Electronic circuit housing
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FIG. 1 is a top front perspective view of an electronic circuit housing showing my new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is an end elevational view thereof taken from the left of FIG. 2;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is an end elevational view thereof taken from the right of FIG. 2;
FIG. 6 is a top front perspective view of a second embodiment thereof;
FIG. 7 is a bottom plan view of the second embodiment thereof;
FIG. 8 is an end elevational view of the second embodiment thereof taken from the left of FIG. 7;
FIG. 9 is a rear elevational view of the second embodiment thereof;
FIG. 10 is an end elevational view of the second embodiment thereof taken from the right of FIG. 7;
FIG. 11 is a top front perspective view of a third embodiment thereof;
FIG. 12 is a bottom plan view of the third embodiment thereof;
FIG. 13 is an end elevational view of the third embodiment thereof taken from the left of FIG. 12;
FIG. 14 is a rear elevational view of the third embodiment thereof; and,
FIG. 15 is an end elevational view of the third embodiment thereof taken from the right of FIG. 12.
Type: Grant
Filed: Jun 9, 1993
Date of Patent: Jun 28, 1994
Assignee: Eldec Corporation (Lynnwood, WA)
Inventor: David Cooper (Seattle, WA)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Law Firm: Christensen, O'Connor, Johnson & Kindness
Application Number: 0/9,363
