Semiconductor module

Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor module showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side view thereof;

FIG. 8 is a left side view thereof;

FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5;

FIG. 10 is a cross-sectional view taken along line 10-10 in FIG. 5;

FIG. 11 is a front, top and right side perspective view of a second embodiment of a semiconductor module showing our new design;

FIG. 12 is a rear, bottom, and left side perspective view thereof;

FIG. 13 is a front view thereof;

FIG. 14 is a rear view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof;

FIG. 17 is a right side view thereof;

FIG. 18 is a left side view thereof;

FIG. 19 is a cross-sectional view taken along line 19-19 in FIG. 15; and,

FIG. 20 is a cross-sectional view taken along line 20-20 in FIG. 15.

The broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines in FIG. 2 and FIG. 6 is transparent.

Claims

The ornamental design for a semiconductor module, as shown and described.