Cap for use in a semiconductor wafer heat processing apparatus
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Description
FIG. 1 a perspective view of a cap for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a top plan view thereof;
FIG. 3 a bottom plan view thereof;
FIG. 4 a front elevational view thereof; and,
FIG. 5 a cross-sectional view taken along line V--V in FIG. 2;
Referenced Cited
Patent History
Patent number: D404370
Type: Grant
Filed: Feb 5, 1998
Date of Patent: Jan 19, 1999
Assignee: Tokyo Electron Limited (Tokyo-to)
Inventor: Norifumi Kimura (Shiroyama-Machi)
Primary Examiner: Brian N.. Vinson
Law Firm: Ladas & Parry
Application Number: 0/83,424
Type: Grant
Filed: Feb 5, 1998
Date of Patent: Jan 19, 1999
Assignee: Tokyo Electron Limited (Tokyo-to)
Inventor: Norifumi Kimura (Shiroyama-Machi)
Primary Examiner: Brian N.. Vinson
Law Firm: Ladas & Parry
Application Number: 0/83,424
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;