Heat dissipation module
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The even-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The long-dash short-dash broken lines in
Claims
The ornamental design for a heat dissipation module as shown and described.
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Type: Grant
Filed: Nov 24, 2023
Date of Patent: Oct 7, 2025
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Yu Lai (New Taipei), Yi-Heng Lee (New Taipei)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria′ L Simmons-Holloway
Application Number: 29/918,034