Heat dissipation module

- Acer Incorporated
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Description

FIG. 1 is a front perspective view of a heat dissipation module showing our new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof; and,

FIG. 9 is an enlarged view of the portion, labeled ‘9’ of FIG. 1.

The evenly-dashed broken lines illustrate portions of the heat dissipation module that form no part of the claimed design. The dot-dashed broken lines depict the limits of the enlarged views and form no part for the claimed design.

Claims

The ornamental design for a heat dissipation module as shown and described.

Referenced Cited
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D1042778 September 17, 2024 Lai
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Foreign Patent Documents
308541318 March 2024 CN
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Other references
  • GeForce RTX 3060, posted date (unavailable), retrieved Apr. 23, 2025 (online), https://www.dateks.lv/en/cenas/videokartes/802906 (Year: 2025).
Patent History
Patent number: D1099054
Type: Grant
Filed: Jan 25, 2024
Date of Patent: Oct 21, 2025
Assignee: Acer Incorporated (New Taipei)
Inventors: Wei-Yu Lai (New Taipei), Yi-Heng Lee (New Taipei)
Primary Examiner: Justin M Jonaitis
Assistant Examiner: Bria′ L Simmons-Holloway
Application Number: 29/925,535
Classifications