Electrical Component Encapsulating Patents (Class 264/272.11)
  • Patent number: 10079188
    Abstract: Provided is a resin composition for encapsulating which is used for forming an encapsulating resin of an on-vehicle electronic control unit including a wiring substrate, a plurality of electronic components mounted on the wiring substrate, and the encapsulating resin encapsulating the electronic component, the resin composition including: a thermosetting resin; and one or more imidazole compounds, in which when a torque value is measured over time under conditions of the number of rotations of 30 rpm and a measurement temperature of 175° C. by using Labo Plastomill, a time T1 at which the torque value is less than or equal to 2 times a minimum torque value is longer than or equal to 15 seconds and shorter than or equal to 100 seconds, and the minimum torque value is greater than or equal to 0.5 N·m and less than or equal to 2.5 N·m.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: September 18, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Naoki Tomida, Kazuhiko Dakede
  • Patent number: 10071509
    Abstract: The present disclosure relates to an arrangement for manufacturing a head winding cap of an electric machine, comprising a container for accommodating a molding compound, the container is attachable to two winding arms adjacent to a clip connecting the winding arms and enclosing the winding arms, the container projecting perpendicular to the winding arms when attached, and the container creating a tight inclusion for the molding compound, whereas the cap is filled with a dielectric compound.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: September 11, 2018
    Assignee: GE Renewable Technologies
    Inventors: Yannick Baril, José Figueroa, Michel Sabourin
  • Patent number: 9960055
    Abstract: In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: May 1, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Haruhiko Harada
  • Patent number: 9893588
    Abstract: A motor includes a housing, a stator holder, a stator, and a flow path for a cooling fluid. The cooling flow path is provided between the housing and the stator holder. A coil of the stator is covered by a resin portion. The stator holder may include a holder cylindrical portion and a holder flat plate portion.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: February 13, 2018
    Assignee: NIDEC CORPORATION
    Inventors: Yusuke Makino, Yoshiki Kawai
  • Patent number: 9887105
    Abstract: An object of the present invention is to improve the reliability and productivity of a semiconductor device by suppressing generation of a resin burr in a molding process. In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. Accordingly, when the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. Thus, no gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: February 6, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Haruhiko Harada
  • Patent number: 9808973
    Abstract: An encapsulated lead frame has a core element with multiple elongated conductor tracks arranged next to one another. The lead frame also has first partial encapsulations formed by a first encapsulation of the core element in first sub-regions and second partial encapsulations formed by a second encapsulation of the core element in second sub-regions. The first and second partial encapsulations enclose the core element as an overall encapsulation. The first partial regions are spaced apart from one another and each of the first partial encapsulations respectively surrounds only one single conductor track. This configuration avoids gaps that may form at interfaces between a first and second partial encapsulation, may extend between two adjacent conductor tracks, and may allow conductive fluid to accumulate therein and form short-circuits between adjacent conductor tracks. The encapsulated frame is used in a transmission control device. A method for producing an encapsulated lead frame is disclosed.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: November 7, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Martin Gerhaeusser, Giuseppe Barone
  • Patent number: 9802279
    Abstract: Embodiments are provided for using a molded thermal plastic fin shell as part of a heat sink design for electronic devices. The heat sink design also includes metal components in contact with the electronics components of the device and the thermal plastic fin shell. The thermal plastic fin shell serves both as part of the heat sink design to dissipate heat to the air and as a protective casing or packaging for the device. The heat is transferred from the electronics components or heat sources in the device to the heat sink metal components and hence to the thermal plastic fin shell in contact with the metal. The thermal plastic fin shell dissipates the heat into the surrounding air. The combination of metal and thermal plastic materials in the heat sink design combines both desired properties of high thermal conductivity and ease of manufacture.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: October 31, 2017
    Assignee: FUTUREWEI TECHNOLOGIES, INC.
    Inventors: Qian Han, Jun Yang, Xiaodu Shao
  • Patent number: 9736560
    Abstract: The present disclosure generally provides an apparatus and method of forming a liquid impermeable sealed audio speaker that can be easily manufactured and provides a high quality audio output. In an effort to overcome the shortcomings of conventional sealed speaker designs that typically utilize complicated and expensive means of shielding their electronic components from liquids and other sources of contamination, one or more of the embodiments of the disclosure provided herein include a sealed enclosure that has at least one liquid impermeable region that prevents or substantially inhibits the movement of a liquid from the exterior region into the internal region. In general, the liquid impermeable regions, or hereafter simply “liquid permeable regions,” are configured to prevent the ingress of liquids or other contaminants, while allowing the production of a desired sound quality.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 15, 2017
    Assignee: Logitech Europe S.A.
