MULTI-LAYER INSULATION COMPOSITE MATERIAL HAVING AT LEAST ONE THERMALLY-REFLECTIVE LAYER WITH THROUGH OPENINGS, STORAGE CONTAINER USING SAME, AND RELATED METHODS
In an embodiment, a multi-layer insulation (MLI) composite material includes a first thermally-reflective layer and a second thermally-reflective layer spaced from the first thermally-reflective layer. At least one of the first or second thermally-reflective layers includes a plurality of through openings configured to at least partially obstruct transmission therethrough of infrared electromagnetic radiation having a wavelength greater than a threshold wavelength. A region between the first and second thermally-reflective layers impedes heat conduction between the first and second thermally-reflective layers. Other embodiments include a storage container including a container structure that may be at least partially formed from such MLI composite materials, and methods of using such MLI composite materials.
Latest Tokitae LLC Patents:
- NUCLEIC ACID AMPLIFICATION TESTING DEVICES AND METHODS
- Micromolded or 3-D printed pulsatile release vaccine formulations
- Temperature-controlled portable cooling units
- Ingestible RFID tag and reader system
- Device for rapid detection of tuberculosis-lipoarabinomannan (TB-LAM) with enhanced sensitivity
The present application is related to U.S. patent application Ser. No. 12/152,467 entitled MULTI-LAYER INSULATION COMPOSITE MATERIAL INCLUDING BANDGAP MATERIAL, STORAGE CONTAINER USING SAME, AND RELATED METHODS, naming Jeffrey A. Bowers, Roderick A. Hyde, Muriel Y. Ishikawa, Edward K. Y. Jung, Jordin T. Kare, Eric C. Leuthardt, Nathan P. Myhrvold, Thomas J. Nugent Jr., Clarence T. Tegreene, Charles Whitmer, and Lowell L. Wood Jr. as inventors, filed on May 13, 2007, and incorporated herein by this reference in its entirety.
The present application is related to U.S. patent application Ser. No. 12/152,465 entitled STORAGE CONTAINER INCLUDING MULTI-LAYER INSULATION COMPOSITE MATERIAL HAVING BANDGAP MATERIAL AND RELATED METHODS, naming Jeffrey A. Bowers, Roderick A. Hyde, Muriel Y. Ishikawa, Edward K. Y. Jung, Jordin T. Kare, Eric C. Leuthardt, Nathan P. Myhrvold, Thomas J. Nugent Jr., Clarence T. Tegreene, Charles Whitmer, and Lowell L. Wood Jr. as inventors, filed on May 13, 2008, and incorporated herein by this reference in its entirety.
The present application is related to U.S. patent application Ser. No. 12/001,757 entitled TEMPERATURE-STABILIZED STORAGE CONTAINERS, naming Roderick A. Hyde, Edward K. Y. Jung, Nathan P. Myhrvold, Clarence T. Tegreene, William H. Gates, III, Charles Whitmer, and Lowell L. Wood, Jr. as inventors, filed on Dec. 11, 2007, and incorporated herein by this reference in its entirety.
The present application is related to U.S. patent application Ser. No. 12/008,695 entitled TEMPERATURE-STABILIZED STORAGE CONTAINERS FOR MEDICINALS, naming Roderick A. Hyde, Edward K. Y. Jung, Nathan P. Myhrvold, Clarence T. Tegreene, William H. Gates, III, Charles Whitmer, and Lowell L. Wood, Jr. as inventors, filed on Jan. 10, 2008, and incorporated herein by this reference in its entirety.
The present application is related to U.S. patent application Ser. No. 12/006,089 entitled TEMPERATURE-STABILIZED STORAGE SYSTEMS, naming Roderick A. Hyde, Edward K. Y. Jung, Nathan P. Myhrvold, Clarence T. Tegreene, William H. Gates, III, Charles Whitmer, and Lowell L. Wood, Jr. as inventors, filed on Dec. 27, 2007, and incorporated herein by this reference in its entirety.
The present application is related to U.S. patent application Ser. No. 12/006,088 entitled TEMPERATURE-STABILIZED STORAGE CONTAINERS WITH DIRECTED ACCESS, naming Roderick A. Hyde, Edward K. Y. Jung, Nathan P. Myhrvold, Clarence T. Tegreene, William H. Gates, III, Charles Whitmer, and Lowell L. Wood, Jr. as inventors, filed on Dec. 27, 2007, and incorporated herein by this reference in its entirety.
