Semiconductor

- Hitachi, Ltd.
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Description

FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 6 is a bottom view thereof;

FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 8 is a bottom view thereof;

FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 10 is a bottom view thereof.

Referenced Cited
U.S. Patent Documents
3208892 September 1965 Miller et al.
3436451 April 1969 Wasser
4012766 March 15, 1977 Phillips et al.
Other references
  • Electronics, 3-17-1977, Front Cover, LSI Package (top right). Electronics, 10-13-1977, p. 9, Semiconductor. Electronics, 10-27-1977, p. 9, Integrated Circuit Package (square). Electronics, 11-24-1977, p. 145, Integrated Circuit Package (bottom right).
Patent History
Patent number: D260091
Type: Grant
Filed: Feb 26, 1979
Date of Patent: Aug 4, 1981
Assignee: Hitachi, Ltd. (Tokyo)
Inventors: Hidetoshi Mochizuki (Fuchu), Keizo Otsuki (Higashiyamayo), Hideki Kosaka (Kodaira), Gen Murakami (Machida)
Primary Examiner: Susan J. Lucas
Law Firm: Craig & Antonelli
Application Number: 6/15,216
Classifications
Current U.S. Class: D13/99
International Classification: D1303;