Abstract: A display panel includes: a first substrate having a top surface and a side surface, the top surface including a display area and a non-display area outside the display area; a second substrate facing the first substrate; a first insulating structure disposed between the second substrate and the first substrate, wherein the first insulating structure overlaps the non-display area without overlapping the display area; an organic light emitting diode between the first substrate and the second substrate and overlapping the display area; a thin film encapsulation layer on the organic light emitting diode; a signal line having a side surface substantially aligned with the side surface of the first substrate, wherein the signal line is disposed on the first substrate; a second insulating structure overlapping the signal line and disposed between the first substrate and the first insulating structure, wherein the second insulating structure has a side surface substantially aligned with the side surface of the first

Abstract: A method of providing a workpiece with an anodised aluminium surface with varying colour. The anodised surface is added colour, such as evenly, so that a colour concentration profile exists through the depth, where after a portion of the outer layer is removed to arrive at colour corresponding to a particular depth.

Abstract: A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

Abstract: Techniques and mechanisms for providing effective connectivity with surface level microbumps on an integrated circuit package substrate. In an embodiment, different metals are variously electroplated to form a microbump which extends through a surface-level dielectric of a substrate to a seed layer including copper. The microbump includes a combination of tin and zinc that mitigates precipitation of residual copper by promoting the formation of miconstituents in the microbump. In another embodiment, the microbump has a mass fraction of zinc, or a mass fraction of tin, that is different in various regions along a height of the microbump.

Abstract: An interconnection structure fabrication method is provided. The method includes providing a substrate; forming a conductive film with a first thickness and having a first lattice structure and a first grain size, wherein the first thickness is greater than the first grain size; and performing an annealing process to change the first lattice structure of the conductive film to a second lattice structure and to change the first grain size to a second grain size. The second grain size is greater than the first grain size, and the first thickness is greater than or equal to the second grain size. The method also includes etching portion of the conductive film to form at least one conductive layer; etching portion of the conductive layer to form at least one trench having a depth smaller than the first thickness in the conductive layer to form an electrical interconnection wire and conductive vias; and forming a dielectric layer covering the substrate, sidewalls of the conductive layer, and the trench.

Abstract: Hybrid rotor bar assemblies and electric motors having hybrid rotor bar assemblies are disclosed, as are other aspects. The hybrid rotor tar assemblies have rotor bars lined with shims. The rotor bars can be copper rotor bars. In certain aspects, the shim may be about one fourth to about one eighth of a thickness of the rotor bar. Also disclosed are electric motors with shims lining the rotor bars and functioning as secondary rotor bars.

Abstract: A coating for protecting a base material from wear and corrosion includes a first layer deposited directly onto an outer surface of the base material. In addition, the coating includes a second layer deposited directly onto the first layer. The first layer is positioned between the base material and the second layer. The first layer includes chromium having a first micro-crack density and the second layer comprises chromium having a second micro-crack density that is less than the first micro-crack density.

Abstract: The present invention relates to a textured substrate for epitaxial film formation, comprising a textured metal layer at least on one side, wherein the textured metal layer includes a copper layer having a cube texture and a nickel layer having a thickness of 100 to 20000 nm formed on the copper layer; the nickel layer has a nickel oxide layer formed on a surface thereof, having a thickness of 1 to 30 nm, and including a nickel oxide; and the nickel layer further includes a palladium-containing region formed of palladium-containing nickel at an interface with the nickel oxide layer. The top layer of the textured substrate, i.e. the nickel oxide layer, has a surface roughness of preferably 10 nm or less.

Abstract: Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.

Abstract: A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.

Abstract: A mirror film including a support, a plating undercoat polymer layer containing reduced metal particles, a reflective layer containing silver, and a resin protective layer, in this order. A surface roughness Ra of a surface of the reflective layer containing silver at a resin protective layer side is 20 nm or less.

Abstract: Methods of providing a corrosion-resistant plating on a steel bumper are provided. A galvanized zinc layer is deposited over a steel substrate. A plurality of nickel layers is deposited over the zinc layer. The plurality of zinc layers has at least a first porosity and a second porosity. A chrome layer is applied over the plurality of nickel layers. The porous nickel layer is immediately adjacent the chrome layer such that a stress applied to the chrome layer is distributed over the porous nickel layer. The porous nickel layer delocalizes a stress applied at an impact area to a dispersed area and the dispersed area is larger than the impact area.

Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.

Abstract: An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film is formed on a base material, and the method includes the steps of forming a film composed of copper particulates on a base material, subjecting the film to photo sintering, and applying plating to the photo-sintered film. Whereby, it is possible to form a conductive film on a base material by lowering irradiation energy of light in photo sintering even when the base material has low heat resistance. Since the conductive film includes a plated layer, electric resistance decreases.

Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.

Abstract: The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.

Abstract: An electrical interconnect is disclosed that includes a first portion configured to be secured to a first terminal of a first electrochemical cell, wherein the first portion comprises a first conductive material, and a second portion configured to be secured to a second terminal of a second electrochemical cell, wherein the second portion comprises a second conductive material; wherein the first conductive material is different than the second conductive material. A method of manufacturing an electrical interconnect is also disclosed.

Abstract: A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided.

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Abstract: The invention relates to a method for producing a noble metal/metal layer, which has particularly advantageous tribological properties, comprising the following steps: providing a bath for the currentless deposition of a metal layer, which additionally contains at least one type of noble metal ions; introducing a substrate into the bath; and applying a voltage.

Abstract: Disclosed is process for producing a protective layer for protecting a component against high temperatures and aggressive media. The process comprises forming a surface layer comprising aluminum and chromium on a surface of the component to be provided with the protective layer by chromizing and alitizing. The chromizing and/or the alitizing in different regions of the component surface to be protected is carried out simultaneously but differently to result in a protective layer that has different regions.

Abstract: Disclosed is a coating for protecting a component against high temperatures and aggressive media, which coating has at least one subregion whose main constituent is chromium. The layer additionally comprises aluminum, the chromium content at least in the subregion in which chromium is the main constituent being greater than 30% by weight and the aluminum content being greater than or equal to 5% by weight. The invention further provides a process for producing such a coating, comprising chromizing the surface to be coated and subsequently alitizing the chromium-rich layer produced during chromizing.

Abstract: An electrode including a first layer having a sintered product of a metallic glass and a first conductive material, and a second layer including a second conductive material plated using the first layer as a seed layer, a method of manufacturing the same, and an electronic device including the electrode.

Abstract: Disclosed is a plating method using etching during surface treatment of a material, including: forming a nickel plating layer on the surface of an original material; masking a masking jig in a form of a plate on which a graphic is engraved on the nickel plating layer; etching the masked nickel plating layer; removing the masking jig from the nickel plating layer; and forming a chromium plating layer on the etched nickel plating layer, in which a desired graphic is engraved without deterioration of appearance, corrosion resistance, abrasion resistance and the like.

Abstract: Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.

Abstract: Provided is a copper-clad laminate comprising a metal conductor layer formed by dry plating and/or wet plating on a surface obtained by subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa. Further provided is a copper-clad laminate comprising a liquid crystal polymer film having a surface roughness after the plasma treatment of 0.15 ?m or less in terms of arithmetic mean roughness Ra and 0.20 ?m or less in terms of root-mean-square roughness Rq. Further provided is a method for manufacturing a copper-clad laminate, wherein a metal conductor layer is formed by dry plating and/or wet plating after subjecting a surface of a liquid crystal polymer film to plasma treatment in an oxygen atmosphere or a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa.

Abstract: A method for depositing an aluminizing coating onto a substrate. The method includes: (a) depositing a layer, containing platinum and at least 35% of nickel, onto a surface of the substrate; and (b) depositing an aluminum coating onto the layer.

Abstract: Provided is a method of producing a two-layered copper-clad laminate with improved folding endurance, wherein the two-layered copper-clad laminate retains folding endurance of 150 times or more measured with a folding endurance test based on JIS C6471 by subjecting the laminate in which a copper layer is formed on a polyimide film through sputtering and plate processing to heat treatment at a temperature of 100° C. or more but not exceeding 175° C. Specifically, provided are a method of producing a two-layered copper-clad laminate (two-layered CCL material) in which a copper layer is formed on a polyimide film through sputtering and plate processing, wherein the rupture of the outer lead part of a circuit can be prevented due to the improvement in folding endurance; and a two-layered copper-clad laminate obtained from the foregoing method.

Abstract: A housing of electronic device includes a metallic substrate, a copper layer formed on the metallic substrate, and a heat dissipation layer formed on the copper layer. A method for manufacturing the housing is also provided.

Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.

Abstract: Methods of providing a corrosion-resistant plating on a steel bumper are provided. A galvanized zinc layer is deposited over a steel substrate. A plurality of nickel layers is deposited over the zinc layer. The plurality of zinc layers has at least a first porosity and a second porosity. A chrome layer is applied over the plurality of nickel layers. The porous nickel layer is immediately adjacent the chrome layer such that a stress applied to the chrome layer is distributed over the porous nickel layer. The porous nickel layer delocalizes a stress applied at an impact area to a dispersed area and the dispersed area is larger than the impact area.

