FIN ASSEMBLY

Abstract

A fin assembly includes multiple first fins, multiple second fins and a heat pipe. An interval is formed between every two of the first fins which are neighboring to each other. The first fins and the second fins are alternately arranged with each other. The heat pipe penetrates through the plurality of first fins and the plurality of second fins. A partial volume of each second fin is disposed inside each interval, respectively.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201410707443.4 filed in China on Nov. 27, 2014, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

TECHNICAL FIELD OF THE INVENTION

The disclosure relates to a fin assembly. More particularly, the disclosure relates to a fin assembly with multiple first fins and multiple second fins that are alternatively arranged, and a part of each second is between two of the first fins neighboring to each other.

DESCRIPTION OF THE RELATED ART

Since a new design concept has been established to make an electronic device become smaller in size and lighter in weight, electronic components inside the electronic device have developed to be miniaturized accordingly. However, since the electronic components are miniaturized, the electronic components are too crowded inside the electronic device. Namely, gaps between the electronic components are narrowed. Hence, heat generated by the electronic components is hard to be dissipated outside efficiently through the gaps.

The electronic device works unsteadily and ineffectively and the life spans of the electronic components are shortened at a high temperature. Because of that, the electronic device is usually equipped with a heat dissipation device. In recent years, the heat dissipation device is formed by fins and a heat pipe, to dissipate the heat generated by the electronic components. For example, each fin has a through hole, the heat pipe penetrates the through hole of each fin and is welded to the fins with a heat conduction medium (such as a solder paste).

However, it is difficult to control the amount of the solder paste. When too much solder paste is pasted on the heat pipe and the through holes, the solder paste will overflow. Accordingly, the appearance of the heat dissipation device is affected, and the heat dissipation efficiency of the heat dissipation device may be reduced. Conversely, when little solder paste is pasted on the heat pipe and the through holes, the heat pipe cannot be fixed to the fins tightly, such that the heat dissipation efficiency of the heat dissipation device will be reduced. Moreover, to improve the efficiency of heat dissipation of the heat dissipation device, an interval between every two of the fins is increased. Thus, solder balls are easily formed by the solder paste and further make the electronic components (such as printed circuit board) short-circuited. Consequently, the appearance and the efficiency of heat dissipation of the heat dissipation device is also affected.

Hence, in order to improve the heat dissipation efficiency of the heat dissipation device, a new heat dissipation device needs to be developed.

SUMMARY OF THE INVENTION

One aspect of the disclosure provides a fin assembly which comprises a plurality of first fins, a plurality of second fins and a heat pipe. An interval is formed between every two of the plurality of first fins which are neighboring to each other. The plurality of first fins and the plurality of second fins are alternately arranged with each other. The heat pipe penetrates through the plurality of first fins and the plurality of second fins. A partial volume of each second fin is disposed inside each interval, respectively.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only and thus are not limitative of the present disclosure and wherein:

FIG. 1 is a perspective view of a fin assembly according to a first embodiment of the disclosure;

FIG. 2 is an exploded view of the fin assembly in FIG. 1;

FIG. 3 is a top view of the fin assembly in FIG. 1;

FIG. 4A is a front view of a first fin according to the first embodiment of the disclosure;

FIG. 4B is a front view of a second fin according to the first embodiment of the disclosure;

FIG. 5A is a front view of a first fin according to a second embodiment of the disclosure;

FIG. 5B is a front view of a second fin according to the second embodiment of the disclosure;

FIG. 6A is a front view of a first fin according to a third embodiment of the disclosure;

FIG. 6B is a front view of a second fin according to the third embodiment of the disclosure;

FIG. 7A is a front view of a first fin according to a fourth embodiment of the disclosure; and

FIG. 7B is a front view of a second fin according to the fourth embodiment of the disclosure.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawings.

Please refer to FIG. 1 through FIG. 4B. FIG. 1 is a perspective view of a fin assembly according to a first embodiment of the disclosure. FIG. 2 is an exploded view of the fin assembly in FIG. 1. FIG. 3 is a top view of the fin assembly in FIG. 1. FIG. 4A is a front view of a first fin according to the first embodiment of the disclosure. FIG. 4B is a front view of a second fin according to the first embodiment of the disclosure. In this embodiment, the fin assembly 1 comprises a plurality of first fins 11, a plurality of second fins 12, a heat pipe 13 and a solder 14.

As shown in FIG. 4A, each first fin 11 has a first surface 111 and a first through hole 112. An interval 113 is formed between every two of the first fins 11 which are neighboring to each other. Additionally, the first fins are arranged as being equidistant from one another. In this embodiment, each first fin 11 is a rectangular plate, and each first through hole 112 is a cylinder through hole. Each first through hole 112 is located away from a center C1 of each first fin 11. However, the disclosure is not limited to the shapes of the first fins 11 and the positions of the first through holes 112.

