PLATING METHOD USING INTAGLIO PROCESSING
Disclosed is a plating method using etching during surface treatment of a material, including: forming a nickel plating layer on the surface of an original material; masking a masking jig in a form of a plate on which a graphic is engraved on the nickel plating layer; etching the masked nickel plating layer; removing the masking jig from the nickel plating layer; and forming a chromium plating layer on the etched nickel plating layer, in which a desired graphic is engraved without deterioration of appearance, corrosion resistance, abrasion resistance and the like.
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This application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2012-50167, filed on May 11, 2012, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to a plating method for surface processing methods of materials, and more particularly, to a plating method of etching a nickel plating layer by various processes such as acid treatment, sand blasting or the like, and forming a typical plating layer such as a microporous (MP) nickel plating layer, a chromium plating layer and the like on the etched nickel plating layer, thereby engraving a graphic without deterioration of quality, such as appearance, corrosion resistance, abrasion resistance and the like.
2. Description of the Related Art
Producing an industrial product is often executed by stocking raw materials, injection molding, plating, painting/assembling and shipping. Plating is a surface treatment process in which a material is covered with a thin layer of another material to improve the surface state of the material, and usually includes applying a thin layer of metal on the surface of the material. Through the plating process, corrosion resistance, abrasion resistance and the like of the material may be improved and effects such as gloss, material smoothness and the like may be generated.
Furthermore, in order to provide a glossy and smooth material, various kinds of plating methods have been used, and particularly, chromium plating due to a high degree of hardness, an increased gloss effect and less tendency to become discolored. In addition, chromium plating has high abrasion resistance, and thus has been widely used for hard chromium plating (industrial chromium plating) in mechanical parts, metal molds, tools and the like.
Moreover, a method of using a glossy or non-glossy nickel plating layer to select whether the chromium plating has gloss or not has been used, and
The glossy or non-glossy chromium plating method of an original material such as Acrylonitrile-Butadiene-Styrene (ABS) resins in the conventional art is generally performed by a chemical plating method and an electroplating method. The chemical plating method is a method of plating by dipping a material in a chemical plating solution through which electric current does not flow. The electroplating method is a method of using precipitation by electrolysis to cover the surface of the material with another metal.
To perform the glossy or non-glossy chromium plating method, an original material (A) is first processed, and then a chemical plating method is used to perform an etching and activation treatment to secure the adhesion between the original material (A) and a plating layer. Further, etching is a process of degreasing a material, washing the material with acid, and then dipping the material in acid for a short period of time to remove an oxide film on a metal surface invisible to the naked eye. The activation treatment is a process of destroying the passivation on the surface of the material, or a process of adsorbing a catalyst metal on the surface of the material to perform an electroless plating on a non-metal foundation and is usually performed as a pre-treatment of plating.
Thereafter, a chemical nickel plating layer (B) having a thickness of about 0.2 μm to 0.4 μm is formed to provide conductivity for electroplating. The chemical plating method is followed by an electroplating method, including (C) a copper plating layer having a thickness of about 10 μm to 30 μm to be a buffer to absorb shock, (D) a semi-glossy nickel plating layer having a thickness of about 10 μm to 20 μm for corrosion prevention, (E) a “glossy” or “non-glossy” nickel plating layer having a thickness of about 8 μm to 12 μm for “glossy” or “non-glossy” effects, corrosion prevention and low potential, (F) an MP nickel plating layer having a thickness of about 0.8 μm to 1.2 μm for dispersion of corrosion current, and (G) a chromium plating layer having a thickness of about 0.15 μm to 0.5 μm for increasing corrosion resistance and abrasion resistance.
Moreover, when the nickel plating layer (E) having a thickness of about 8 μm to 12 μm (E) is “glossy”, the method is classified as a glossy chromium plating method, whereas when the layer is “non-glossy”, the method is classified as a non-glossy chromium plating method.
Further, as the copper plating layer (C) and the MP nickel plating layer (F) are included in the entire plating layer, the overall physical properties of the plating are further improved.
However, when an intaglio processing is performed on the surface of a material made by a glossy or non-glossy chromium plating method in the related art to implement any graphic, the chromium plating layer (G) or the MP nickel plating layer (F) is damaged by the intaglio processing and as a result, corrosion resistance, abrasion resistance and the like deteriorate, and particularly, when the chromium plating layer (G) is a chromium plating layer (G) to which a color effect is imparted, such as a white chromium plating layer, a dark chromium plating layer or the like, the chromium plating layer is partially or entirely damaged by the intaglio processing, thereby not providing desired color effect or a durable product quality.
