Semiconductor module
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Description
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims
The ornamental design for a semiconductor module, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- Notification to Make Rectification issued for Chinese Patent Application No. 202130619661.3, dated Jul. 24, 2023, 3 pages including English machine translation.
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Patent History
Patent number: D1013648
Type: Grant
Filed: Sep 16, 2021
Date of Patent: Feb 6, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Yoshihisa Tsukamoto (Kyoto)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/808,055
Type: Grant
Filed: Sep 16, 2021
Date of Patent: Feb 6, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Yoshihisa Tsukamoto (Kyoto)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/808,055
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)