Lid for a semiconductor package

Description

FIG. 1 is a bottom perspective view of a lid for a semiconductor package showing our new design;

FIG. 2 is another bottom perspective view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a front view thereof; and,

FIG. 8 is a rear view thereof.

Within the drawings, the broken lines show unclaimed portions of the lid for a semiconductor package, and thus form no part of the claimed design.

Claims

The ornamental design for a lid for a semiconductor package, as shown and described.