CMC ANCHOR FOR ATTACHING A CERAMIC THERMAL BARRIER TO METAL
A ceramic matrix composite (CMC) anchor (20, 100) joining a metal substrate (40) and a ceramic thermal barrier (38). The CMC anchor extends into and interlocks with the ceramic barrier, and extends into and interlocks with the metal substrate. The CMC anchor may be a honeycomb (20) or other extending-into-and-interlocking geometry. A CMC honeycomb may be formed with first (22) and second (24) arrays of cells (26) with open distal ends (28) on respective opposite sides of a sheet (30). The cells may have walls (32) with transverse passages (36). A metal (40) may be deposited into the cells and passages on one side of the sheet, forming a metal substrate locked into the honeycomb. A ceramic insulation material (38) may be deposited into the cells and passages on the opposite side of the sheet, forming a layer of ceramic insulation locked into the honeycomb.
Latest SIEMENS POWER GENERATION, INC. Patents:
The invention relates generally to mechanisms for attaching ceramic coatings to metal structures, and more particularly to attaching a ceramic thermal barrier coating to a metallic component by means of a mutually interlocked ceramic matrix composite (CMC) honeycomb.
BACKGROUND OF THE INVENTIONMetal structures in high temperature environments such as in gas turbines may be coated with a protective ceramic insulating layer called a thermal barrier coating (TBC). Various processes and thermal barrier compositions have been used, but usually have been limited to layers less than 2 mm thick due to thermal expansion differences between the coating and the metal. This limits the amount of protection provided by these coatings, and leads to high thermal gradients in the coating, which can cause spalling. Differential thermal expansion can crack the coating and weaken the bond with the protected substrate material.
Other approaches to adhering ceramic coatings to metal substrates include the use of metal foams or feltmetals. U.S. Pat. No. 5,605,046 (Liang) and others use fibrous metallic layers brazed to metal substrates and used as a compliant layer for ceramic TBCs. Improvements, such as U.S. Pat. No. 6,499,943 (Beeck, et al) focus on improving the temperature capability of the compliant metallic interlayer.
Other approaches include: graded composition coatings from metal-to-ceramic (e.g., U.S. Pat. No. 5,320,909) metal wire meshes bonded to the metallic substrate (e.g., U.S. Pat. No. 6,280,584 and U.S. Pat. No. 6,264,766); metallic protrusions integrally cast with the substrate (e.g., U.S. Pat. Nos. 6,720,087 & 6,251,526); metallic foam interlayers (U.S. Pat. No. 6,544,003); and metal honeycombs (U.S. Pat. No. 6,235,370).
The problem with all these solutions is the temperature limitation of the metallic interlayers. For porous or thin-walled metal structures, oxidation resistance is severely compromised by high surface area and rapid depletion of protective oxide forming elements. Thus, the compliant member becomes the temperature limiting feature of such designs. For applications where high heat flux and/or temperatures necessitate the use of ceramic thermal barrier coatings, improvements over these state-of-the-art solutions is desired.
Thus, there has been a long-standing need for thicker coatings with improved bonding and durability on metal structures for high temperature environments.
The present invention provides a high temperature, oxidation-resistant compliant layer between a structural metal substrate and an insulating ceramic coating. The compliant interlayer comprises a fiber-reinforced ceramic composite structure which is integrally tied to both metallic and ceramic coating members and is arranged in such a manner as to provide compliance for differential thermal expansion.
The invention is explained in the following description in view of the drawings that show:
Alternate methods of fabricating a CMC honeycomb include:
1. Stacking corrugated CMC sheets offset laterally to form channels, and bonding or curing the sheets together
2. Stacking and bonding a plurality of CMC braided tubes
3. Stacking and bonding a plurality of CMC 3D woven sheets of tubes.
Once the ceramic material of the CMC honeycomb and ceramic composite structure of
Surfaces 39, 41 with specific shapes may be formed on the ceramic insulation 38 and/or on the metal structure 40 in the molds 46, 48. For example, the ceramic insulation surface 39 may be formed as a surface of rotation, including a cylindrical surface. For example, shapes can be formed for gas turbine components such as ring seal segments, vane segment shrouds, transitions, and combustors. The ceramic 38 may be poured first. Then the ceramic 38 and CMC honeycomb 20 may be fired. Then the metal 40 may be poured. One or both surfaces 39, 41 may be later machined to final specifications.
