Headphone

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Description

FIG. 1 is a perspective view of a headphone showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment in which the design resides; the broken lines form no part of the claimed design.

Claims

The ornamental design for a headphone as shown and described.

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Patent History
Patent number: D1051089
Type: Grant
Filed: Dec 16, 2022
Date of Patent: Nov 12, 2024
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventor: Laurent Lindenberger (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/868,926
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)