In addition, recently, the glossy or non-glossy chromium plating method in the related art has a limitation on an attempt to make products differentiated from each other because it is only determined whether there is gloss and the degree of gloss or non-gloss in a graphic is not controlled.
SUMMARY OF THE INVENTIONThe present invention provides a plating method of etching a nickel plating layer, and forming a typical plating layer on the etched nickel plating layer, thereby implementing a graphic without damaging the nickel plating layer, and implementing a graphic of which brightness is controlled by an etched thickness of the nickel plating layer.
An exemplary embodiment of the present invention provides a plating method using a multi-layer nickel intaglio (e.g., etching) processing, including: forming a copper plating layer and a semi-glossy nickel plating layer on a surface of an original material, forming a glossy nickel plating layer on the semi-glossy nickel plating layer, forming a non-glossy nickel plating layer on the glossy nickel plating layer, masking a masking jig in a form of a plate on which a graphic is engraved on the non-glossy nickel plating layer, etching the masked non-glossy nickel plating layer, removing the masking jig from the non-glossy nickel plating layer, forming an MP (microporous) nickel plating layer on the etched non-glossy nickel plating layer, and forming a chromium plating layer on the MP nickel plating layer.
Another exemplary embodiment of the present invention provides a plating method using a multi-layer nickel intaglio processing, including: forming a copper plating layer and a semi-glossy nickel plating layer on a surface of an original material, forming a non-glossy nickel plating layer on the semi-glossy nickel plating layer, forming a glossy nickel plating layer on the non-glossy nickel plating layer, masking a masking jig in a form of a plate on which a graphic is engraved on the glossy nickel plating layer, etching the masked glossy nickel plating layer, removing the masked jig from the glossy nickel plating layer, forming an MP nickel plating layer on the etched glossy nickel plating layer, and forming a chromium plating layer on the MP nickel plating layer.
The intaglio processing may be an acid treatment or sand blasting process.
In a surface treatment method, the plating method using the intaglio processing according to the present invention may implement a desired graphic without deterioration of appearance, corrosion resistance, abrasion resistance and the like by etching a nickel plating layer rather than etching the surface of a material, and then forming a typical plating layer on the etched nickel plating layer.
Considering the significance of product appearance in the product selection criteria of consumers, as the brightness of a graphic is controlled by an etched thickness of a nickel plating layer, the marketability is increased and the image of the product is improved and the quality of the product is enhanced, thereby obtaining an effect capable of constructing a differentiated brand image.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Unless specifically stated or obvious from context, as used herein, the term “about” is understood as within a range of normal tolerance in the art, for example within 2 standard deviations of the mean. “About” can be understood as within 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, 0.1%, 0.05%, or 0.01% of the stated value. Unless otherwise clear from the context, all numerical values provided herein are modified by the term “about.”
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
The plating method using the intaglio processing (e.g., etching) according to the present invention implements a graphic without deteriorating the material appearance, corrosion resistance, abrasion resistance and the like by etching a nickel plating layer, such as a single layer nickel plating layer or a multi layer nickel plating layer.
Furthermore, the graphic may be various visual shapes including a drawing, a figure, a character and the like, and the multi layer nickel may be a nickel plating layer in which two to three layers having different sulfur contents overlap.
In addition, the intaglio processing may include typical intaglio processing methods used in the art, such as a mechanical intaglio processing, a chemical intaglio processing and the like. The mechanical intaglio processing may include polishing and the like using sand blasting or various devices, and the chemical intaglio processing may include an acid treatment using various acid solutions applied on the surface of a material, various chemical treatments or the like. The acid treatment is a collective term for chemical treatment using acid and may use acid to dissolve a plating layer, and the sand blasting may be a type of jet machining, and is a method of polishing the surface of a material, removing rust and the like by blasting a grid glass sphere having a small diameter, silicone, sea sand and the like in the air or dropping the grid glass sphere and the like by gravitational force.
According to, the thickness of an etched nickel plating layer in the present invention, a 50% to 70% nitric acid solution may be applied for about 5 minutes to 10 minutes for acid treatment, and in sand blasting, about 10 g/cm2 to 200 g/cm2 at a pressure of 1 kgf/cm2 to 10 kgf/cm2 of sand having a diameter of about 1 mm to 10 mm may be used. However, in acid treatment, it may be possible to use an acid solution having different concentrations, such as sulfuric acid and the like other than the 50% to 70% nitric acid solution. Similarly, in sand blasting, it may be possible to use various grid glass spheres and the like other than sand. In other words, the conditions are sufficiently variable depending on factors such as the thickness of an etched nickel plating layer.