    Inventors: Steve McGarry, Steven Warren Pooler, Donald Robert Mayette
  • Patent number: 9730350
    Abstract: The invention discloses electrical equipment, an integrated circuit's loop thereof and a circuit connecting method. The integrated circuit's loop includes: a passive component part, including a power device and/or an execution device; and one or more electrical components, each of the electrical components including a body and multiple pins, wherein at least one pin extends to an electrical connecting end of the passive component part, and is electrically connected with the electrical connecting end. In the integrated circuit's loop of the invention, the pins of the electrical components extend to electrical connecting ends of the passive component part, and are electrically connected with the electrical connecting ends, so that the electrical components are not required to be arranged on a Printed Circuit Board (PCB), a physical structure of the circuit configuration is simplified, a size of the circuit is reduced, and the technician is not required to design the PCB.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: August 8, 2017
    Assignee: SHENZHEN SIGMA MICROELECTRONICS CO., LTD.
    Inventors: Lun Lv, Lifa Wu
  • Patent number: 9579869
    Abstract: This invention relates to polyurethane prepolymer containing adhesives that are liquid at room temperature and that do not phase separate under typical storage and use conditions and that can be cured by exposure to moisture or active hydrogen-containing curing agents. The polyurethane prepolymer adhesives exhibit surprisingly good adhesion to plastics such as fiberglass reinforced plastics (“FRP”).
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: February 28, 2017
    Assignee: Henkel IP & Holding GmbH
    Inventors: Shuhui Qin, Yingjie Li
  • Patent number: 9479211
    Abstract: A housing includes a main body, the main body includes a plurality of metal sheets and a plurality of resin layers, each metal sheet alternates with one resin layer, each two adjacent metal sheets are fixed together by one resin layer located between the two metal sheets. An electronic device using the housing is also provided.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: October 25, 2016
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: Xu Liu, Yi Yang, Po-Feng Ho
  • Patent number: 9273989
    Abstract: An antenna combination includes a feed-through having an input side including a connector for coupling to a transmission line connector and an output side including an inner cavity attaching to an aperture in a top surface or a nozzle of a tank. A foam filled dielectric rod antenna is coupled to the output side of the feed-through having a nose portion including a sub-portion within the inner cavity and a rod-shaped portion from beyond the inner cavity to an antenna launch end. The rod-shaped portion includes an outer solid dielectric material including a thickness transition region, wherein a thickness of the solid dielectric material decreases toward the antenna launch end to a constant minimum thickness shell region that extends to the antenna launch end. The outer solid dielectric material defines an inner hollow region. A dielectric foam fill material fills the inner hollow region.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: March 1, 2016
    Assignee: Honeywell International Inc.
    Inventors: Bin Sai, Fouad Nusseibeh
  • Patent number: 9228861
    Abstract: A signal transmitting member is electrically connected to a rotation sensing device and transmits a rotation sensing signal from the rotation sensing device to an external device. An internal structure holds the rotation sensing device and a portion of the signal transmitting member. At least one rib is molded on an outer peripheral surface of the internal structure. The internal structure is integrally molded with a resin material and includes an installing portion, which is configured to install the rotation sensing apparatus to an external subject body through the installing portion, and a holding portion, which is configured to enable holding of the rotation sensing apparatus through the holding portion. A plurality of recesses is formed between the installing portion and the holding portion.
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: January 5, 2016
    Assignee: DENSO CORPORATION
    Inventors: Mitsuru Takasaki, Hiroyuki Tsuge
  • Patent number: 9120257
    Abstract: Methods and devices for forming a composite carrier frame assembly used in an injection molding process are described. Methods and devices described herein are well suited for insert molding multiple small pieces into a single injection molded part. The composite carrier frame assembly can include a number of insert attached thereto that are positioned in a pre-determined arrangement such during an injection molding process the inserts are molded in a molded part in the pre-determined arrangement. Each insert can include an anchor portion arranged to be molded in the single injection molded part and an exterior portion arranged to be positioned exterior to the single injection molded part.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: September 1, 2015
    Assignee: Apple Inc.
