Headphone
Latest Anker Innovations Technology Co., Ltd. Patents:
Description
The broken lines shown in the drawings are included for the purpose of illustrating portions of the headphone that form no part of the claimed design.
Claims
The ornamental design for a headphone as shown and described.
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Foreign Patent Documents
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- “Sony MDR-7506 Headphones”; bhphotovideo.com; retrieved Jul. 5, 2023; published date unkown, prior to the filing date of the present Application; URL: <https://www.bhphotovideo.com/c/product/49510-REG/Sony_MDR_7506_MDR_7506_Headphone.html>.
Patent History
Patent number: D1070805
Type: Grant
Filed: Jul 5, 2023
Date of Patent: Apr 15, 2025
Assignee: Anker Innovations Technology Co., Ltd. (Changsha)
Inventors: Wu Xu (Shenzhen), Zheng Wei (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/896,552
Type: Grant
Filed: Jul 5, 2023
Date of Patent: Apr 15, 2025
Assignee: Anker Innovations Technology Co., Ltd. (Changsha)
Inventors: Wu Xu (Shenzhen), Zheng Wei (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/896,552
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)