Lid for a microelectronic package

- IBM
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Description

FIG. 1 is a top plan view of a lid for a microelectronic package showing a first embodiment of my new design;

FIG. 2 is a side elevational view thereof, the opposite side being identical in appearance;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a bottom plan view of a lid for a microelectronic package showing a second embodiment of my new design, the only difference from the first embodiment residing in the appearance of the bottom.

Referenced Cited
U.S. Patent Documents
D206327 November 1966 Keys
D358805 May 30, 1995 Siegel et al.
D395638 June 30, 1998 Koyama et al.
3255055 June 1966 Ross
5055971 October 8, 1991 Fundala et al.
5089929 February 18, 1992 Hilland
Patent History
Patent number: D407382
Type: Grant
Filed: Oct 24, 1996
Date of Patent: Mar 30, 1999
Assignee: International Business Machines Corporation (Armonk, NY)
Inventors: John V. Acciaioli (Tucson, AZ), Myra M. Boenke (Hopewell Junction, NY), Larry D. Gross (Poughkeepsie, NY), Martin Marotti (Carmel, IN), John B. Pavelka (Austin, TX), Roland N. Zapfe (Rochester, MN)
Primary Examiner: Brian N. Vinson
Attorney: Steven J. Soucar
Application Number: 0/61,550
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1302;