As shown in FIG. 4B, each second fin 12 has a second surface 121 and a second through hole 122. The second fins are arranged as being equidistant from one another. Moreover, the first fins 11 and the second fins 12 are alternately arranged with each other. In this embodiment, each second fin 12 is also a rectangular plate, and each second through hole 122 is also a cylinder through hole. Each second through hole 122 is located away from a center C2 of each second fin 12. However, the disclosure is not limited to the shapes of the second fins 12 and the positions of the first through holes 112.

Furthermore, a partial volume of each second fin 12 is disposed inside each interval 113, respectively. Accordingly, a projection area (not shown in FIGs.) is formed inside the interval 113 by projecting each first surface 111 of each first fin 11 on each second surface 121 of each second fin 12, and an area ratio of the projection area to an area of each second surface 121 is between 1% and 30%. For example, both the areas of each second surface 121 of each second fin 12 and an area of each first surface 111 of each first fin 11 are A1, and both thicknesses of each second fin 12 and each first fin 11 are T1. When 25 percent of second fin 12 (that is, 0.25×A1 ×T1) is located inside each interval 113, the area of each projection area is 25 percent of the area of the second surface 121 (that is, 0.25×A1).

The heat pipe 13 has an external surface 131, and the heat pipe 13 penetrates through the first through holes 112 of the first fins 11 and the second through holes 122 of the second fins 12. The external surface 131 of the heat pipe 13 has a plurality of first connecting parts 132 and a plurality of second connecting parts 133. The first fins 11 and the second fins 12 are assembled with the heat pipe 13 over the first connecting parts 132 and the second connecting parts 133, respectively. In this embodiment, the first connecting parts 132 and the second connecting parts 133 are, but not limited to, ring-shaped.

The solder 14 continuously covers a section of the heat pipe 13 inside each interval 113, for fixing the first fins 11 and the second fins 12 to the heat pipe 13 steadily.

The disclosure is not limited to the shapes of the first fins 11 and the second fins 12, and the positions of the first through holes 112 and the second through holes 122 mentioned above. The following describes another embodiment of the disclosure. Please refer to FIG. 5A and FIG. 5B, FIG. 5A is a front view of a first fin according to a second embodiment of the disclosure and FIG. 5B is a front view of a second fin according to the second embodiment of the disclosure.

As shown in FIG. 5A, each first fin 21 has a first surface 211 and a first through hole 212. An interval (not shown in FIGs.) is formed between every two of the first fins 21 which are neighboring to each other. In this embodiment, each first fin 21 is a rectangular plate, and each first through hole 212 is a cylinder through hole. Different from the first embodiment, each first through hole 212 is located at a center C3 of each first fin 21 in this embodiment.

As shown in FIG. 5B, each second fin 22 has a second surface 221 and a second through hole 222. In this embodiment, each second fin 22 is also a rectangular plate, and each second through hole 222 is also a cylinder through hole. Different from the first embodiment, each second through hole 222 is located at a center C4 of each second fin 22, and a surface area of each first fin 21 is less than a surface area of each second fin 22 in this embodiment.

Similar to the first embodiment, in this embodiment, a projection area (not shown in FIGs.) is formed inside the interval (not shown in FIGs.) by projecting each first surface 211 of each first fin 21 on each second surface 221 of each second fin 22, and an area ratio of the projection area to an area of each second surface 221 is also between 1% and 30%.

Except the first fins 21 and the second fins 22, other components, which are not mentioned in this embodiment, are similar to the first embodiment (please refer to FIG. 1 through FIG. 4B), such that they will not be repeated again.

Moreover, please refer to FIG. 6A and FIG. 6B. FIG. 6A is a front view of a first fin according to a third embodiment of the disclosure. FIG. 6B is a front view of a second fin according to the third embodiment of the disclosure.

Different from the first embodiment, in this embodiment, each first fin 31 comprises a first rectangular plate 311, a second rectangular plate 312 and a first through hole 313 (as shown in FIG. 6A). In one of the first fins 31, the first rectangular plate 311 is connected to the second rectangular plate 312. The first through hole 313 is located at a connection between the first rectangular plate 311 and the second rectangular plate 312. The connection between the first rectangular plate 311 and the second rectangular plate 312 is away from a center of the first fin 31. In other words, The connection between the first rectangular plate 311 and the second rectangular plate 312 is not located within the center of the first fin 31.

Additionally, in this embodiment, each second fin 32 comprises a third rectangular plate 321, a fourth rectangular plate 322 and a second through hole 313 (as shown in FIG. 6B). In one of the second fins 32, the third rectangular plate 321 is connected to the fourth rectangular plate 322. The second through hole 323 is located at a connection between the third rectangular plate 321 and the fourth rectangular plate 322. The connection between the third rectangular plate 321 and the fourth rectangular plate 322 is away from a center of each second fin 32.

