Power semiconductor module
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Description
The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims
The ornamental design for a power semiconductor module, as shown and described.
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Patent History
Patent number: D1030686
Type: Grant
Filed: Sep 20, 2021
Date of Patent: Jun 11, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventors: Yuki Nakano (Kyoyo), Yasunori Kutsuma (Kyoyo), Kenji Yamamoto (Kyoyo)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/808,479
Type: Grant
Filed: Sep 20, 2021
Date of Patent: Jun 11, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventors: Yuki Nakano (Kyoyo), Yasunori Kutsuma (Kyoyo), Kenji Yamamoto (Kyoyo)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/808,479
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)