Ring for use in a semiconductor wafer heat processing apparatus

- Tokyo Electron Limited
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Description

FIG. 1 a perspective view of a ring for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a top plan view thereof;

FIG. 3 a front elevational view thereof;

FIG. 4 a bottom plan view thereof;

FIG. 5 a right side view thereof;

FIG. 6 a rear elevational view thereof; and,

FIG. 7 a cross-sectional view taken along line VII--VII in FIG. 3.

Referenced Cited
U.S. Patent Documents
4857689 August 15, 1989 Lee
5314574 May 24, 1994 Takahashi
5320218 June 14, 1994 Yamashita et al.
5752796 May 19, 1998 Muka
Patent History
Patent number: D404372
Type: Grant
Filed: Feb 12, 1998
Date of Patent: Jan 19, 1999
Assignee: Tokyo Electron Limited (Tokyo-To)
Inventor: Katsutoshi Ishii (Shiroyama-machi)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/83,715
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;