The present application is related to U.S. patent application Ser. No. 12/012,490 entitled METHODS OF MANUFACTURING TEMPERATURE-STABILIZED STORAGE CONTAINERS, naming Roderick A. Hyde, Edward K. Y. Jung, Nathan P. Myhrvold, Clarence T. Tegreene, William H. Gates, III, Charles Whitmer, and Lowell L. Wood, Jr. as inventors, filed on Jan. 31, 2008, and incorporated herein by this reference in its entirety.
The present application is related to U.S. patent application Ser. No. 12/077,322 entitled TEMPERATURE-STABILIZED MEDICINAL STORAGE SYSTEMS, naming Roderick A. Hyde, Edward K. Y. Jung, Nathan P. Myhrvold, Clarence T. Tegreene, William Gates, Charles Whitmer, and Lowell L. Wood, Jr. as inventors, filed on Mar. 17, 2008, and incorporated herein by this reference in its entirety.
SUMMARYIn an embodiment, a multi-layer insulation (MLI) composite material includes a first thermally-reflective layer and a second thermally-reflective layer spaced from the first thermally-reflective layer. At least one of the first or second thermally-reflective layers includes a plurality of through openings configured to at least partially obstruct transmission therethrough of infrared electromagnetic radiation (EMR) having a wavelength greater than a threshold wavelength. A region between the first and second thermally-reflective layers substantially impedes heat conduction between the first and second thermally-reflective layers.
In an embodiment, a storage container includes a container structure defining at least one storage chamber. The container structure includes MLI composite material having at least one thermally-reflective layer including a plurality of through openings configured to at least partially obstruct transmission therethrough of infrared electromagnetic radiation having a wavelength greater than a threshold wavelength.
In an embodiment, a method includes at least partially enclosing an object with MLI composite material to insulate the object from an external environment. MLI composite material includes at least one thermally-reflective layer having a plurality of through openings configured to at least partially obstruct transmission therethrough of infrared electromagnetic radiation having a wavelength greater than a threshold wavelength.
The foregoing is a summary and thus may contain simplifications, generalizations, inclusions, and/or omissions of detail; consequently, the reader will appreciate that the summary is illustrative only and is NOT intended to be in any way limiting. Other aspects, features, and advantages of the devices and/or processes and/or other subject matter described herein will become apparent after reading the teachings set forth herein.
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein.
The first and second thermally-reflective layers 102 and 104 may be spaced from each other using, for example, low thermal conductivity spacers that join the first and second thermally-reflective layers 102 and 104 together, electro-static repulsion, or magnetic repulsion. For example, electrical potentials may be applied to the first and second thermally-reflective layers 102 and 104 via electrical circuitry and maintained to provide a controlled electro-static repulsive force, or the first and second thermally-reflective layers 102 and 104 may each include one or more magnetic or electromagnetic elements embedded therein or otherwise associated therewith to provide a magnetic repulsive force.
The first thermally-reflective layer 102, second thermally-reflective layer 104, or both may include a plurality of through openings configured to at least partially obstruct infrared EMR having a wavelength greater than a threshold wavelength. For example, in the illustrated embodiment, the first thermally-reflective layer 102 includes a first plurality of through openings 108 that extend completely through a thickness of the first thermally-reflective layer 102, and the second thermally-reflective layer 104 also includes a second plurality of through openings 110 that extend completely through a thickness of the second thermally-reflective layer 104 and in substantial registry with the first plurality of openings 108. Respective through openings 108 and 110 may have a lateral opening dimension d (e.g., a diameter) proportional to a selected threshold wavelength Infrared EMR having a wavelength greater than the threshold wavelength may be at least partially obstructed by the first and second plurality of through openings 108 and 110. Thus, the lateral opening dimension d defines, in part, the threshold wavelength, and infrared EMR having a wavelength greater than that of the threshold wavelength may be reflected from the first and second thermally-reflective layers 102 and 104. The threshold wavelength is a function of the lateral opening dimension d and may be proportional to the lateral opening dimension d. For example, the threshold wavelength may be equal to n·d, where n is a constant that may be approximately two.
