Air-cooled supercomputing server
The broken lines in the figures show portions of the air-cooled supercomputing server that form no part of the claimed design.
Claims
The ornamental design for an air-cooled supercomputing server as shown and described.
| 6621709 | September 16, 2003 | Schnabel |
| D736198 | August 11, 2015 | Merbeth |
| 11259440 | February 22, 2022 | Chen |
| D973654 | December 27, 2022 | Li |
| D979561 | February 28, 2023 | Hu |
| D1046843 | October 15, 2024 | Tian |
| 12144154 | November 12, 2024 | Patel |
| 20030227755 | December 11, 2003 | Haworth |
| 20210274676 | September 2, 2021 | Chehade |
| 20210298195 | September 23, 2021 | Barbour |
| 20220043494 | February 10, 2022 | Yang |
| 20220046820 | February 10, 2022 | Yang |
| 20220304182 | September 22, 2022 | Pan |
| 20230085383 | March 16, 2023 | Zhang |
| 20230262944 | August 17, 2023 | Cheng |
| 20230389225 | November 30, 2023 | Kelly |
| 20240224473 | July 4, 2024 | Zhan |
| 20240344527 | October 17, 2024 | Caltabellotta |
| 20250284326 | September 11, 2025 | Li |
Type: Grant
Filed: Jul 23, 2024
Date of Patent: Sep 8, 2026
Assignee: Shenzhen MicroBT Electronics Technology Co., Ltd. (Shenzhen)
Inventors: Fangyu Liu (Shenzhen), Yuefeng Wu (Shenzhen), Yang Gao (Shenzhen), Qian Chen (Shenzhen), Hongyan Ning (Shenzhen)
Primary Examiner: L. A. Grabenstetter
Application Number: 29/953,689