Abstract: A method for manufacturing a semiconductor device includes a resin sealing step for sealing a semiconductor chip with a resin material in a state where the semiconductor chip is bonded on a lead frame in which a depressed portion is formed, a laser light irradiation step for irradiating the depressed portion with laser light to remove the resin material in the depressed portion by the laser light so that a part of the resin material remains in the depressed portion, and a cutting step for cutting a bottom face of the depressed portion in the lead frame together with the part of the resin material in the depressed portion.

Abstract: A lead frame has a back surface having a multiple-irradiated region that is irradiated with laser light scanned in a first scan step and laser light scanned in a second scan step, a unit resin molded product that is formed in a cutting step has corner regions overlapping the multiple-irradiated region of the lead frame, and the multiple-irradiated region prevents the laser light emitted to the back surface from reaching portions of the resin material on the front surface of the lead frame, the portions being located at a position corresponding to the corner regions.

Abstract: A compression molding die includes a first mold and a second mold. The first mold includes a bottom surface member and a side surface member. A space is providable in the first mold by a step of at least one of an outer peripheral surface of the bottom surface member and an inner peripheral surface of the side surface member. The first mold includes a gas inlet capable of introducing gas into the space, a gas outlet through which the gas introduced into the space is dischargeable, and a seal member below the space.

Abstract: Provided a method for supplying a resin by which appropriate replacement of a cartridge enables resin supply to be performed appropriately. The method for supplying a resin includes: a primary resin supplying step of supplying a liquid resin contained in a first cartridge to a supply target, the first cartridge having a remaining amount of liquid resin smaller than a target supply amount appropriate for one-time resin supply to the supply target; a cartridge replacing step of replacing, after the primary resin supplying step, the first cartridge with a second cartridge already subjected to dripping out; and a secondary resin supplying step of supplying a liquid resin contained in the second cartridge to the supply target after the cartridge replacing step.

Abstract: A resin molding apparatus includes: a resin supply mechanism including a nozzle for ejecting liquid resin to a supply target; a resin collection unit including: a resin-receiving member configured to receive a portion of the liquid resin which portion has dropped from the nozzle; and a movement mechanism configured to cause the resin-receiving member to move in such a manner as to follow the nozzle while keeping the resin-receiving member under the nozzle; a mold die including an upper die and a lower die facing the upper die; a mold clamp mechanism configured to clamp the mold die with the supply target between the upper die and the lower die; and a control section configured to control at least respective operations of the resin supply mechanism and the resin collection unit.

Abstract: Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.

Abstract: The present invention relates to a conveyance device with which a subject to be molded can be positioned relative to a forming die. This conveyance device conveys a subject to be molded to one die from among forming dies to which a resin material is supplied from a resin injection part and comprises a retaining unit which retains and delivers the subject to be molded to the one die, a first movement mechanism which moves the subject to be molded having been delivered to the one die in a first direction toward the resin injection part, and a second movement mechanism which moves the subject to be molded having been delivered to the one die in a second direction differing from the first direction.

Abstract: Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.

Abstract: A resin molding device includes: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of ascending and descending vertically with respect to the side block; a clamp mechanism which clamps the lower mold and the upper mold; a transfer mechanism which supplies a resin material to the cavity by a plunger; and a controller which performs first final adjustment control for adjusting a clamp load of the clamp mechanism to a final clamp load after the cavity has been filled with the resin material supplied from the transfer mechanism and which performs second final adjustment control for driving the plunger after the first adjustment control has been completed and thereby adjusting a plunger load applied to the plunger to a final plunger load.

Abstract: A mold die includes: a mold die body that is configured to hold an object to be molded, the object including a substrate and a chip mounted in a central area of the substrate, and that has a cavity which is rectangular in a plan view and which is configured to receive a resin material, the mold die body including: a pot for containing the resin material; a gate disposed at one side of the cavity and configured to allow the resin material to flow into the cavity; and a flow-path restricting mechanism that is disposed on both lateral sides of the cavity that are perpendicular to the one side and that is configured to narrow lateral flow paths, the lateral flow paths being flow paths for the resin material flowing through the cavity in which the chip is not disposed.

