Heat retaining tube for use in a semiconductor wafer heat processing apparatus
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Description
FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2: a top plan view thereof;
FIG. 3: a front elevational view thereof;
FIG. 4: a cross sectional view thereof taken along line IV--IV in FIG. 3;
FIG. 5: a cross sectional view thereof taken along line V--V in FIG. 3;
FIG. 6: a left side view thereof;
FIG. 7: a right side view thereof;
FIG. 8: a bottom plan view thereof; and,
FIG. 9: a rear elevational view thereof.
Referenced Cited
Patent History
Patent number: D405428
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Feb 9, 1999
Assignee: Tokyo Electron Ltd. (Tokyo-to)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,285
Type: Grant
Filed: Jul 24, 1997
Date of Patent: Feb 9, 1999
Assignee: Tokyo Electron Ltd. (Tokyo-to)
Inventor: Katsutoshi Ishii (Kanagawa)
Primary Examiner: Brian N. Vinson
Law Firm: Ladas & Parry
Application Number: 0/74,285
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;