    Inventor: Scott M. Nathanson
  • Patent number: 9089906
    Abstract: Various identification tags are disclosed. In one embodiment, a system includes a coupling with an extended skirt having an opening to receive an identification tag. The identification tag may be configured to be snapped into the opening, slid into the opening, or threaded into the opening, for example. The identification tag, such as an RFID tag, may include an electronics module to enable wireless communication with a reader. The electronics module may be received within a body to facilitate installation and retention of the tag and increase durability. The disclosed tags may also be installed in other components. Various other tags, systems, devices, and methods pertaining to identification tags are also disclosed.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: July 28, 2015
    Assignee: Vallourec Oil and Gas France, S.A.S.
    Inventor: Ian Rex Binmore
  • Publication number: 20150140848
    Abstract: A connector includes a connector housing, an inner plate that supports a terminal connected to a one end portion of an electric wire and that is accommodated in an inside of the connector housing, and filler material that fills the inside of the connector housing which has accommodated the inner plate and that is then hardened so as to cover a connection part of the electric wire and the terminal. The filler material adheres to a first portion within an inner surface of the connector housing and to an outer surface of the inner plate. A release layer is provided between a second portion within the inner surface of the connector housing and an outer surface of the filler material opposite to the second portion.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 21, 2015
    Applicant: YAZAKI CORPORATION
    Inventors: Akira SATO, Kazuhide TAKAHASHI, Etsuro SUZUKI, Kenji TAKAHASHI
  • Publication number: 20150138700
    Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, a flexible substrate. In one example, a wearable device may include a framework configured to be worn or attached, and a flexible substrate coupled to the framework. The flexible substrate may include a first end and a second end, and may include one or more conductive layer structures and a conductive laminate structure. The flexible substrate may include rigid regions configured to receive one or more components including a sensor, an electrode, and/or a logic circuit (e.g., bioimpedance logic circuit).
    Type: Application
    Filed: November 13, 2014
    Publication date: May 21, 2015
    Applicant: AliphCom
    Inventors: Dileep Goyal, Mihai Ionescu, Hari N. Chakravarthula
  • Publication number: 20150131235
    Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.
    Type: Application
    Filed: April 24, 2014
    Publication date: May 14, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Jae YOO, Eun Jung JO, Jae Hyun LIM
  • Publication number: 20150131206
    Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.
    Type: Application
    Filed: March 4, 2014
    Publication date: May 14, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ho Kwak, Hun Chol Jung, Jeong Oh Hong, Sung Soo Cha, Hee Dong Myung, Hee Sung Choi
  • Patent number: 9028736
    Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: May 12, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngshin Choi, Kikwon Jeong
  • Patent number: 9022773
    Abstract: A device and method for manufacturing integrated circuit packaging using a mold plunger with position compensation in a manufacturing setting. In an embodiment, a compensating mold plunger, which may be used during the manufacture of an integrated circuit package, engages a die set on a carrier and within a bushing. This may be done to inject a mold compound on top of the die/carrier. If the bushing that is housing the die/carrier tandem is misaligned with the plunger in any lateral direction, the amount of pressure may be compromised. A compensating mold plunger includes a flexible portion that allows for the head of the plunger to properly engage the die/carrier despite any possible misalignments. Further, different die/carrier combinations may also be used with a compensating mold plunger because the pressure and force applied may be uniform inside a bushing despite the contents of the bushing.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: May 5, 2015
    Assignee: STMicroelectronics, Inc.
    Inventors: Aaron Cadag, BernieChrisanto Ang, Richard Laylo
  • Publication number: 20150115311
    Abstract: The present invention relates to a film-like thermosetting silicone sealing material for sealing a semiconductor element by means of compression molding, the sealing material having an initial torque value of less than 15 dN·m as measured by an MDR (Moving Die Rheometer) at a molding temperature of from room temperature to 200° C., to a method for producing an LED by means of compression molding using the same, and to an LED produced by this method. The sealing material has excellent moldability, causes no problems such as overflow from a die, and has no defects such as voids.
    Type: Application
    Filed: April 23, 2013
    Publication date: April 30, 2015
    Inventors: Shin Yoshida, Masaaki Amako
  • Publication number: 20150108223
    Abstract: A radio frequency identification (RFID) collar comprising a radio identification tag including an antenna and a RFID chip electrically interconnected; an elastic surface including an elastically deformable opening for fitting a pipe therethrough; and a rim peripherally surrounding said elastic surface and including said antenna embedded therein.