Furthermore, the single layer nickel plating layer may be a glossy nickel plating layer; a semi-glossy nickel plating layer; a non-glossy nickel plating layer; or the like, and the multi-layer nickel plating layer may include a nickel plating layer with a multi-layer structure by combination various nickel plating layers having different degrees of gloss such as a semi-glossy nickel plating layer and a glossy nickel plating layer formed on the semi-glossy nickel plating layer; a semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer; a semi-glossy nickel plating layer, a glossy nickel plating layer formed on the semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the glossy nickel plating layer; a semi-glossy nickel plating layer, a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer and a glossy nickel plating layer formed on the non-glossy nickel plating layer; or the like.
In other words, as illustrated in
However, the plating method according to the present invention may prevent deterioration of appearance, corrosion resistance, abrasion resistance and the like etching a single-layer nickel plating layer such as a nickel plating layer, that is, a glossy nickel plating layer; a semi-glossy nickel plating layer; a non-glossy nickel plating layer; or the like or etching multi-layer nickel plating layer, and forming a typical plating layer on the etched nickel plating layer. The typical plating layer may be a chromium plating layer, and may include an MP nickel plating layer, a chromium plating layer formed on the MP nickel plating layer and the like.
As shown in
The nickel plating layer in
Furthermore, a masking jig 300 in the form of a plate on which a graphic (e.g., English character, SAMPLE in the present drawing) may be engraved on the nickel plating layer may be used to perform masking (a second step, a).
In addition, an intaglio processing method such as acid treatment, sand blast or the like is used to subject the masked nickel plating layer to intaglio processing (a third step, b). When the masking jig 300 is removed, the etched nickel plating layer may be exposed along the engraved portion of the masking jig 300 (a fourth step, c).
Thereafter, a chromium plating layer 160 may be formed on the etched nickel plating layer, and to disperse corrosion current, an MP nickel plating layer 150 may be formed on the etched nickel plating layer, and a chromium plating layer 160 and the like may be formed (a fifth step, d).
Moreover, the MP nickel plating layer 150 and the chromium plating layer 160 may have a substantially small thickness, and thus do not affect the exposure of the non-glossy nickel plating layer 140 on which the graphic is engraved, and a plating on which a graphic is engraved on a non-glossy background may be completed by etching the non-glossy nickel plating layer 140, and forming a typical plating layer. Accordingly, a desired graphic may be engraved by etching without deterioration of appearance, corrosion resistance, abrasion resistance and the like.
In other words, as illustrated in
However, the plating method according to the present invention implements a graphic without deterioration of appearance, corrosion resistance, abrasion resistance and the like by etching a single-layer nickel plating layer such as a nickel plating layer, that is, a glossy nickel plating layer; a semi-glossy nickel plating layer; a non-glossy nickel plating layer; or the like or etching the multi-layer nickel plating layer, and forming a typical plating layer on the etched nickel plating layer. The typical plating layer may be a chromium plating layer, and may include an MP nickel plating layer, a chromium plating layer formed on the MP nickel plating layer and the like.
As shown in
The nickel plating layer in
Furthermore, a masking jig 300 in the form of a plate on which a graphic (e.g., English character, SAMPLE in the present drawing) may be engraved on the nickel plating layer may be used (a second step, a). An etching method such as acid treatment, sand blasting or the like may be used to etch the masked nickel plating layer (a third step, b). When the masking jig 300 is removed, the etched nickel plating layer may be exposed along the engraved portion of the masking jig 300 (a fourth step, c).
Thereafter, a chromium plating layer 260 may be formed on the etched nickel plating layer, and to disperse corrosion current, an MP nickel plating layer 250 may be formed on the etched nickel plating layer, and a chromium plating layer 260 and the like may be formed (a fifth step, d).
Moreover, the MP nickel plating layer 250 and the chromium plating layer 260 may have substantially small thicknesses, and thus do not affect the exposure of the non-glossy nickel plating layer 230 on which the graphic is engraved, and a plating on which a graphic is engraved on a glossy background may be completed by etching the non-glossy nickel plating layer 230, and forming a typical plating layer. Accordingly, a desired graphic may be engraved by etching without deterioration of appearance, corrosion resistance, abrasion resistance and the like.
Accordingly, the plating method of the present invention may implement a graphic in which gloss and non-gloss are contrasted to impart significant differentiation to the appearance of a product unlike a glossy or non-glossy chromium plating method in the related art. Furthermore, the method may be applied to implement a graphic in which various combinations of semi-gloss and gloss, semi-gloss and dark gloss, non-gloss and dark gloss, or the like are contrasted on the plating.
