Heat dissipation module

- Acer Incorporated
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Description

FIG. 1 is a front perspective view of a heat dissipation module showing our new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof;

FIG. 9 is an enlarged view of the portion, labeled ‘9’ of FIG. 1; and,

FIG. 10 is a cross-sectional view taken along line 10-10 in FIG. 3.

The even-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The long-dash short-dash broken lines in FIGS. 1 and 9 represent the extents of the enlarged detail view and form no part of the claimed design.

Claims

The ornamental design for a heat dissipation module as shown and described.

Referenced Cited
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Foreign Patent Documents
230745-0001 April 2024 TW
230746-0001 April 2024 TW
Other references
  • PNY GeForce RTX, posted Aug. 18, 2023, retrieved Apr. 23, 2025 (online), https://www.amazon.com/PNY-GeForce-RTXTM-Verto-Graphics/dp/B0CG2MX5H9 (Year: 2023).
Patent History
Patent number: D1096673
Type: Grant
Filed: Nov 24, 2023
Date of Patent: Oct 7, 2025
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Yu Lai (New Taipei), Yi-Heng Lee (New Taipei)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria′ L Simmons-Holloway
Application Number: 29/918,034
Classifications