HEAT SINK ASSEMBLY

Abstract

A heat sink assembly includes a fan and two sets of fin modules. The fan generates airflow along a first direction. The two sets of fin modules are fixed on opposite sides of the fan. Each set of fin module has a plurality of parallel fins. The fins extend parallel to the first direction.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to a heat sink assembly and, particularly, to a heat sink assembly with a fan.

2. Description of Related Art

Electronic devices in computers, such as central processing units (CPUs), generate a lot of heat during normal operation, which can deteriorate their operational stability, and damage associated electronic devices. Thus, the heat must be removed quickly to ensure normal operation of the CPU. A typical thermal device includes a typical heat sink mounted on a CPU to remove heat. The typical heat sink includes a plurality of parallel fins and several heat pipes passing through the parallel fins. However, the typical thermal device is usually heavy and the efficiency low.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is a schematic view of a heat sink assembly; and

FIG. 2 is a schematic view of a heat sink assembly in an electronic device.

DETAILED DESCRIPTION

Referring to FIG. 1, a heat sink assembly 100 includes a fan 10 and a plurality of fins 20. The fan 10 is installed at a middle portion of the heat sink assembly 100. The fins 20 are located on two sides of the fan 10. The fan 10 includes an inlet and an outlet. The air flows into the inlet of the fan 10 through one part of the fins 20 laid on one side of the fan 10. Then the air flows toward the outlet of the fan 10 from the inlet of the fan 10. Finally, the air flows out from the outlet of the fan 10 through the other part of the fins 20.

Each fin 20 is perpendicular to the fan 10. The fins 20 are rectangular and have the same height and length. As a whole, the exposed surface of the fins 20 is approximately equal to the area of the face of the fan 10.

A plurality of heat pipes 21 run through the fins 20. A heat pipe is a heat transfer mechanism that can transport large quantities of heat with a very small difference in temperature between the hotter and colder interfaces. Sometimes, inside a heat pipe, at the hot interface a fluid turns to vapor and the gas naturally flows and condenses on the cold interface.

A bracket 30 is mounted on a bottom portion of the heat sink assembly 100 to fix the heat sink assembly 100 in an electronic device. A through hole 22 is defined in each corner of the fins 20 to receive a screw 31. The screws 31 are inserted into the holes 22 to fix the bracket 30 in the electronic device.

Referring to FIG. 2, the heat sink assembly 100 is mounted in the electronic device to dissipate heat from a central processing unit (CPU). The electronic device includes a plurality of CD-ROMs 40, a plurality of power supplies 50, a plurality of hard disk drivers 60, a plurality of memories 70, a plurality of PCIE cards 80 and a plurality of system fans 90. The system fans 90 are located on one side of the heat sink assembly 100. The air flows through the heat sink assembly 100, and flows out from the system fans 90. These components cooperate to work in the electronic device.

Each heat pipe 21 quickly transfers heat from the CPU to the fins 20. The fins 20 and the fan 10 dissipate the heat from the CPU. The fins 20 of the heat sink assembly 100 are uniformly distributed. The air flows through the heat sink assembly 100, and flows out from the system fans 90.

It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat sink assembly comprising:

a fan generating airflow along a first direction;

two sets of fin modules fixed on opposite sides of the fan, each set of fin module having a plurality of parallel fins, wherein the fins extend parallel to the first direction.

2. The heat sink assembly of claim 1, wherein an exposed surface of each set of fin module is approximately equal to an area of the face of the fan.

3. The heat sink assembly of claim 1, wherein a through hole is defined in each fin module to accommodate a fastener.

4. The heat sink assembly of claim 1, wherein at least one heat pipe is located in each fin module.

5. The heat sink assembly of claim 1, wherein a bracket is located on a bottom portion of the fin modules to support the fin modules.

6. The heat sink assembly of claim 5, wherein each fin is parallel to a top portion of the bracket.

7. A heat dissipater comprising:

two fin modules, each fin module having a plurality of parallel fins;

a fan sandwiched between the two fin modules, the fan having an inlet toward one fin module and an outlet toward the other fin module, each fin is perpendicular to a face of the fan.

8. The heat dissipater of claim 7, wherein an exposed surface of each fin module is approximately equal to an area of the face of the fan.

9. The heat dissipater of claim 7, wherein each fin is rectangle-shaped.

10. The heat dissipater of claim 7, wherein a hole is defined in each fin module to accommodate a fastener.

11. The heat dissipater of claim 10, wherein a diameter of the hole is larger than a diameter of the fastener.

12. The heat dissipater of claim 7, wherein the fin modules further comprise of heat pipes.

13. The heat dissipater of claim 7, wherein a bracket is located on a bottom portion of the fin modules to support the fin modules.

14. The heat dissipater of claim 7, wherein each fin is parallel to a top portion of the bracket.