Abstract: The resin molding device comprises: a lower mold on which a substrate is placed; an upper mold in which a cavity is formed by a side block and a cavity block provided so as to be capable of rising and descending vertically with respect to the side block; a clamp mechanism for clamping the lower mold and the upper mold; a transfer mechanism that supplies a resin material to the cavity by means of a plunger; and a controller that uses the relationship between the position of the plunger and a resin filling rate for the cavity calculated on the basis of the volume of a chip arranged on the substrate and the volume of the resin material when performing filling rate correspondence control for controlling operation relating to resin molding triggered as a result of the plunger arriving at a position corresponding to a predetermined resin filling rate.

Abstract: The present invention enables a reference surface member to reliably contact a side surface of a recess of a molding die, and is directed to a conveyance apparatus that conveys an object to be molded to a molding die in which a recess is formed on a side of a mold surface on which the object to be molded is placed, the conveyance apparatus including: a position reference mechanism having a reference surface serving as a positioning reference of the object to be molded placed on the molding die; and an object-to-be-molded moving mechanism that moves the object to be molded placed on the molding die toward the reference surface.

Abstract: A compression mold includes a first mold and a second mold. The first mold includes a side surface member and a bottom surface member. The side surface member includes a step height on a bottom surface member side of the side surface member. The step height includes a first surface of the side surface member, a second surface that extends from the first surface toward the bottom surface member, and a third surface that extends downward from the second surface. The bottom surface member includes an upper surface where a resin material can be arranged and a slide surface that extends downward from the upper surface and is slidable with respect to the third surface of the side surface member. The third surface of the side surface member is not exposed while the resin material is supplied.

Abstract: Provided is a laser processing device that enables a film to be stabilized and processed. The present invention comprises: a conveyance mechanism that conveys a film; a holding mechanism that has a pair of holding parts which can at least sandwich and hold lateral portions of the processing range of the film; and a laser mechanism for processing the processing range of the film held by the holding mechanism.

Abstract: A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact with a portion of the substrate when the first molding mold and the second molding mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the second member is capable of flowing.

Abstract: The present invention is to improve the quality and appearance of a second molded product such as a secondary molded product obtained by further resin-molding a first molded product such as a primary molded product, for example. The present invention is a method for manufacturing a resin molded product in which a second molded product is obtained by further performing resin molding on a resin-molded first molded product using a first mold with a cavity formed and a second mold facing the first mold, the method including a disposing step of disposing the first molded product in the cavity and disposing a resin material on the first molded product, and a mold clamping step of clamping the first mold and the second mold after the disposing step.

Abstract: The present invention provides a resin leakage prevention member 401 for use in a molding die 1000, wherein the molding die 1000 includes a lower die 200 and an upper die 100, the lower die 200 has a side member 201 and a bottom member 202, a space surrounded by the side member 201 and the bottom member 202 forms a cavity 204, the cavity 204 is configured to accommodate a resin material 20a, the side member 201 is configured to move relatively vertical to the bottom member 202, and the resin leakage prevention member 401 is disposed on a peripheral portion of an upper surface of the bottom member 202 and along an inner peripheral surface of the side member 201, thereby sealing a gap between the side member 201 and the bottom member 202 and preventing a resin from leaking from the cavity 204 into the gap.

Abstract: The present invention is intended to prevent resin from sticking to a molding surface of a first molding die that holds an object to be molded, without using a release film, and is a resin molding apparatus that performs resin molding on the object to be molded, the resin molding apparatus including: a first molding die that holds the object to be molded; a second molding die that is provided in a manner facing the first molding die and that has a cavity for holding resin material; and a cover plate that is provided between the object to be molded and the first molding die, that covers a molding surface of the first molding die, and that has rigidity for maintaining its own shape.

Abstract: The present invention aims at eliminating a need for a protective cover such as a bellows cover and improving a collection rate of machining scraps, and includes machining tables that are fixed at least in X and Y directions on a horizontal plane and hold a workpiece, a machining mechanism that machines the workpiece with a rotary tool using a machining liquid, a moving mechanism that linearly moves the machining mechanism at least in each of the X and Y directions on the horizontal plane, and a machining scrap storage unit that is provided below the machining tables and stores machining scraps generated by machining by the machining mechanism.

Abstract: The present invention aims at eliminating a need for a moving mechanism that moves a machining table and eliminating a need for a protective cover such as a bellows cover, and includes a machining table that holds a workpiece, a machining mechanism that machines the workpiece with a rotary tool while using a machining liquid, and a moving mechanism that linearly moves the machining mechanism at least in each of X and Y directions on a horizontal plane, in which the machining mechanism moved by the moving mechanism machines the workpiece with respect to the machining table, the machining table being fixed at least in the X and Y directions.