    Type: Application
    Filed: May 3, 2012
    Publication date: April 23, 2015
    Applicant: Petratec International Ltd.
    Inventor: Shimon Weitzhandler
  • Patent number: 8986588
    Abstract: The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: March 24, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Kenji Uchida, Koki Hirasawa
  • Publication number: 20150080989
    Abstract: A method (100) of moulding an article comprises: forming (104) a first portion (2) of the article by injecting a first material (50) into a first mould (61), the first mould being shaped so as to define a flange (8) on the first portion of the article; placing (106) the first portion of the article into a second mould (91), the second mould having a first plate (90) and a second plate (92); compressing (108) the flange between the first and second plates of the second mould; and forming (110) a second portion (4) of the article by injecting a second material (55) into the second mould whilst the flange is compressed between the first and second plates of the second mould.
    Type: Application
    Filed: March 22, 2013
    Publication date: March 19, 2015
    Inventor: Louise Mohn
  • Patent number: 8980154
    Abstract: A method of making a twist-on wire connector including a method of making a sealant containing twist-on wire connector by in situ formation of a shell around the coil wherein a sealant may be injected into a cavity in the coil prior to removing the shell from the mold to form a ready-to-use sealant containing twist on wire connector without further steps outside the mold.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: March 17, 2015
    Assignee: The Patent Store LLC
    Inventors: Lloyd Herber King, Jr., William Hiner, James C. Keeven
  • Publication number: 20150069673
    Abstract: An electrosurgical instrument is manufactured by presenting an electrode, and attaching a sacrificial portion to the electrode to form a first electrode assembly. An insulating material is moulded over the first electrode assembly to form a second electrode assembly, and the second electrode assembly is subjected to a further process which is capable of removing the sacrificial portion without removing the insulating material. The sacrificial portion is removed to form at least one cavity within the electrosurgical instrument.
    Type: Application
    Filed: November 14, 2014
    Publication date: March 12, 2015
    Inventor: David Wyn MORRIS
  • Patent number: 8974224
    Abstract: Method and apparatus for overmolding delicate parts are disclosed. A mold unit for an injection molding apparatus can be provided. The mold unit can include a clamping mechanism and a locking mechanism. The clamping mechanism can be positioned in contact with the delicate part. The position of the clamping mechanism can be selected such that the clamping mechanism does not exert a force that damages the delicate part. The delicate part can vary in size from part to part. Thus, as the overmolding process is repeated, the position that is selected each time for the clamping mechanism can vary depending on the size of a part that is used. The locking mechanism can be configured to lock the clamping mechanism into the position selected for the part.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: March 10, 2015
    Inventor: Craig M. Stanley
  • Publication number: 20150061657
    Abstract: A position detector apparatus includes a detector part, wiring, a resin part, a resin body, a terminal, and a lead frame. The resin part has a thickness at a wiring side portion of the detector part that is greater than a thickness on a side opposite to the wiring side portion. Therefore, when injection-molding the resin part, due to a thickness change of the resin part, the detector part is pressed against a metal mold and a position of the detecting part is fixed. Further, the resin body has a thick-resin portion and a thin-resin portion. The thickness of the thin-resin portion allows a predetermined amount of dislocation of the detector part. Therefore, if the detector part is exposed, water is prevented from intruding the lead frame and the terminal.
    Type: Application
    Filed: August 27, 2014
    Publication date: March 5, 2015
    Inventors: Tomoyuki TAKIGUCHI, Ninh Duc HOANG, Yoshiyuki KONO, Takehito MIZUNUMA
  • Publication number: 20150041263
    Abstract: A magnetic viscous fluid damper includes: a cylinder; a piston that is slidably interposed within the cylinder; two fluid chambers that are partitioned by the piston; a hollow rod that is coupled to the piston; an electromagnetic coil that is formed with a magnet wire wound around the piston; two lead wires that extend from both ends of the magnet wire; and a coil assembly in which the electromagnetic coil and the two lead wires are embedded in a mold resin. The piston includes a hollow first core coupled to the rod and a second core that sandwiches the coil assembly with the first core. The two lead wires are passed through the inside of the first core and are electrically continuous with an electric wire passed through the inside of the rod.
