ELASTIC BUMP STOPS FOR MEMS DEVICES
A MEMS device includes at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The MEMS device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure. The MEMS device additionally includes at least one secondary bump stop situated at a second distance from the target structure, wherein the second distance is greater than the first distance, and further wherein the at least one elastic bump stop moves to reduce the first distance when a shock is applied.
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This application claims priority to U.S. Provisional Application No. 61/790,300 filed on Mar. 15, 2013, by Qiu et al., and entitled “Elastic Bump Stops for MEMS Devices”.
BACKGROUNDVarious embodiments of the invention relate generally to bump stops and particularly to elastic bump stops used in microelectromechanical systems (MEMS) device. A known problem with MEMS devices is upon experiencing a shock, the MEMS device undergoes chipping at corners when a moving structure contacts a target. This clearly leads to undesirable effects not to mention a short lifetime of the MEMS device as well as increased costs and other foreseen deterioration. Bump stops have been historically employed to aid in reducing the impact experienced by MEMS devices. However, such measures have yielded little positive results particularly in light of their stiffness.
What is needed is a MEMS device with reduced impact force upon encountering a shock.
SUMMARYBriefly, an embodiment of the invention includes a MEMS device having at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The MEMS device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure. The MEMS device additionally includes at least one secondary bump stop situated at a second distance from the target structure, wherein the second distance is greater than the first distance, and further wherein the at least one elastic bump stop moves to reduce the first distance when a shock is applied.
A further understanding of the nature and the advantages of particular embodiments disclosed herein may be realized by reference of the remaining portions of the specification and the attached drawings.
The following specification describes a MEMS device with multiple bump stops (also referred to herein as “elastic bump” or “bump”) to reduce the affect of a shock to the MEMS device.
As used herein “stiction” is an undesirable situation which arises when surface adhesion forces are higher than the mechanical restoring force of a MEMS structure or MEMS device. Stiction is recognized to often occur in situations where two surfaces with areas in close proximity come in contact. The greater the contact area at both macroscopic and microscopic roughness levels, the greater the risk of stiction. At the microscopic level, soft materials can deform, effectively increasing contact area. Surfaces can be unintentionally brought into contact by external environmental forces including vibration, shock and surface tension forces that are present during aqueous sacrificial release steps often used in micro-fabrication processes. Adherence of the two surfaces may occur causing the undesirable stiction.
Particular embodiments and methods of the invention disclose a MEMS device having at least one proof mass. The proof mass is capable of moving to contact at least one target structure. The MEMS device further includes at least one primary bump stop that is coupled to the proof mass and situated at a first distance from the target structure. The primary bump stops maybe an elastic bump stop. The MEMS device additionally has at least one secondary bump stop situated at a second distance from the target structure. The second distance is greater than the first distance. The primary bump stop moves to reduce the first distance when a shock is applied to the MEMS device. Flexible element coupled to the proof mas reduces the impact of the force experienced by the proof mas to prevent chipping. In various embodiments of the invention, reduced impact force permits use of smaller bump stops for less stiction. Additionally, the increased flexible element restores force for a secondary bump stop. In some embodiments, the target structure is positioned at a tilt relative to the elastic bump stops and the elastic bump stops reduce chipping caused by impact at the corners of the target structure, such as the MEMS device, because the bump stop can conform to the tilt. Stated differently, elastic bump stops are utilized to help prevent chipping by compressing to help break out a secondary bump stop contact stiction.
In the described embodiments, MEMS device may include one or more proof masses, one or more primary bump stops and one or more secondary bump stops. The primary bump stop may be more flexible than the secondary bump stop. The primary bump stop may be coupled to a target structure or connected to the proof mass. Similarly, the secondary bump stop may be coupled to the target structure or the proof mass. The target structure may be a stationary or moveable.
The MEMS device may include a first contact surface and a second contact surface coupled to the proof mass. In some embodiments, the first contact surface may be on the primary bump stop or the proof mass or the target structure; the second contact surface may be on the secondary bump stop or the proof mass or the target structure or the primary bump stop. In some embodiments, the first target surface may be on the primary bump stop or the proof mass or the target structure; the second target surface may be on the secondary bump stop or the proof mass or the target structure. The second target structure and the second contact are farther apart than the first target structure and the first contact. The first contact surface may be coupled to the proof mass via a flexible element or coupled directly to the proof mass.
In the described embodiments, elastic member, flexible element, spring, and flexible structure maybe used interchangingly.
