Package for electronic parts or the like

- TDK Corporation
Description

FIG. 1 is a front perspective view of a package for electronic parts or the like showing our new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front elevation thereof;

FIG. 4 is a rear elevation thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a left side elevation thereof; and

FIG. 8 is a right side elevation thereof.

Referenced Cited
U.S. Patent Documents
D273805 May 8, 1984 Filhol
D283464 April 22, 1986 Ogden
3332575 July 1967 Pilot et al.
3831808 August 1974 Bender
4261468 April 14, 1981 Krebs
4399914 August 23, 1983 Damratowski et al.
4542495 September 17, 1985 Ziegler et al.
4785969 November 22, 1988 McLaughlin
4811998 March 14, 1989 Rankin
Patent History
Patent number: D323061
Type: Grant
Filed: Oct 18, 1989
Date of Patent: Jan 14, 1992
Assignee: TDK Corporation (Tokyo)
Inventors: Tetsuo Takahashi (Tokyo), Kuniaki Takahashi (Tokyo), Koji Kudo (Tokyo)
Primary Examiner: Bernard Ansher
Assistant Examiner: Prabhakar Deshmukh
Law Firm: Helfgott & Karas
Application Number: 7/423,104
Classifications
Current U.S. Class: D 3/35