Package
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The evenly-dashed broken lines in the figures depict portions of the package which form no part of the claimed design.
The evenly-dashed broken lines which surround claimed surface pattern ornamentation in
The dot-dash broken lines encircling portions of the claimed design that are illustrated in enlargements form no part of the claimed design.
Claims
We claim the ornamental design for a package, as shown and described.
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Type: Grant
Filed: Jun 3, 2020
Date of Patent: Oct 24, 2023
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Dae-Hee Yoon (Suwon-si), Soo-Hyun Whang (Suwon-si), Sung-Do Son (Suwon-si)
Primary Examiner: Andrew Kerr
Assistant Examiner: Chariton Alexakis
Application Number: 29/736,833