Heat sink or similar article
Latest Thermalloy Incorporated Patents:
- Heat sink for direct attachment to surface mount electronic device packages
- Heat dissipation system having releasable attachment assembly
- Heat sink mounting assembly for surface mount electronic device packages
- Apparatus for securing electronic device packages to heat sinks
- Spring clip fastener for surface mounting of printed circuit board components
Description
FIG. 1 is a perspective view of a heat sink or similar article showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a side elevational view thereof, the opposite side being a mirror image; and
FIG. 5 is an end elevational view thereof, the opposite end being a mirror image.
Referenced Cited
Patent History
Patent number: D285193
Type: Grant
Filed: Apr 2, 1984
Date of Patent: Aug 19, 1986
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventor: Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz, Scherback & Timmons
Application Number: 6/595,910
Type: Grant
Filed: Apr 2, 1984
Date of Patent: Aug 19, 1986
Assignee: Thermalloy Incorporated (Dallas, TX)
Inventor: Marvin F. Moore (Carrollton, TX)
Primary Examiner: Susan J. Lucas
Law Firm: Kanz, Scherback & Timmons
Application Number: 6/595,910
Classifications
Current U.S. Class:
D13/23