As shown in
While oxide CMC's can survive most metal casting processes, the high temperatures required for Ni-based superalloys may degrade the CMC properties—particularly its strain tolerance. Even in this degraded state, the CMC still offers much better bond reinforcement and compliance than a straight metal-to-ceramic bond. However, methods that deposit metal at lower bulk temperatures may be used to minimize this effect on the CMC. Such methods may include:
1. Selective laser sintering (laser locally densifies thin layers of metal powder deposit—may not heat underlying material in bulk)
2. Physical vapor deposition
3. Active metal brazing (allows joining at a lower temperature than the metal melting temp. Can diffuse active species to increase thermal capacity of joint. Requires matching joint design with tolerance requirements.)
4. Powder metal approaches using sintering temperatures that are below melting point
5. The above can be used in combination with each other and/or casting. The term “deposit” may be used generically to describe any process for applying or forming the metal, ceramic, or other layers to form the structure described herein.
1. Fill the CMC honeycomb 20 with a leachable, non-wetting ceramic core 53 in a layer at the desired metal/ceramic coating interface as in
2. Cast or deposit metal 40 against one side of the core 53.
3. Cast or deposit ceramic 38 against the opposite side of the core 53.
4. Leach away the core 53, leaving a void 54.
1. Fill the CMC honeycomb 20 with a leachable, non-wetting ceramic core 53 in a layer at the desired metal/ceramic coating interface as in
2. Cast or deposit metal 40 against one side of the core 53.
3. Leach away the core 53.
4. Cast or deposit ceramic 38 against the metal.
1. Fill the CMC honeycomb 20 with a leachable, non-wetting ceramic core 53 in a layer at the desired metal/ceramic coating interface as in
2. Cast or deposit metal 40 against one side of the core 53.
3. Leach away the core 53.
4. Deposit ceramic fibers 55 against the metal inner surface.
5. Cast or deposit ceramic 38 against the ceramic fibers 55.
In another fabrication method, ceramic 38 can be deposited into the CMC anchor, and then cured, creating the ceramic layer 38 with an inner surface or interface plane. For embodiment 103 the metal 40 may then be deposited against the ceramic inner surface, allowing some infusion of the metal into the ceramic layer porosity. If infusion is not wanted, a non-wetting layer can be applied to the ceramic layer prior to applying the metal. For embodiments 102 and 104, a leachable, non-wetting ceramic core material 53 (embodiment 102) or ceramic fibers 55 (embodiment 104) can be deposited in a layer on the ceramic 38 inner surface as shown in
Other CMC wall geometries besides honeycombs may be used. The term “anchor” may be used to describe any CMC wall structure that joins a metal substrate 40 and a ceramic barrier layer 38 as described and claimed herein. For example,
While various embodiments of the present invention have been shown and described herein, it will be obvious that such embodiments are provided by way of example only. Numerous variations, changes and substitutions may be made without departing from the invention herein. For example, the honeycomb structure may be a fully infused CMC material, or it may be only partially infused with matrix material so that it is somewhat porous, thereby allowing the infusion of the respective ceramic 38 or metal 40 layers to further strengthen those layers. Alternatively, the sheet 30 may be infused to a different degree than the walls 32 of the honeycomb, such as to allow more interconnection between the cells on respective sides of the sheet but still maintaining a CMC boundary between the ceramic 38 and metal 40 layers. In another embodiment it may be desired to omit the sheet 30 and to form the ceramic 38 to only partially fill the honeycombs, then to complete the fill of the honeycombs with the metal 40. This embodiment maintains the integrity of continuous ceramic fibers extending across the boundary between the metal and its protective ceramic insulating layer, thereby improving the bonding there between.