Abstract: A coated article includes a substrate, a Ni layer formed on the substrate, and a vacuum coated layer formed on the Ni layer. The vacuum coated layer is made of material selected from a group consisting of Al, Ti, Cr and Zn. A method for manufacturing an article is also provided.

Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.

Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and radio subsystems such as antennas and filters. The novel structures are fabricated by electroplating the required structure over a mold, housing, or substrate. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.

Abstract: A pretreatment composition for metal that provides enhanced corrosion resistance, enhanced paint adhesion and reduced chip damage to a wide variety of metal substrates. The pretreatment is also cleaner because it is based on zirconium rather than zinc phosphates. The pretreatment coating composition in use preferably comprises 50 to 300 parts per million (ppm) zirconium, 0 to 100 ppm of SiO2, 150-2000 ppm of total fluorine and 10-100 ppm of free fluorine, 150 to 10000 ppm of zinc and 10 to 10000 ppm of an oxidizing agent and has a pH of 3.0 to 5.0, preferably about 4.0. The coating composition can optionally include 0 to 50 ppm of copper. The suitable oxidizing agents can be selected from a large group.

Abstract: The invention relates to a method of providing an electric current taker made from silver and having a highly electroconductive contact surface into an aluminium support bar to be used in electrolysis.

Abstract: A method of making a biochemical test strip is disclosed which comprises the step of providing a substrate; the step of forming a metalizable primer on the area in which a circuit layout being to be formed; the step of forming a metal layer on the metalizable primer to form the circuit layout; using the substrate having the circuit layout to form the biochemical test strip.

Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Abstract: A method for electroplating titanium alloy coating into plastic and carbon foam comprises the steps of activating the given specimen, deposition of electroless nickel and electroplating process of titanium alloy to the surface of the specimen. The electroplating process of electroplating titanium alloy coating includes a direct current method and a pulse plating method. The direct current method characterized by lager sized grains and the pulse plating method characterized by smaller sized grains. The advantages of proposed electroplating processes are: a) low cost, b) very broad applications and c) relatively low number of the process steps. Unique combination of physical, mechanical and chemical properties makes the electroplating methods of titanium coating an attractive technology for medicine, biotechnology, sports, defense, aeronautic, and auto industries.

Abstract: A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.

Abstract: A method for producing electrical components for electrical contacts, and such a component are provided. To achieve simpler production of a partial surface treatment, which likewise exhibits optimal current carrying capacity, with minimum material use of noble metals, the entirety of the components are provided with an electrically insulating passivation layer, and the passivation is then removed chemically or mechanically at the contact points of the components. The entire components are put into an electrolytic bath, and a noble metal is deposited only on the parts of the components from which the passivation layer has been removed.

Abstract: The invention relates to a process for the treatment of parts for creating a surface with areas with shiny and matte appearances, in which on the surface previously coated with a first layer of copper and a second layer of metal a selective etching of the second layer is performed, wherein the selective etching of the second layer is performed according to the area or areas to be glazed with respect to the rest of the part. The process allows a finish with areas of a different shine (from mirror shine to matte), the differences in thickness of which cannot be observed by the human eye without optical aids.

Abstract: A method of forming a metal film, the method including: (a) forming a primer layer on a substrate by applying a first polymer including a unit having a cyano group in a side chain; (b) forming a polymer layer on the surface of the primer layer by applying a second polymer, the second polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof and a polymerizable group; (c) applying the electroless plating catalyst or the precursor thereof to the polymer layer; and (d) forming a metal film on the polymer layer by performing electroless plating.

Abstract: A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu—Sn alloy layer onto the second copper layer from a Cu—Sn electroplating solution; and electroplating a chromium layer onto the Cu—Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.

Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: Improved battery materials, and a process for producing such improved battery materials are disclosed. The materials and methods employ battery components based on porous lightweight non woven substrate materials that are coated with dispersions comprised of carbon nanotubes, conductive secondary particles (usually with an approximate diameter between about 0.5 nm to 100 microns), a binder and a solvent. The dispersions permeate the substrate's pores, and when cured, the carbon nanotubes form conductive bridges between the conductive secondary particles, and these in turn are held on the substrate by the binder. The net effect is to increase the battery's total active material and energy density. The permeated substrate may then be further treated to achieve the desired conductivity as needed. These materials and methods can produce improved lead acid and silver zinc batteries, as well as other types of batteries.

Abstract: An electrochemical deposition method to form uniform and continuous Group IIIA material rich thin films with repeatability is provided. Such thin films are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, the Group IIIA material rich thin film is deposited on an interlayer that includes 20-90 molar percent of at least one of In and Ga and at least 10 molar percent of an additive material including one of Cu, Se, Te, Ag and S. The thickness of the interlayer is adapted to be less than or equal to about 20% of the thickness of the Group IIIA material rich thin film.

Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.