The lateral opening dimension d may exhibit a magnitude falling within the thermal infrared EMR spectrum, which is of most interest to be reflected by the MLI material 100 to provide an efficient insulation material. For example, the lateral opening dimension d may be about 1 μm to about 15 μm (e.g., about 8 μm to about 12 μm) so that transmission of infrared EMR through the MLI composite material 100 having a wavelength greater than about 1 μm to about 15 μm (e.g., about 8 μm to about 12 μm) may be at least partially obstructed. Although respective through openings 108 and 110 are illustrated as being cylindrical in configuration, other configurations may be used, such as a rectangular geometry. Additionally, although in the illustrated embodiment, the through openings 108 and 110 are substantially in registry, in other embodiments, the through openings 108 and 110 may be at least partially out of registry.
In addition to the MLI composite material 100 being configured to at least partially obstruct infrared EMR having a wavelength greater than the threshold wavelength, the magnitude of the lateral dimension d is sufficiently large to allow visible EMR (e.g., about 400 nm to about 700 nm) to be transmitted therethrough over at least part of or substantially all of the visible EMR spectrum. Thus, the first and second plurality of through openings 108 and 110 may be configured to allow transmission of visible EMR therethough so that the MLI composite material 100 is at least partially transparent. Accordingly, when the MLI composite material 100 is disposed in front of an object, the object may be at least partially visible through the various layers of the MLI composite material 100.
In the illustrated embodiment, the first and second plurality of through openings 108 and 110 may be arranged in a substantially non-periodic pattern to minimize diffraction effects of EMR incident on the first and second thermally-reflective layers 102 and 104. In other embodiments, the first and second plurality of through openings 108 and 110 may be arranged in a substantially periodic pattern.
The first and second thermally-reflective layers 102 and 104 may be formed from a variety of different materials, such as an electrically conductive metallic material, an electrically conductive doped semiconductor material, a dielectric material, or an infrared-reflective coating (e.g., an infrared-reflective paint). In an embodiment, the first or second thermally-reflective layers 102 and 104 may be formed from an electrically conductive metallic layer or a doped semiconductor material that is patterned using photolithography or electron-beam lithography and etched to form the through openings 108 or 110 therein. In another embodiment, the first and second thermally-reflective layers 102 or 104 may be formed from dielectric layer that is patterned using a photolithography process or an electron-beam lithography process and etched to define the through openings 108 and 110 therethrough. For example, the dielectric layer may comprise a dielectric material that is substantially transparent to visible EMR, such as a silica-based glass.
As discussed above, the region 106 impedes heat conduction between the first and second thermally-reflective layers 102 and 104. In some embodiments, the region 106 may be at least partially or substantially filled with at least one low-thermal conductivity material. Referring to
In an embodiment, instead of filling the region 106 between the first and second thermally-reflective layers 102 and 104 with a low thermal conductivity material, the region 106 may be at least partially evacuated to reduce heat conduction and convection between the first and second thermally-reflective layers 102 and 104.
Referring to
Referring to
In the illustrated embodiment, the substrates 500 and 506 may be formed from a material that is substantially transparent to visible EMR. In other embodiments, the substrates 500 and 506 may each include through openings (not shown) that have about the same lateral dimension as the through openings 504 and 510 and generally in registry with the through openings 504 and 510.
The first and second layers of materials 502 and 508 may be selected from any of the previously described materials, such as a metallic material, a doped semiconductor material, a dielectric material, or an infrared-reflective coating. For example, in one embodiment, the first thermally-reflective layer 102 may be formed by depositing the first layer of material 502 onto the substrate 500 using a deposition technique (e.g., chemical vapor deposition (CVD), physical vapor deposition (PVD), or another suitable technique) followed by defining the first plurality of through holes using a suitable material removal technique. For example, the first plurality of through openings 504 may be formed using photolithography and etching, electron beam lithography and etching, nanoimprint lithography and etching, focused ion beam milling, or another suitable technique with a sufficient resolution to define feature sizes of about 1 μm to about 15 μm. The second thermally-reflective layer 508 and second plurality of through openings 510 may be formed using the same or similar technique as the first thermally-reflective layer 102.
