Magazine for a plurality of tube assemblies carrying integrated circuit chips

- IBM
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Description

FIG. 1 is a magazine for a plurality of tube assemblies carrying integrated circuit chips showing our new design;

FIG. 2 is a front elevational view thereof on an enlarged scale;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and

FIG. 7 is a bottom plan view thereof.

Referenced Cited
U.S. Patent Documents
D270051 August 9, 1983 Smith
D313586 January 8, 1991 Vitek
4043485 August 23, 1977 Tipetts
4591053 May 27, 1986 Alemanni
4638348 January 20, 1987 Brown et al.
4765471 August 23, 1988 Murphy
4987516 January 22, 1991 Belanger, Jr. et al.
Patent History
Patent number: D323318
Type: Grant
Filed: Dec 18, 1989
Date of Patent: Jan 21, 1992
Assignee: International Business Machines Corporation (Armonk, NY)
Inventors: Paul Feinstein, Jr. (Austin, TX), Ronald E. Hunt (Georgetown, TX), Alan J. Schwartz (Cedar Park, TX), Verlon E. Whitehead (Austin, TX)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Freda S. Nunn
Attorney: Robert M. Carwell
Application Number: 7/453,435
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182); D34/40