    Type: Application
    Filed: December 3, 2012
    Publication date: February 12, 2015
    Applicant: KAYABA INDUSTRY CO., LTD.
    Inventor: Keiji Saito
  • Patent number: 8945451
    Abstract: Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: February 3, 2015
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jeevan M. Prasannakumar, Richard P. Nelson
  • Publication number: 20150016838
    Abstract: A process cartridge including a first frame member molded by pouring a resin from a gate; a conductive sheet adhered integrally to a sheet adhering portion of the first frame member by molding of the resin; and a second frame member configured to define a toner storage portion by being coupled with the first frame member, wherein, the first frame member includes a bent portion at the sheet adhering portion, and a portion of the first frame member different in thickness is provided at an adjacent position to the adhering portion.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Inventor: Kosuke Nishino
  • Publication number: 20150017372
    Abstract: The present invention is to provide a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component that enable the manufacture of a resin-encapsulated electronic component including a plate-like member in a simple manner at low cost. The method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member 13, the method includes: placing a resin 15 on the plate-like member 13; transferring the resin 15 to a position of a die cavity 17a of a molding die in a state where the resin 15 is placed on the plate-like member 13; and performing resin-encapsulation of an electronic component by subjecting the resin 15 to compression molding together with the plate-like member 13 and the electronic component in a state where the electronic component is soaked in the resin 15 placed on the plate-like member 13 in the die cavity 17a.
    Type: Application
    Filed: November 8, 2012
    Publication date: January 15, 2015
    Applicant: TOWA CORPORATION
    Inventors: Hiroshi Uragami, Keita Mizuma, Ichitaro Okamoto, Naoki Takada, Mamoru Nakamura, Shinsuke Yasuda
  • Patent number: 8916079
    Abstract: A method for producing an electronic component includes: providing at least one carrier element having a microcomponent receptacle configured for contacting at least one microcomponent, injection molding a housing around the carrier element, the microcomponent receptacle being situated in a cavity of the housing that is open on at least one side, introducing the microcomponent into the microcomponent receptacle in the cavity to contact the microcomponent to the carrier element, and injecting the cavity using a filler material to fix the microcomponent in the housing and in the microcomponent receptacle.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: December 23, 2014
    Assignee: Robert Bosch GmbH
    Inventor: Ronny Ludwig
  • Patent number: 8911652
    Abstract: A method of sealing coil leads during encapsulation by placing a lead of a coil in a tube, such that there remains a gap between the lead and the tube; placing the coil in a mold such that the gap remains open to an environment surrounding the mold; and injecting encapsulation material into the closed mold in a liquid state under pressure, thereby causing the material to flow through the gap toward the environment. Injecting encapsulation material into the mold may be done at a rate, temperature, and/or environmental temperature to cause the material to solidify before passing through the gap into the environment. In any case, there is no need to seal the mold to the leads. Each lead of the coil may be placed into an individual tube and/or the tubes may be is formed within a single sleeve.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 16, 2014
    Assignee: Automatic Switch Company
    Inventors: Stanley B. Roedel, Eugene Gaw, Vincent Cole
  • Publication number: 20140334658
    Abstract: A wireless ear-hook headset includes a flexible tube, a receiver and a transceiver. The flexible tube has a cable, a first fixing binder fixed on one end of the cable, a second fixing binder fixed on the other end of the cable, and an outer layer. The cable has at least one shapeable metallic wire, a plurality of signal wires and an insulating cover layer. The outer layer has two ends which are fixedly connected with the first and second fixing binders respectively and fully covering the cable. The receiver is connected to the first fixing binder of the flexible tube. The transceiver is connected to the second fixing binder of the flexible tube. The present invention also discloses the flexible tube structure and a method for manufacturing the flexible tube.
    Type: Application
    Filed: August 7, 2013
    Publication date: November 13, 2014
    Applicants: LITE-ON TECHNOLOGY CORPORATION, LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
    Inventors: CHUNG-MING WANG, CHE-CHENG CHANG
  • Patent number: 8881387
    Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: November 11, 2014
    Assignee: Apple Inc.