Except the first fins 31 and the second fins 32, other components, which are not mentioned in this embodiment, are similar to the first embodiment (please refer to FIG. 1 through FIG. 4B), such that they will not be repeated again.

Furthermore, please refer to FIG. 7A and FIG. 7B. FIG. 7A is a front view of a first fin according to a fourth embodiment of the disclosure. FIG. 7B is a front view of a second fin according to the fourth embodiment of the disclosure.

Different from the first embodiment, in this embodiment, each first fin 41 comprises a first triangular plate 411, a second triangular plate 412 and a first through hole 413 (as shown in FIG. 7A). In one of the first fins 41, the first triangular plate 411 is connected to the second triangular plate 412. The first through hole 413 is located at a connection between the first triangular plate 411 and the second triangular plate 412. The connection between the first triangular plate 411 and the second triangular plate 412 is away from a center of each first fin 41.

Moreover, in this embodiment, each second fin 42 comprises a third triangular plate 421, a fourth triangular plate 422 and a second through hole 423 (as shown in FIG. 7B). In one of the second fins 42, the third triangular plate 421 is connected to the fourth triangular plate 422. The second through hole 423 is located at a connection between the third triangular plate 421 and the fourth triangular plate 422. The connection between the third triangular plate 421 and the fourth triangular plate 422 is far away from a center of the second fin 42.

Except the first fins 41 and the second fins 42, other components, which are not mentioned in this embodiment, are similar to the first embodiment (please refer to FIG. 1 through FIG. 4B), such that they will not be repeated again.

To sum up, a heat dissipation device in the prior art is formed by fins and a heat pipe to dissipate the heats generated by electronic components. However, it is difficult to control the amount of the solder paste. When too much solder paste is pasted on the heat pipe and the through holes, the solder paste will overflow. Accordingly, the appearance of the heat dissipation device will be affected, and the heat dissipation efficiency of the heat dissipation device will be reduced. According to the embodiments of the disclosure, since the fin assembly comprises the plurality of first fins and the plurality of second fins, and the partial volume of the second fins are disposed inside the intervals, respectively. When the first fins and the second fins are welded to the heat pipe with the solder, a solder ball is not formed at the same time. Accordingly, the appearance and the heat dissipation efficiency of the fin assembly are improved.

The disclosure will become more fully understood from the said embodiment for illustration only and thus does not limit the disclosure. Any modifications within the spirit and category of the disclosure fall in the scope of the disclosure.

Claims

1. A fin assembly, comprising:

a plurality of first fins, an interval being formed between every two of the plurality of first fins which are neighboring to each other;

a plurality of second fins, the plurality of first fins and the plurality of second fins being alternately arranged with each other; and

a heat pipe penetrating through the plurality of first fins and the plurality of second fins;

wherein a partial volume of each second fin is disposed inside each interval, respectively.

2. The fin assembly according to claim 1, wherein the plurality of first fins are arranged as being equidistant from one another, and the plurality of second fins are arranged as being equidistant from one another.

3. The fin assembly according to claim 1, wherein each first fin comprises a first surface, each second fin comprises a second surface, a projection area is formed inside the interval by projecting each first surface on each second surface, and an area ratio of the projection area to an area of the second surface is between 1% and 50%.

4. The fin assembly according to claim 3, wherein the area ratio of the projection area to the area of the second surface is between 1% and 30%.

5. The fin assembly according to claim 1, wherein each first fin comprises a first through hole, each second fin comprises a second through hole, and the heat pipe penetrates through each first through hole of each first fin and each second through hole of each second fin, respectively.

6. The fin assembly according to claim 5, wherein each first fin and each second fin are rectangular plates, each first through hole is located at a center of each first fin, and each second through hole is located at a center of each second fin.

7. The fin assembly according to claim 5, wherein each first fin and each second fin are rectangular plates, each first through hole is located far away from a center of each first fin, and each second through hole is located far away from a center of each second fin.

8. The fin assembly according to claim 7, wherein each first fin comprises a first rectangular plate and a second rectangular plate which are connected to each other, each second fin comprises a third rectangular plate and a fourth rectangular plate which are connected to each other, the first through hole is located at a connection between the first rectangular plate and the second rectangular plate, and the second through hole is located at a connection between the third rectangular plate and the fourth rectangular plate.

9. The fin assembly according to claim 7, wherein each first fin comprises a first triangular plate and a second triangular plate which are connected to each other, each second fin comprises a third triangular plate and a fourth triangular plate which are connected to each other, the first through hole is located at a connection between the first triangular plate and the second triangular plate, and the second through hole is located at a connection between the third triangular plate and the fourth triangular plate.

10. The fin assembly according to claim 1, further comprising a solder continuously covering a section of the heat pipe inside the interval.