Package for electronic parts or the like
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Description
FIG. 1 is a front perspective view of a package for electronic parts or the like showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a front elevation thereof;
FIG. 4 is a rear elevation thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevation thereof; and
FIG. 8 is a right side elevation thereof.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D323061
Type: Grant
Filed: Oct 18, 1989
Date of Patent: Jan 14, 1992
Assignee: TDK Corporation (Tokyo)
Inventors: Tetsuo Takahashi (Tokyo), Kuniaki Takahashi (Tokyo), Koji Kudo (Tokyo)
Primary Examiner: Bernard Ansher
Assistant Examiner: Prabhakar Deshmukh
Law Firm: Helfgott & Karas
Application Number: 7/423,104
Type: Grant
Filed: Oct 18, 1989
Date of Patent: Jan 14, 1992
Assignee: TDK Corporation (Tokyo)
Inventors: Tetsuo Takahashi (Tokyo), Kuniaki Takahashi (Tokyo), Koji Kudo (Tokyo)
Primary Examiner: Bernard Ansher
Assistant Examiner: Prabhakar Deshmukh
Law Firm: Helfgott & Karas
Application Number: 7/423,104
Classifications
Current U.S. Class:
D 3/35