dielectric layer, and a conductive via. The patterned organic core layer defines a passage extending in the dielectric layer towards the carrier. The conductive via extends through the passage towards the carrier without contacting the patterned organic core layer.

Abstract: A mounted structure of a supporting-terminal-equipped capacitor chip includes first and second supporting terminals. The first supporting terminal includes a first helical electrically conductive portion extending in a first axial direction along a main surface. The second supporting terminal includes a second helical electrically conductive portion extending in a second axial direction along the main surface. The first helical electrically conductive portion is electrically connected to a first outer electrode at an outer peripheral side surface of the first helical electrically conductive portion. The second helical electrically conductive portion is electrically connected to a second outer electrode at an outer peripheral side surface of the second helical electrically conductive portion.

Abstract: A method for fabricating a semiconductor package includes: providing a semiconductor wafer having opposing first and second sides, the semiconductor wafer being arranged on a first carrier such that the second side of the wafer faces the carrier; masking sawing lines on the first side of the semiconductor wafer with a mask; depositing a first metal layer on the masked first side of the semiconductor wafer by cold spraying or by high velocity oxygen fuel spraying or by cold plasma assisted deposition, such that the first metal layer does not cover the sawing lines, the deposited first metal layer having a thickness of 50 ?m or more; singulating the semiconductor wafer into a plurality of semiconductor dies by sawing the semiconductor wafer along the sawing lines; and encapsulating the plurality of semiconductor dies with an encapsulant such that the first metal layer is exposed on a first side of the encapsulant.

Abstract: A circuit board heat sink structure having a circuit board and comprising a metallic heat sink, wherein the circuit board has a metal substrate, an insulation layer and a conductor layer, and the wherein the circuit board is arranged on the heat sink in such a way that the metal substrate contacts a locating face of the heat sink. At least one heat transition point is formed between the heat sink and the metal substrate, which provides a defined metallic contact between the material of the heat sink and the material of the metal substrate. A method is also provided for forming the circuit board heat sink structure.

Abstract: A module board is provided. The module board includes a plurality of first left terminals and a plurality of first right terminals. Each of the plurality of first left terminals includes a left upper body, a left lower body, and a left lower bar which are connected to one another and sequentially provided, each of the plurality of first right terminals includes a right upper body, a right lower body, and a right lower bar which are connected to one another and sequentially provided, and a first width of each of the left upper body and the right upper body is greater than a second width of each of the left lower bar and the right lower bar.

Abstract: A magnetic base body comprises multiple metal magnetic grains and bonding parts for bonding the multiple metal magnetic grains, wherein the bonding parts are constituted by an amorphous mixture containing carbon and an oxide of at least one element selected from silicon, aluminum, chromium, magnesium, titanium, and zirconium. A coil component using the magnetic base body can improve mechanical strength while ensuring insulation reliability.

Abstract: A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016?A/B<1 in which A is a thickness of the dielectric layer and B is an average length of margins of the capacitor body in a length direction, and A is 1 ?m or less.

Abstract: A flexible circuit board is provided. The flexible circuit board includes a base film with an outer lead region defined on either one surface or the other surface and an outer lead provided in the outer lead region and connected to an electronic device, in which the outer lead includes a plurality of first outer leads and a plurality of second outer leads formed to be spaced apart from each other so as to face each other in the outer lead region, and in which the number of the plurality of first outer leads is greater than the number of the plurality of second outer leads.

Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).

Abstract: A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.

Abstract: A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including a first end surface and a second end surface facing in a direction of a first axis, and internal electrodes laminated in a direction of a second axis orthogonal to the first axis and drawn from the first end surface or the second end surface; a first external electrode disposed to cover the first end surface; and a second external electrode disposed to cover the second end surface. Each of the first external electrode and the second external electrode has an electrode end surface facing in the direction of the first axis. The electrode end surface includes a pair of first peripheral regions located at peripheral edges in the direction of the second axis, and a first concave region located between the pair of first peripheral regions and recessed from the pair of first peripheral regions.

Abstract: A printed circuit board according to an embodiment includes: a first insulating portion having a cavity; a second insulating portion disposed on the first insulating portion; a third insulating portion disposed under the first insulating portion; and an electronic device disposed in the cavity, wherein a number of layers of the second insulating portion is different from a number of layers of the third insulating portion, and has an asymmetric structure with respect to the first insulating portion in which the electronic device is disposed.

Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.

Abstract: A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: An electronic device includes: a first resin layer having a first resin layer main surface and a first resin layer inner surface; a columnar conductor having a columnar conductor main surface and a columnar conductor inner surface and penetrating the first resin layer in direction z; a wiring layer connecting the first resin layer main surface and the first conductor main surface; an electronic component being electrically connected and joined to the wiring layer; a second resin layer having a second resin layer main surface facing the same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface, covering the wiring layer and the electronic component; and an external electrode closer to the side where the first resin layer inner surface faces than the first resin layer and is electrically connected to the columnar conductor.