Claims
1. An apparatus comprising:
- a metal substrate;
- a ceramic thermal barrier;
- a ceramic matrix composite (CMC) anchor between the metal substrate and the ceramic thermal barrier, wherein the CMC anchor extends into and interlocks with the ceramic thermal barrier, and extends into and interlocks with the metal substrate.
2. The apparatus of claim 1 wherein the CMC anchor comprises first and second arrays of cells with open distal ends on respective first and second sides of a CMC separation sheet, wherein transverse passages are formed in walls between at least some of the cells of the first array.
3. The apparatus of claim 2, wherein the ceramic thermal barrier is deposited into the cells and through the passages of the first array, thus interlocking the ceramic thermal barrier with the cells of the first array.
4. The apparatus of claim 3, wherein the ceramic thermal barrier extends beyond the cells of the first array forming a ceramic wall across the distal ends of the cells of the first array.
5. The apparatus of claim 3, further comprising passages formed in walls between at least some of the cells of the second array, and wherein the metal substrate is deposited into the cells and passages of the second array, thus interlocking the metal substrate with the cells of the second array.
6. The apparatus of claim 5, wherein the metal structure extends beyond the cells of the second array forming a metal wall across the distal ends of the cells of the second array.
7. The apparatus of claim 6, wherein clearance is formed between the metal substrate and the walls of the cells of the second array.
8. The apparatus of claim 1, wherein the metal substrate is attached to the CMC anchor by depositing molten metal for the metal substrate into the CMC anchor and through passages in walls of the CMC matrix.
9. The apparatus of claim 1, wherein the CMC anchor comprises portions extending into the metal substrate, and said portions comprise passages that interlock the CMC anchor with the metal substrate without metallurgical bonding.
10. The apparatus of claim 1, wherein the ceramic thermal barrier and the metal substrate are separated from each other within the CMC anchor by a void.
11. The apparatus of claim 1, wherein the ceramic thermal barrier and the metal substrate are separated from each other within the CMC anchor by a compliant ceramic buffer.
12. The apparatus of claim 11, wherein the compliant buffer comprises ceramic fiber felt.
13. The apparatus of claim 1, wherein the ceramic thermal barrier and the metal substrate contact each other within the CMC anchor along a diffusion zone in which the metal substrate is partially diffused into the ceramic thermal barrier.
14. The apparatus of claim 1, wherein the CMC anchor comprises portions extending through the metal substrate and attached to a back side of the metal substrate.
15. The apparatus of claim 14, wherein the extending portions are attached to the back side of the metal substrate by brazing across transverse passages in the extending portions.
16. The apparatus of claim 14, wherein the extending portions are attached to the back side of the metal substrate by mechanical attachment across transverse passages in the extending portions.
17. An apparatus comprising:
- a ceramic matrix composite (CMC) honeycomb comprising cell walls extending in a first direction into a metal substrate and cell walls extending in an opposite direction into a ceramic thermal barrier;
- at least one transverse passage formed in at least one of the cell walls extending into the metal substrate, interlocking the metal substrate with the honeycomb; and
- at least one transverse passage formed in at least one of the cell walls extending into the ceramic thermal barrier, interlocking the ceramic thermal barrier with the honeycomb.
18. The apparatus of claim 17, further comprising a CMC separation sheet between the cell walls extending in the first direction and the cell walls extending in the opposite direction.
19. The apparatus of claim 18, wherein the metal substrate fills cells of the honeycomb on a first side of the separation sheet, and the ceramic thermal barrier fills cells of the honeycomb on a second side of the separation sheet.
Type: Application
Filed: Apr 24, 2008
Publication Date: Jun 14, 2012
Applicant: SIEMENS POWER GENERATION, INC. (Orlando, FL)
Inventors: Douglas A. Keller (Kalamazoo, MI), Jay A. Morrison (Oviedo, FL), Malberto Gonzalez (Orlando, FL), Bonnie D. Marini (Oviedo, FL)
Application Number: 12/108,708
International Classification: B32B 3/12 (20060101); B32B 18/00 (20060101); B32B 7/04 (20060101); B32B 15/04 (20060101); B32B 3/30 (20060101); B32B 3/26 (20060101);