    Inventors: Gloria Lin, Wyeman Chen, Michael Nikkhoo, Michael Rosenblatt, Hammid Mohammadinia, Ziv Wolkowicki, Amir Salehi
  • Publication number: 20140329399
    Abstract: A connector (1) includes: a terminal receiving chamber (3) provided in a connector housing (2) and configured to receive therein (3) a terminal; and a potting material filling portion (9) provided in the terminal receiving chamber (3) with a potting material filled in the potting material filling portion (9), thus allowing the potting material filling portion (9) to seal the terminal receiving chamber (3). With respect to the potting material filling portion (9), based on an occurring stress characteristic showing a filling amount of the potting material relative to a stress occurring in the potting material filling portion (9) and based on a peel strength characteristic showing the filling amount of the potting material relative to a peel strength of the potting material filling portion (9), the filling amount of the potting material is set within such a range as that the peel strength becomes larger than the occurring stress.
    Type: Application
    Filed: November 5, 2012
    Publication date: November 6, 2014
    Inventors: Hideki Ohsumi, Kazuhide Takahashi, Shigeru Tanaka, Haruki Tsuchiya
  • Publication number: 20140327458
    Abstract: A method of manufacturing an electronic circuit with an integrally formed capability of providing information indicative of a value of a current flowing in the electronic circuit, wherein the method comprises forming an electrically conductive wiring structure on a substrate, configuring a first section of the wiring structure for contributing to a predefined use function of the electronic circuit, and configuring a second section of the wiring structure for providing information indicative of the value of the current flowing in the electronic circuit upon applying a stimulus signal to the second section, wherein at least a part of the configuring of the first section and the configuring of the second section is performed simultaneously.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 6, 2014
    Inventors: Martin GRUBER, Angela Kessler
  • Publication number: 20140320845
    Abstract: The invention relates to an optical measuring device (1) having a housing (3), in which at least one optical emitter (20) for emitting at least one emission beam (22, 24) and at least one optical receiver are arranged, wherein a cover disc (5) terminates the housing and forms an emission window (10) and a reception window (7), wherein the at least one emission beam (22, 24) exits from the housing through the emission window (10), wherein the receiver receives the emission beam, which is reflected from the surroundings, as a reception beam through the reception window (7), and wherein the cover disc (5) has a heating assembly (20), and a corresponding method for producing a cover disc (5) for the optical measuring device (1).
    Type: Application
    Filed: November 30, 2012
    Publication date: October 30, 2014
    Applicant: Valeo Schalter und Sensoren GmbH
    Inventors: Heiner Bayha, Peter Horvath, Jens Nicolai, Andreas Reichert
  • Publication number: 20140309548
    Abstract: The invention provides an implantable multi-electrode device (300) and related methods and apparatuses. In one embodiment, the invention includes an implantable device (300) comprising: an assembly block (320); and a plurality of leads (340 . . . 348) radiating from the assembly block (320), each of the plurality of leads (340 . . . 348) containing at least one electrode (342A), such that the electrodes are distributed within a three-dimensional space, wherein the assembly block (320) includes a barb (350) for anchoring the assembly block (320) within implanted tissue.
    Type: Application
    Filed: June 26, 2014
    Publication date: October 16, 2014
    Applicant: SAPIENS STEERING BRAIN STIMULATION B.V.
    Inventors: Matthias Merz, Youri V. Ponomarev, Remco H.W. Pijnenburg
  • Patent number: 8859341
    Abstract: A semiconductor chip which is mounted on a wiring substrate and which is electrically connected to the wiring substrate is disposed in a sealing apparatus. A sealing resin material made of a thermosetting resin composition is supplied into the sealing apparatus. The sealing resin material contains a solid foreign matter having a cured product of a thermosetting resin, and includes particulates of the thermosetting resin composition pulverized with the solid foreign matter, a granulation powder of the particulates, or a preform of the particulates. The semiconductor chip is resin sealed by using the sealing resin material.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: October 14, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuuki Kuro, Makoto Minaminaka
  • Patent number: 8846183
    Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: September 30, 2014
    Assignee: California Institute of Technology
    Inventors: Marc A. Unger, Hou-Pu Chou, Todd A. Thorsen, Axel Scherer, Stephen R. Quake
  • Publication number: 20140259271
    Abstract: Methods for embedding an electronic device in a frame enclosure and wearable apparatuses using the same are disclosed. The method includes: providing a first substrate and a second substrate; shaping at least one of the first substrate or the second substrate according to a second predetermined pattern; disposing the electronic device between the first substrate and the second substrate; compressing the first substrate and the second substrate together, wherein the electronic device is sandwiched by the compression between the first substrate and the second substrate; and heating the assembly of the first substrate, the electronic device, and the second substrate.
