HEAT DISSIPATING DEVICE

A heat dissipating device comprises a first body, a second body, and a working fluid, the first body having a first plate and a second plate combining with each other to together define a first chamber, the second body connecting the first body and having a second chamber communicating with the first chamber correspondingly, the working fluid filled in the first chamber and the second chamber. By means of the design of the structure of the present invention and through the circulation of the working fluid between the first chamber and the second chamber, the heat dissipating device of the present invention can achieve the effect of remote heat dissipation.

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Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat dissipating device, and in particular to a heat dissipating device with remote heat dissipation and an extended range of heat dissipation.

2. Description of Prior Art

With the rapid progress of technology industry, the functions of electronic devices are more and more powerful; for example, the operational speeds of the electronic components in the central processing unit (CUP), chip set, and display unit increase accordingly. As a result, the heat generated per unit time by the electronic components is getting higher. Therefore, if the heat generated can not be dissipated promptly, it will affect the effective operation of the electronic device or cause damage to the electronic components.

The general heat dissipating devices used for the electronic components to remove heat in industry are mainly the heat dissipating components such as fans, heat sinks and heat pipes. The heat is delivered by contacting the heat sink and the heat source, and then is dissipated afar via the heat pipe, or the fan is used to drive a forced wind flow to cool the heat sink. For a tiny space or a wider heat source, a vapor chamber is selected as a heat-conducting component for heat transfer of the heat source.

A traditional vapor chamber is formed by two plates combined together. Both or either of grooves and wick structures such as meshes and sintered bodies is disposed on the corresponding sides of the two plates. The two plates are combined together to form a closed chamber which is at a vacuum state and is filled with a working fluid. In order to increase the capillary attraction capability, the wick structures of sintered coating copper pillars, sintered pillars and foam pillars are used as support and return paths. When the working fluid in the vapor chamber is heated at the vaporization area to vaporize, the working fluid transforms from liquid to vapor. After the vapor working fluid flows to the condensation area of the vapor chamber, it transforms from vapor to liquid. Then it flows back to the vaporization area through the copper pillars to repeat the cycle. After the vapor working fluid condenses into liquid droplets at the condensation area, gravity or capillarity causes the working fluid to flow back to the vaporization area, achieving the effect of uniform heat dissipation.

However, the heat dissipation feature of the traditional vapor chamber only works on the heat generated on or around the place the electronic component is attached to the traditional vapor chamber.

According to the above, the prior art has the following disadvantages:

1. without the effect of remote heat dissipation;

2. a narrow heat dissipation range; and

3. a low heat dissipation rate.

Thus, how to overcome the disadvantages and problems of the prior art is the focus of the inventor and related manufacturers in this fields to desperately study and improve.

SUMMARY OF THE INVENTION

In order to effectively overcome the above problems, the primary objective of the present invention is to provide a heat dissipating device with remote heat dissipation.

The secondary objective of the present invention is to provide a heat dissipating device with an extended range of heat dissipation.

The further objective of the present invention is for provide a heat dissipating device with an increased heat dissipation rate.

In order to achieve the above objectives, the present invention provides a heat dissipating device comprising a first body, a second body, and a working fluid; the first body has a first plate and a second plate disposed opposite to the first plate, the first plate and the second plate combined with each other to together define a first chamber, a first wick structure being formed on the inner wall of the first chamber; the second body connects the first body and extends opposite to the first body, the second body having a second chamber communicating with the first chamber correspondingly, a second wick structure being formed on the inner wall of the second chamber; the working fluid is filled in the first chamber and the second chamber.

By means of the design of the structure of the present invention, the structure of corresponding communication between the first chamber of the first body and the second chamber of the second body, when the first body is heated, the liquid working fluid is heated and vaporized into vapor. Then, part of the vapor working fluid in the first chamber flows toward the second chamber of the second body due to the communication structure between the first and second chambers. By the circulation of the vapor working fluid between the first and second chambers, the effect of remote heat dissipation can be achieved. Besides, the range of heat dissipation can be extended and the heat dissipation rate can be increased.

BRIEF DESCRIPTION OF DRAWING

FIG. 1A is an assembled perspective view of the heat dissipating device according to the first embodiment of the present invention;

FIG. 1B is a cross-sectional view of the heat dissipating device according to the first embodiment of the present invention;

FIG. 2 is an assembled perspective view of the heat dissipating device according to the second embodiment of the present invention;

FIG. 3 is a cross-sectional view of the heat dissipating device according to the third embodiment of the present invention;

FIG. 4 is a cross-sectional view of the heat dissipating device according to the fourth embodiment of the present invention;

FIG. 5 is a cross-sectional view of the heat dissipating device according to the fifth embodiment of the present invention;

FIG. 6 is an assembled perspective view of the heat dissipating device according to the sixth embodiment of the present invention; and

FIG. 7 is an assembled perspective view of the heat dissipating device according to the seventh embodiment of the present invention.

