Electronic device
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
The evenly-dashed broken lines in the figures depict portions of the electronic device that form no part of the claimed design. The dot-dash broken lines in the figures represent a boundary of the claimed design and form no part of the claimed design. The dot-dot-dash broken lines encircling portions of the claimed design that are illustrated in enlargements form no part of the claimed design.
Claims
We claim the ornamental design for an electronic device, as shown and described.
D788773 | June 6, 2017 | Seo |
D797729 | September 19, 2017 | Park |
D807874 | January 16, 2018 | Seoc |
D811382 | February 27, 2018 | Cai |
10061359 | August 28, 2018 | Määttä |
D828319 | September 11, 2018 | Seo |
D834009 | November 20, 2018 | Itou |
D926150 | July 27, 2021 | Xie |
D934855 | November 2, 2021 | Hallar |
11256304 | February 22, 2022 | Mehandjiysky |
11366498 | June 21, 2022 | Shibayama |
D975087 | January 10, 2023 | Seo |
D976900 | January 31, 2023 | Escolin |
20200162596 | May 21, 2020 | Kim |
- Gizmochina.com, Samsung's new Flex Hinge for Foldables explained, first available Jul. 29, 2023 [online], retrieved Feb. 29, 2024, available at URL: https://www.gizmochina.com/2023/07/29/samsung-flex-hinge-galaxy-z-fold5-flip5-explanation-engineering/ (Year: 2023).
Type: Grant
Filed: Jan 21, 2021
Date of Patent: Jul 30, 2024
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Jooho Seo (Suwon-si), Donghun Kim (Suwon-si), Jaehyuk Lee (Suwon-si)
Primary Examiner: Wendy L Arminio
Assistant Examiner: Carrie S Gelula
Application Number: 29/767,259