Specifically, to implement a graphic in which semi-gloss and gloss are contrasted on a plating, a copper plating layer and a semi-glossy nickel plating layer may be formed on the surface of an original material (e.g., foundation). Thereafter, when a glossy nickel plating layer is formed on the semi-glossy nickel plating layer, and the glossy nickel plating layer is etched, the semi-glossy nickel plating layer may be exposed. In addition, when an MP nickel plating layer is formed on the etched glossy nickel plating layer, and a chromium plating layer is formed, a graphic in which semi-gloss and gloss are contrasted may be implemented on the plating.
Further, to implement a graphic in which semi-gloss and dark gloss are contrasted on a plating, a copper plating layer and a semi-glossy nickel plating layer may be formed on the surface of an original material (e.g., foundation). Thereafter, when a dark glossy nickel plating layer is formed on the semi-glossy nickel plating layer, and the dark glossy nickel plating layer is etched, the semi-glossy nickel plating layer may be exposed. In addition, when an MP nickel plating layer is formed on the etched dark glossy nickel plating layer, and a chromium plating layer is formed, a graphic in which semi-gloss and dark gloss are contrasted may be implemented on a plating.
Moreover, to obtain a plating on which a dark glossy graphic is implemented on a non-glossy background, a copper plating layer and a semi-glossy nickel plating layer may be formed on the surface of an original material (e.g., foundation). Thereafter, a dark glossy nickel plating layer may be formed on the semi-glossy nickel plating layer, and a non-glossy nickel plating layer may be formed thereon. Moreover, when the non-glossy nickel plating layer is etched, the dark glossy nickel plating layer may be exposed, and when an MP nickel plating layer is formed on the etched non-glossy nickel plating layer, and a chromium plating layer is formed thereon, a plating on which a dark glossy graphic is implemented on a non-glossy background may be completed.
In addition, to obtain a plating on which a non-glossy graphic is implemented on a dark glossy background, a copper plating layer and a semi-glossy nickel plating layer may be formed on the surface of an original material (e.g., foundation). Thereafter, a non-glossy nickel plating layer may be formed on the semi-glossy nickel plating layer, and a dark glossy nickel plating layer may be formed thereon. Moreover, when the dark glossy nickel plating layer is etched, the non-glossy nickel plating layer may be exposed, and when an MP nickel plating layer is formed on the etched dark glossy nickel plating layer, and a chromium plating layer is formed thereon, a plating on which a non-glossy graphic is implemented on a dark glossy background may be completed.
In other words, according to the present invention, various visual effects may be displayed on the surface of a product by performing a plating method having various combinations according to the characteristics of gloss, thereby improving marketability.
Claims
1. A plating method for covering a surface of a material with a metal by etching, comprising:
- forming a nickel plating layer on a surface of an original material;
- masking a masking jig as a plate on which a graphic is engraved on the nickel plating layer;
- etching the masked nickel plating layer;
- removing the masking jig from the nickel plating layer; and
- forming a chromium plating layer on the etched nickel plating layer.
2. The method of claim 1, wherein the etching uses an acid treatment or sand blasting.
3. The method of claim 1, wherein the forming a nickel plating layer further includes forming a copper plating layer on the surface of the original material, and forming a nickel plating layer on the copper plating layer.
4. The method of claim 1, wherein the forming a chromium plating layer further includes forming a microporous nickel plating layer on the etched nickel plating layer, and forming a chromium plating layer on the microporous nickel plating layer.
5. The method of claim 4, wherein the forming a nickel plating layer further includes forming a copper plating layer on the surface of the original material.
6. The method of claim 1, wherein the nickel plating layer is selected from a group consisting of: a glossy nickel plating layer, a semi-glossy nickel plating layer, and a non-glossy nickel plating layer.
7. The method of claim 1, wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a glossy nickel plating layer formed on the semi-glossy nickel plating layer.
8. The method of claim 1, wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer.
9. The method of claim 1, wherein the nickel plating layer comprises a semi-glossy nickel plating layer a glossy nickel plating layer formed on the semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the glossy nickel plating layer.
10. The method of claim 1, wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer and a glossy nickel plating layer formed on the non-glossy nickel plating layer.
Type: Application
Filed: Dec 21, 2012
Publication Date: Nov 14, 2013
Applicant: Hyundai Motor Company (Seoul)
Inventor: Chang-Sup Lee (Hwasung)
Application Number: 13/724,569
International Classification: C25D 5/40 (20060101);