In some embodiments, the first plurality of through openings 504 may be configured to reflect infrared EMR greater than a first threshold wavelength and the second plurality of through openings 510 may be configured to reflect infrared EMR greater than a second threshold wavelength. In such an embodiment, the MLI composite material 100 may be configured to block infrared EMR over a range of wavelengths that would be difficult to block using a single type of bandgap material.
Infrared EMR having a polarization direction generally perpendicular to the respective lengths 708 and 714 of the corresponding elongated through slots 704 and 710 and a wavelength greater than a threshold wavelength that is a function of the respective widths 706 and 712 is at least partially obstructed so that transmission through the elongated through slots 704 and 710 is reduced and, in some embodiments, substantially prevented. Infrared EMR having a polarization direction generally parallel to the respective lengths 708 and 714 of the corresponding elongated through slots 704 and 710 may be transmitted through the elongated through slots 704 and 710 regardless of the wavelength of the infrared EMR. Accordingly, infrared EMR having a polarization direction that allows transmission through the elongated through slots 704 may be at least partially obstructed by the elongated through slots 710 so that such infrared EMR is not transmitted completely through the MLI composite material 700.
In some embodiments, one or more thermally-reflective layers of a MLI composite material may include sets of elongated through slots, with the elongated through slots of each set oriented in different selected orientations. For example, at least one of the first thermally-reflective layer 702 or second thermally-reflective layer 710 may include the elongated through slots 704 and 710.
In some embodiments, the container structure 802 may include one or more interlocks configured to provide controllable ingress of the object 810 into the storage chamber 808 or egress of the object 810 stored in the storage chamber 808 from the container structure 802. The one or more interlocks may enable inserting the object 810 into the storage chamber 808 or removing the object 810 from the storage chamber 808 without allowing the temperature of the storage chamber 808 to significantly change. In some embodiments, the container structure 802 may include two or more storage chambers, and the one or more interlocks enable removal an object from one storage chamber without disturbing the contents in another chamber. Similarly, the one or more interlocks may enable insertion of an object into one storage chamber without disturbing the contents of another storage chamber. For example, the one or more interlocks may allow ingress or egress of an object through a network of passageways of the container structure 802, with the one or more interlocks being manually or automatically actuated.
In a general sense, the various embodiments described herein can be implemented, individually and/or collectively, by various types of electro-mechanical systems having a wide range of electrical components such as hardware, software, firmware, or virtually any combination thereof; and a wide range of components that may impart mechanical force or motion such as rigid bodies, spring or torsional bodies, hydraulics, and electro-magnetically actuated devices, or virtually any combination thereof. Consequently, as used herein “electro-mechanical system” includes, but is not limited to, electrical circuitry operably coupled with a transducer (e.g., an actuator, a motor, a piezoelectric crystal, etc.), electrical circuitry having at least one discrete electrical circuit, electrical circuitry having at least one integrated circuit, electrical circuitry having at least one application specific integrated circuit, electrical circuitry forming a general purpose computing device configured by a computer program (e.g., a general purpose computer configured by a computer program which at least partially carries out processes and/or devices described herein, or a microprocessor configured by a computer program which at least partially carries out processes and/or devices described herein), electrical circuitry forming a memory device (e.g., forms of random access memory), electrical circuitry forming a communications device (e.g., a modem, communications switch, or optical-electrical equipment), and any non-electrical analog thereto, such as optical or other analogs. Those skilled in the art will also appreciate that examples of electro-mechanical systems include but are not limited to a variety of consumer electronics systems, as well as other systems such as motorized transport systems, factory automation systems, security systems, and communication/computing systems. Those skilled in the art will recognize that electro-mechanical as used herein is not necessarily limited to a system that has both electrical and mechanical actuation except as context may dictate otherwise.
