Package
Latest Samsung Electronics Patents:
Description
Claims
We claim the ornamental design for a package, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D873133
Type: Grant
Filed: Sep 27, 2017
Date of Patent: Jan 21, 2020
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Ee-Na Kim (Seoul), Tae-Ho Kim (Seoul), Jong-Yun Shin (Seoul)
Primary Examiner: Michael C Stout
Assistant Examiner: Omeed Agilee
Application Number: 29/619,099
Type: Grant
Filed: Sep 27, 2017
Date of Patent: Jan 21, 2020
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Ee-Na Kim (Seoul), Tae-Ho Kim (Seoul), Jong-Yun Shin (Seoul)
Primary Examiner: Michael C Stout
Assistant Examiner: Omeed Agilee
Application Number: 29/619,099
Classifications
Current U.S. Class:
D9/432;
D9/433