 DETAILED DESCRIPTION OF THE INVENTION

The above objectives and structural and functional features of the present invention will be described with reference to the accompanying drawings.

Please refer to FIGS. 1A and 1B, which are the assembled perspective view and cross-sectional view of the heat dissipating device according to the first embodiment of the present invention, respectively. The heat dissipating device comprises a first body 1, a second body 2, and a working fluid 3. The first body 1 has a first plate 10 and a second plate 11 disposed opposite to the first plate 10, the first plate 10 and the second plate 11 combined with each other to together define a first chamber 101, a first wick structure 102 being formed on the inner wall of the first chamber 101. The first wick structure 102 can be one of sintered powder, mesh, fiber, foam and porous material. The first body 1 further has a hole 103.

The above-mentioned second body 2 connects the first body 1 and extends opposite to the first body 1. The second body 2 has a second chamber 211 communicating with the first chamber 101 correspondingly. A second wick structure 212 is formed on the inner wall of the second chamber 211. The second wick structure 212 is one of sintered powder, mesh, fiber and grooves. The second body 2 further has an open end 213 at one end thereof (a closed end at the other end thereof, not shown, disposed away from the first body 1) and the open end 213 connects the first plate 10 and the second plate 11 correspondingly. The open end 213 is inserted into the first chamber 101 and connected to the hole 103 correspondingly.

The above-mentioned working fluid 3 is filled in the first chamber 101 of the first body 1 and the second chamber 211 of the second body 2.

In the current embodiment, a heat spreader is used as the first body 1 and a heat pipe is used as the second body 2 for the purpose of explanation, but not limited to the above examples.

Thus, by means of the design of the heat dissipating device of the present invention, using the corresponding connection between the hole 103 of the first body 1 and the open end 213 of the second body 2 enables the corresponding communication between the first chamber 101 of the first body 1 and the second chamber 211 of the second body 2. When the first body 1 is heated, the liquid working fluid 3 is heated and then vaporized into the vapor working fluid 3. Next, part of the vapor working fluid 3 in the first chamber 101 flows toward the second chamber 211 of the second body 2 due to the communication structure between the first and second chambers 101, 211. This makes part of the vapor working fluid 3 flow from the first chamber 101 to the second chamber 211 to dissipate the heat. With the continuous circulation of the working fluid 3 between the first and second chambers 101, 211, the uniform heat dissipation is achieved by the first body 1 and the effect of remote heat dissipation is further achieved by the second body 2; furthermore, the range of heat dissipation is extended and the rate of heat dissipation is increased.

Please refer to FIGS. 2 and 1A; the former is an assembled perspective of the heat dissipating device according to the second embodiment of the present invention. In the second embodiment, some components of the heat dissipating device and the corresponding relation among the components are the same as those in the first embodiment, not described again here. The main difference of the heat dissipating devices between the second and first embodiments is that the second body 2 in the second embodiment further has an upper pipe surface 21 and a lower pipe surface 22, the upper pipe surface 21 and the lower pipe surface 22 together defining the second chamber 211, the second body 2 being flattened. By means of the structure of corresponding communication between the first chamber 101 and the second chamber 211, part of the vapor working fluid 3 in the first chamber 101 can flow toward the second chamber 211 of the second body 2. This makes the working fluid 3 circulate continuously between the first and second chambers 101, 211. As a result, the effects of uniform heat dissipation and remote heat dissipation can be achieved.

Please refer to FIGS. 3 and 1A; the former is a cross-sectional view of the heat dissipating device according to the third embodiment of the present invention. In the third embodiment, some components of the heat dissipating device and the corresponding relation among the components are the same as those in the above-mentioned embodiments, not described again here. The main difference of the heat dissipating devices between the third and first embodiments is that the first body 1 in the third embodiment further has at least one supporting structure 4. The supporting structure 4 is one of a copper pillar, a sintered powder column and an annulus, two ends of the supporting structure 4 connecting the first plate 10 and the second plate 11, respectively. By means of the above-mentioned supporting structures 4, when the second plate 11 is heated, the liquid working fluid 3 is vaporized and transformed to the vapor working fluid 3. The vapor working fluid 3 flows toward the first plate 10 and contacts the inner wall of the first plate 10 and then is condensed back into the liquid working fluid 3. After that, the liquid working fluid 3 is drawn back to the second plate 11 by means of the supporting structures 4.