In a general sense, the various aspects described herein which can be implemented, individually and/or collectively, by a wide range of hardware, software, firmware, or any combination thereof can be viewed as being composed of various types of “electrical circuitry.” Consequently, as used herein “electrical circuitry” includes, but is not limited to, electrical circuitry having at least one discrete electrical circuit, electrical circuitry having at least one integrated circuit, electrical circuitry having at least one application specific integrated circuit, electrical circuitry forming a general purpose computing device configured by a computer program (e.g., a general purpose computer configured by a computer program which at least partially carries out processes and/or devices described herein, or a microprocessor configured by a computer program which at least partially carries out processes and/or devices described herein), electrical circuitry forming a memory device (e.g., forms of random access memory), and/or electrical circuitry forming a communications device (e.g., a modem, communications switch, or optical-electrical equipment). The subject matter described herein may be implemented in an analog or digital fashion or some combination thereof.
The herein described components (e.g., steps), devices, and objects and the discussion accompanying them are used as examples for the sake of conceptual clarity. Consequently, as used herein, the specific exemplars set forth and the accompanying discussion are intended to be representative of their more general classes. In general, use of any specific exemplar herein is also intended to be representative of its class, and the non-inclusion of such specific components (e.g., steps), devices, and objects herein should not be taken as indicating that limitation is desired.
With respect to the use of substantially any plural and/or singular terms herein, the reader can translate from the plural to the singular and/or from the singular to the plural as is appropriate to the context and/or application. The various singular/plural permutations are not expressly set forth herein for sake of clarity.
The herein described subject matter sometimes illustrates different components contained within, or connected with, different other components. It is to be understood that such depicted architectures are merely exemplary, and that in fact many other architectures can be implemented which achieve the same functionality. In a conceptual sense, any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved. Hence, any two components herein combined to achieve a particular functionality can be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. Likewise, any two components so associated can also be viewed as being “operably connected,” or “operably coupled,” to each other to achieve the desired functionality, and any two components capable of being so associated can also be viewed as being “operably couplable,” to each other to achieve the desired functionality. Specific examples of operably couplable include but are not limited to physically mateable and/or physically interacting components and/or wirelessly interactable and/or wirelessly interacting components and/or logically interacting and/or logically interactable components.
In some instances, one or more components may be referred to herein as “configured to.” The reader will recognize that “configured to” can generally encompass active-state components and/or inactive-state components and/or standby-state components, etc. unless context requires otherwise.
In some instances, one or more components may be referred to herein as “configured to.” The reader will recognize that “configured to” can generally encompass active-state components and/or inactive-state components and/or standby-state components, unless context requires otherwise.
While particular aspects of the present subject matter described herein have been shown and described, it will be apparent to those skilled in the art that, based upon the teachings herein, changes and modifications may be made without departing from the subject matter described herein and its broader aspects and, therefore, the appended claims are to encompass within their scope all such changes and modifications as are within the true spirit and scope of the subject matter described herein. Furthermore, it is to be understood that the invention is defined by the appended claims. In general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to inventions containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a” and/or “an” should typically be interpreted to mean “at least one” or “one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to “at least one of A, B, and C, etc.” is used, in general such a construction is intended in the sense the convention (e.g., “a system having at least one of A, B, and C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). In those instances where a convention analogous to “at least one of A, B, or C, etc.” is used, in general such a construction is intended in the sense the convention (e.g., “a system having at least one of A, B, or C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). Virtually any disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase “A or B” will be understood to include the possibilities of “A” or “B” or “A and B.”
With respect to the appended claims, the recited operations therein may generally be performed in any order. Examples of such alternate orderings may include overlapping, interleaved, interrupted, reordered, incremental, preparatory, supplemental, simultaneous, reverse, or other variant orderings, unless context dictates otherwise. With respect to context, even terms like “responsive to,” “related to,” or other past-tense adjectives are generally not intended to exclude such variants, unless context dictates otherwise.
While various aspects and embodiments have been disclosed herein, the various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.
Claims
1.-63. (canceled)
64. A method, comprising:
- at least partially enclosing an object with multi-layer insulation (MLI) composite material to insulate the object from a surrounding environment, the MLI composite material including at least one thermally-reflective layer having a plurality of through openings configured to at least partially obstruct transmission therethrough of infrared electromagnetic radiation having a wavelength greater than a threshold wavelength.
65. The method of claim 64, further comprising maintaining the object at a temperature greater than that of a temperature of the surrounding environment for a period of time.
66. The method of claim 64, further comprising maintaining the object at a temperature less than that of a temperature of the surrounding environment for a period of time.