Abstract: A power conversion circuit board (1) is a circuit board on which a power conversion circuit configured to convert a direct current into an alternating current is mounted. A low-voltage circuit (10b) to which a low voltage is applied and a high-voltage circuit (10a) to which a high voltage is applied are separately disposed in different areas on the same circuit board surface. Furthermore, part of wiring of the high-voltage circuit (10a) is formed on the circuit board surface, and the other wiring is constituted by a bus bar provided at a predetermined distance from the circuit board surface.

Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.

Abstract: A board having an electronic component mounted thereon includes a capacitor body; a pair of external electrodes disposed on both ends of the capacitor body, respectively; a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions each having a protrusion on a lower side thereof, respectively; a board; and a pair of electrode pads disposed on an upper surface of the board and connected to the pair of metal frames, respectively, and each having a groove portion corresponding to the protrusion on an upper surface thereof.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of first and second internal electrodes disposed inside the ceramic body, exposed to the first and second surfaces, and having ends exposed to the third or fourth surface, and a first side margin portion and a second side margin portion disposed on side portions of the plurality of first and second internal electrodes exposed to the first and second surfaces. A ratio Db/Da satisfies 1.00 to 1.07, inclusive, where ‘Db’ is a distance, in a stacking direction of the dielectric layer, between both end points of respective edge regions of the first side margin portion and the second side margin portion, and ‘Da’ is a distance in a central region of the ceramic body in the stacking direction.

Abstract: A method of manufacturing a batch of component carriers is disclosed. The method includes providing a plurality of separate wafer structures, each comprising a plurality of electronic components, simultaneously laminating the wafer structures with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and singularizing a structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components, a part of the at least one electrically conductive layer structure and a part of the at least one electrically insulating layer structure.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and an external electrode including a base layer including a step portion formed on the main surface, and a plated layer formed on the base layer, the external electrode being connected to the internal electrodes.

Abstract: A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

Abstract: The present disclosure relates to a chip on film and a display device. The chip on film includes a body and an insulating protective film arranged on the body, in which the body includes a first area, a first binding area for binding and connecting to the back surface of the display panel, and a first bendable area located between the first area and the first binding area and capable of being bent in a first direction; and the insulating protection film includes a first connection area connected to the first area, a second connection area for connecting to the back surface of the display panel, and a second bendable area located between the first connection area and the second connection area and capable of being bent in a second direction opposite to the first direction.

Abstract: An array imaging apparatus having discrete camera modules is disclosed. In one embodiment, the apparatus comprises a substrate; and heterogeneous camera modules attached to the substrate and in a geometric relationship with each other, the heterogeneous camera modules having a substantially similar photometric response.

Abstract: Electronic chip comprising: an electronic circuit; a resistive element arranged on a rear face of a substrate; two conductive vias passing through the substrate, each connected to the electronic circuit and to one of the ends of the resistive element, and masked by the resistive element; and comprising a weakening structure formed of blind holes such that each of the blind holes comprises a section, at the rear face, of shape and of external dimensions similar to those of the conductive vias, and comprises a portion of the substrate masked by the resistive element, or in which the resistive element comprises first and second parts spaced apart from each other, arranged one above the other, electrically connected to each other and together forming a coil pattern and/or several alternating, intermingled, wound up or intertwined patterns.

Abstract: Disclosed are a package structure of an integrated passive device and a manufacturing method thereof and a substrate. The method includes: providing an organic frame having a chip embedding cavity and a metal pillar, laminating at least one layer of first dielectric on an upper surface of the organic frame, and processing the first dielectric by photolithography to form an opening correspondingly above the chip embedding cavity; mounting an electronic component in the chip embedding cavity through the opening, the electronic component including an upper and lower electrodes; laminating and curing a second dielectric into the chip embedding cavity and on an upper surface of the first dielectric, thinning the first and second dielectrics to expose the upper and lower electrodes, upper and lower surfaces of the metal pillar; performing metal electroplating to form a circuit layer communicated with the upper and lower electrodes and the metal pillar.

Abstract: An object is to provide a power system interconnection system and a method of installing the power system interconnection system that are able to supply a load with required power. A power system interconnection system comprises a storage battery an AC-DC power conversion device for the storage battery a charge and discharge station for an electric-powered automobile and an interconnection control device that are installed on a parking lot. The interconnection control device supplies a first load with power from at least one of the charge and discharge station and the AC-DC power conversion device in a case where the electric power system is in an emergency situation.

Abstract: A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.

Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.

Abstract: A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.

Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

Abstract: A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.