Electrostatic chuck with improved spacing and charge migration reduction mask

- Applied Materials, Inc.
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Description

FIG. 1 is a top view of the electrostatic chuck having the improved spacing and charge migration reduction mask;

FIG. 2 is an elevation view of the electrostatic chuck when looking up along the y-axis in FIG. 1, the view when looking down along the y-axis being a mirror image of FIG. 2;

FIG. 2A is a detailed view of part of the surface of the electrostatic chuck seen in FIG. 2;

FIG. 3 is a bottom view of the electrostatic chuck;

FIG. 4 is an elevation view of the electrostatic chuck when looking to the right along the x-axis in FIG. 1;

FIG. 4A is a detailed view of part of the surface of the electrostatic chuck seen in FIG. 4;

FIG. 5 is an elevation view of the electrostatic chuck when looking to the left along the x-axis in FIG. 1 and; and,

FIG. 5A is a detailed view of part of the surface of the electrostatic chuck seen in FIG. 5.

Referenced Cited
U.S. Patent Documents
4502094 February 26, 1985 Lewis et al.
4554611 November 19, 1985 Lewis
4665463 May 12, 1987 Ward et al.
5001594 March 19, 1991 Bobbio
5179498 January 12, 1993 Honough et al.
5459632 October 17, 1995 Birang et al.
Patent History
Patent number: D407073
Type: Grant
Filed: Dec 24, 1997
Date of Patent: Mar 23, 1999
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Vincent E. Burkhart (San Jose, CA), Allen Flanigan (San Jose, CA), Steven Sansoni (San Jose, CA)
Primary Examiner: Brian N. Vinson
Law Firm: Thomason & Moser
Application Number: 0/81,237
Classifications
Current U.S. Class: Miscellaneous (D13/199)
International Classification: 1399;