67. The method of claim 64, wherein at least partially enclosing an object with MLI composite material includes wrapping the MLI composite material around at least a portion of the object.
68. The method of claim 64, wherein at least partially enclosing an object with MLI composite material includes assembling sections made from the MLI composite material.
69. The method of claim 64, wherein at least partially enclosing an object with MLI composite material includes enclosing the object in a container structure that is at least partially formed from the MLI composite material.
70. The method of claim 64, wherein at least partially enclosing an object with MLI composite material includes placing the MLI composite material between incident electromagnetic radiation and the object.
71. The method of claim 64, wherein the plurality of through openings are arranged in a substantially periodic pattern.
72. The method of claim 64, wherein the plurality of through openings are arranged in a substantially non-periodic pattern.
73. The method of claim 64, wherein:
- the plurality of through openings include a first plurality of through openings and a second plurality of through openings;
- the at least one thermally-reflective layer includes a first thermally-reflective layer having the first plurality of through openings, and a second thermally-reflective layer having the second plurality of through openings which are not positioned in substantial registry with the first plurality of through openings.
74. The method of claim 64, wherein:
- the plurality of through openings include a first plurality of through openings and a second plurality of through openings;
- the at least one thermally-reflective layer includes a first thermally-reflective layer having the first plurality of through openings, and a second thermally-reflective layer having the second plurality of through openings positioned in substantial registry with the first plurality of through openings.
75. The method of claim 64, wherein the threshold wavelength is related to an opening dimension of at least a portion of the plurality of through openings.
76. The method of claim 64, wherein the threshold wavelength is proportional to an opening dimension of at least a portion of the plurality of through openings.
77. The method of claim 64, wherein the threshold wavelength is about twice an opening dimension of at least a portion of the plurality of through openings.
78. The method of claim 64, wherein the plurality of through openings are configured to at least partially allow transmission therethrough of visible electromagnetic radiation.
79. The method of claim 64, wherein the plurality of through openings are configured to at least partially allow transmission therethrough of visible electromagnetic radiation over substantially the entire visible electromagnetic radiation spectrum.
80. The method of claim 64, wherein the plurality of through openings are configured to at least partially allow transmission therethrough of visible electromagnetic radiation over only part of the visible electromagnetic radiation spectrum.
81. The method of claim 64, wherein the threshold wavelength is from about 1 μm to about 15 μm.
82. The method of claim 81, wherein the threshold wavelength is from about 8 μm to about 12 μm.
83. The method of claim 64, wherein at least a portion of the through openings are slots.
84. The method of claim 64, wherein at least a portion of the plurality of through openings are configured to at least partially obstruct transmission of the infrared electromagnetic radiation therethrough having a selected polarization direction.
85. The method of claim 64, wherein:
- the plurality of through openings include a first plurality of slots and a second plurality of slots; and
- the at least one thermally-reflective layer includes a first thermally-reflective layer having the first plurality of elongated through slots, and a second thermally-reflective layer having the second plurality of elongated through slots oriented in substantially the same directional orientation as the first plurality of elongated through slots.
86. The method of claim 64, wherein:
- the plurality of through openings include a first plurality of slots and a second plurality of slots; and
- the at least one thermally-reflective layer includes a first thermally-reflective layer having the first plurality of elongated through slots, and a second thermally-reflective layer having the second plurality of elongated through slots oriented in a substantially different directional orientation than that of the first plurality of elongated through slots.
87. The method of claim 64, wherein the plurality of through openings include:
- a first plurality of elongated through slots; and
- a second plurality of elongated through slots oriented in substantially the same directional orientation as the first plurality of elongated through slots.
88. The method of claim 64, wherein the plurality of through openings include:
- a first plurality of elongated through slots; and
- a second plurality of elongated through slots oriented in a substantially different directional orientation than that of the first plurality of elongated through slots.
Type: Application
Filed: Nov 4, 2013
Publication Date: Feb 27, 2014
Applicant: Tokitae LLC (Bellevue, WA)
Inventors: Roderick A. Hyde (Redmond, WA), Muriel Y. Ishikawa (Livermore, CA), Jordin T. Kare (Seattle, WA), Lowell L. Wood, JR. (Bellevue, WA)
Application Number: 14/070,892
International Classification: B65D 81/38 (20060101);