Referring now to
Further shown in
The structure 114 is shown, in
In
In
Stated differently,
fbounceMax=v0√{square root over (mk2)},fMax=k2g2. Eq. (1)
If v0 is low and the secondary bump stops 106 and 108 are not engaged during impact, f_bounceMax is the maximum force experienced by primary bump stop 114. In the embodiment of
As shown in
When a shock is applied, first the gap 367 closes, due to the flexibility of the flexible beam 361, the contact force between 362 and the structure 363 are reduced. If the shock is large enough, the gaps 365 and 366 also close, to prevent further relative motion between the proof mass 364 and the structure 363.
Thus, in accordance with the various embodiments and methods of the invention, an elastic bump stop design with a second contact that limits the elastic bump stop deflection so as to prevent the bump stop function is disclosed. The elastic bump stop design with the second contact helps restore the second contact and conforms to the contact surface by the rotational compliance of the elastic member. The elastic bump stop design with the first contact member either flattens out, or not, against the contact target. Both behaviors can be implemented by specific elastic bump stop designs.
The embodiments and methods disclosed herein can also apply to a compass, in addition to a gyroscope, with the compass comprising of moveable elements. Although the description has been described with respect to particular embodiments thereof, these particular embodiments are merely illustrative, and not restrictive.
As used in the description herein and throughout the claims that follow, “a”, “an”, and “the” includes plural references unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
Thus, while particular embodiments have been described herein, latitudes of modification, various changes, and substitutions are intended in the foregoing disclosures, and it will be appreciated that in some instances some features of particular embodiments will be employed without a corresponding use of other features without departing from the scope and spirit as set forth. Therefore, many modifications may be made to adapt a particular situation or material to the essential scope and spirit.
Claims
1. A MEMS device comprising:
- at least one proof mass capable of moving relative to a substrate;
- a first contact surface coupled to the at least one proof mass;
- a second contact surface coupled to the at least one proof mass;
- a first target surface facing the first contact surface and separated from the first contact surface by a first distance;
- a second target surface facing the second contact surface and separated from the second contact surface by a second distance; and
- the first contact surface is coupled to the proof mass by a flexible element or the first target surface is coupled to the flexible element,
- wherein the at least one proof mass is coupled to the substrate by a spring,
- wherein when the at least one proof mass moves, the first contact surface moves to reduce the first distance until the first contact surface contacts the first target surface,
- wherein when the first contact surface and the first target surface are in contact and the at least one proof mass moves, at least one flexible element flexes and the second contact surface moves to reduce the second distance until the second contact surface contacts the second target surface.
2. The MEMS device of claim 1, wherein the at least one proof mass moves at a plane substantially parallel to the substrate.
3. The MEMS device of claim 1, wherein the at least one proof mass moves out of a plane parallel to the substrate.
4. The MEMS device of claim 1, wherein the flexible element is a torsional spring.
5. The MEMS device of claim 1, wherein the first target surface is stationary with respect to the substrate.
6. The MEMS device of claim 5, wherein the flexible element is coupled to the at least one proof mass.
7. The MEMS device of claim 1, wherein the flexible element is a clamped-clamped beam.
8. The MEMS device of claim 7, further comprising a first structure coupled to the first target surface, thereby extending a portion of the first target surface towards the at least one proof mass.
9. The MEMS device of claim 7, further comprising a first structure coupled to the first contact surface thereby extending a portion of the first contact surface towards the at least one proof mass
10. The MEMS device of claim 9, further comprising a second structure coupled to the second target surface or the second contact surface.
11. The MEMS device of claim 10, wherein the second structure is a secondary bump stop.
12. The MEMS device of claim 10, wherein the second structure is less flexible than the at least one flexible element.
13. The MEMS device of claim 1, wherein the second target surface is stationary with respect to the substrate.
14. The MEMS device of claim 1, wherein the first contact surface is smaller than the second contact surface.
15. The MEMS device of claim 1, where in the MEMS device is a gyroscope or an accelerometer.
16. The MEMS device of claim 1, wherein the at least one proof mass moves translationally.
17. The MEMS device of claim 1, wherein the at least one proof mass moves rotationally.
18. The MEMS device of claim 1, further comprising a structure coupled to the at least one proof mass by a second flexible element,
- wherein the first contact surface is formed on a the first surface of the structure,
- wherein the second target surface is formed on a second surface of the structure,
- wherein the second contact surface is formed on the at least one proof mass.
19. The MEMS device of claim 18, wherein the second flexible element is a cantilever beam.
Type: Application
Filed: Oct 9, 2013
Publication Date: Sep 18, 2014
Applicant: Invensense, Inc. (San Jose, CA)
Inventors: Jin Qiu (Sunnyvale, CA), Joseph Seeger (Menlo Park, CA)
Application Number: 14/050,201
International Classification: G01C 19/56 (20060101);