Please refer to FIGS. 4 and 1A; the former is a cross-sectional view of the heat dissipating device according to the fourth embodiment of the present invention. In the fourth embodiment, some components of the heat dissipating device and the corresponding relation among the components are the same as those in the above-mentioned embodiments, not described again here. The main difference of the heat dissipating devices between the fourth and first embodiments is that the second body 2 in the fourth embodiment further has at least one supporting structure 4. The supporting structure 4 is one of a copper pillar, a sintered powder column and an annulus. Two ends of the supporting structure 4 connect the upper pipe surface 21 and the lower pipe surface 22, respectively.

Please refer to FIGS. 5 and 1A; the former is a cross-sectional view of the heat dissipating device according to the fifth embodiment of the present invention. In the fifth embodiment, some components of the heat dissipating device and the corresponding relation among the components are the same as those in the above-mentioned embodiments, not described again here. The main difference of the heat dissipating devices between the fifth and first embodiments is that both the first and second bodies 1, 2 in the fifth embodiment have at least one supporting structure 4. By means of the supporting structure 4, when the second body 11 is heated, the liquid working fluid 3 is vaporized and transformed to the vapor working fluid 3 which is then condensed back into the liquid working fluid 3 in the first and second chambers 101, 201. After that, the liquid working fluid 3 is drawn back to the second plate 11 and the lower pipe surface 22 by means of the supporting structure 4.

Also, the materials of the first body 1 and second body 2 can be one of copper, aluminum and highly thermoconductive material.

Finally, please refer to FIGS. 6 and 7, which are the assembled perspective views of the heat dissipating devices according to the sixth and seventh embodiments of the present invention, respectively. In the current embodiments, some components of the heat dissipating device and the corresponding relation among the components are the same as those in the above-mentioned embodiments, not described again here. The main difference of the heat dissipating devices between the current and above embodiments is that in the application of the present invention, there can be a first body 1 connecting plural second bodies 2, a second body 2 connecting two first bodies 1, or plural first bodies 1 and plural second bodies 2 connecting to each other.

In summary, the present invention has the following advantages over the prior art:

1. the effect of remote heat dissipation;

2. an extended range of heat dissipation; and

3. an increased rate of heat dissipation.

Although the present invention has been described above with reference to the foregoing preferred embodiments, it will be understood that the above embodiments are not to limit the scope of the present invention. Various equivalent variations and equivalent modifications according to the scope of the present invention are also embraced within the scope of the invention as defined in the appended claims.

Claims

1. A heat dissipating device, comprising:

a first body having a first plate and a second plate disposed opposite to the first plate, the first plate and the second plate combined with each other to together define a first chamber, a first wick structure being formed on the inner wall of the first chamber;
a second body connecting the first body at one end thereof and extending opposite to the first body from the other end thereof, the second body having a second chamber communicating with the first chamber correspondingly, a second wick structure being formed on the inner wall of the second chamber; and
a working fluid filled in the first chamber and the second chamber.

2. The heat dissipating device according to claim 1, wherein the second body further has an upper pipe surface and a lower pipe surface, the upper pipe surface and the lower pipe surface together defining the second chamber.

3. The heat dissipating device according to claim 2, wherein the second body further has an open end at one end thereof, the open end connecting the first plate and the second plate correspondingly.

4. The heat dissipating device according to claim 3, the first body further has a hole connecting the open end correspondingly.

5. The heat dissipating device according to claim 1, wherein the first wick structure is one of sintered powder, mesh, fiber, foam, and porous material.

6. The heat dissipating device according to claim 1, wherein the second wick structure is one of sintered powder, mesh, fiber, and grooves.

7. The heat dissipating device according to claim 1, wherein the first body further has at least one supporting structure, the supporting structure being one of a copper pillar, a sintered powder column and an annulus, two ends of the supporting structure connecting the first plate and the second plate, respectively.

8. The heat dissipating device according to claim 2, wherein the second body further has at least one supporting structure, the supporting structure being one of a copper pillar, a sintered powder column and an annulus.

9. The heat dissipating device according to claim 1, wherein the first body is a heat spreader.

10. The heat dissipating device according to claim 1, wherein the second body is a heat pipe.

Patent History
Publication number: 20140182819
Type: Application
Filed: Jan 1, 2013
Publication Date: Jul 3, 2014
Applicant: ASIA VITAL COMPONENTS CO., LTD. (New Taipei City)
Inventor: Hsiu-Wei Yang (New Taipei City)
Application Number: 13/732,416
Classifications
Current U.S. Class: Utilizing Capillary Attraction (165/104.26)
International Classification: F28D 15/02 (20060101);