    Type: Application
    Filed: March 17, 2014
    Publication date: September 18, 2014
    Applicant: CAPE EVOLUTION LIMITED
    Inventors: Christopher David Cox, Benoit Chirouter
  • Publication number: 20140255634
    Abstract: A housing includes a substrate and a protective layer. The protective layer is formed on the substrate. The substrate includes a first member and a second member, the first member is made of plastic and the second member is made of metal. The protective layer is made of silicone rubber and is formed on the second member of the substrate. The protective layer has a peripheral waterproof portion covering a peripheral edge of the substrate.
    Type: Application
    Filed: August 23, 2013
    Publication date: September 11, 2014
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventor: LI-HONG NA
  • Patent number: 8830665
    Abstract: Methods and apparatus for forming a housing, such as for an electronic device, from multi-layer materials are disclosed. The multi-layer materials include at least two layers. Typically, one or more of the layers are metal. However, different layers of the multi-layer materials can be different metals. In one embodiment, an inner layer of the multi-layer materials can be provided with or form internal features that can be for attaching parts or components to the multi-layer materials. In another embodiment, processing of an inner layer of the multi-layer materials can facilitate part formation with increased curvature and/or internal part clearance. In another embodiment, the multi-layer materials can include an intermediate layer that facilitates creation of internal features that can be for attaching parts or components to the multi-layer materials.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: September 9, 2014
    Assignee: Apple Inc.
    Inventors: Stephen B. Lynch, John B. Filson, Stephen P. Zadesky, Douglas J. Weber
  • Patent number: 8820359
    Abstract: A fluid storage and transport module includes complex plumbing features such as fluid reservoirs, filters, heat exchangers, three-dimensionally routed tubing, valves, mixing chambers, and exit apertures formed in and on a monolithic common bulk material using an additive rapid prototyping process of depositing multiple layers of rapid prototyping materials without welds, adhesives or compression fittings, being made by a method that minimizes leaks, maximizes packing density of the functional components, and increases the plumbing robustness to leaks.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: September 2, 2014
    Assignee: The Aerospace Corporation
    Inventor: David A. Hinkley
  • Patent number: 8776365
    Abstract: A method of manufacturing a terminal block for a telecommunication cable, which includes providing a housing having a front side and a back side and positioning multiple pairs of electrical connectors in the housing such that one end of each of the electrical connectors is exposed on the front side of the housing and one end of the connector is exposed on the back side of the housing. Each of electrical connectors having an insulation displacement contact terminal on the end exposed on the back side of the housing, and connecting multiple pairs of insulated electrical wires to the connectors on the back side of the housing. A dielectric material is pressure molded on the back side of the housing to encapsulate the connections of the wires and the connectors on the back side of the housing.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: July 15, 2014
    Assignee: Channell Commercial Corporation
    Inventors: William H. Channell, Sr., Edward J. Burke
  • Publication number: 20140190742
    Abstract: An objective is to achieve a configuration for mounting a wire harness in a vehicle to protect the wire harness and regulate a path in a simpler manner with fewer components. A wire harness has a wire harness main body including at least one wire, and a protection member protecting the wire harness main body. The protection member includes an inner peripheral protection portion formed by hot-pressing a nonwoven member in a state of covering at least a portion of the wire harness main body and an outer peripheral protection portion formed by hot-pressing a nonwoven member in a state of covering at least a portion of the inner peripheral protection portion in an extending direction.
    Type: Application
    Filed: April 16, 2012
    Publication date: July 10, 2014
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Yasuhiro Kajiwara
  • Patent number: 8771573
    Abstract: The invention relates to a method for producing a plastic housing, where at least one first plastic housing part with at least one guide or bearing for at least one mechanically movable component, in particular a sensor, is produced in a first molding step, the at least one first plastic housing part is overmolded in a second molding step while a second plastic housing part is being formed, in order to form an integral plastic housing. Moreover, the invention relates to a plastic housing with at least one first plastic housing part including at least one guide or bearing for at least one mechanically movable component, where the at least one plastic housing part is entirely or partially overmolded by a second plastic housing part so that the integral plastic housing is formed.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: July 8, 2014
    Assignee: Preh GmbH
    Inventors: Bernhard Knüttel, Annegret Suckfüll