Electrostatic chuck with improved spacing and charge migration reduction mask
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Description
FIG. 1 is a top view of the electrostatic chuck having the improved spacing and charge migration reduction mask;
FIG. 2 is an elevation view when looking to the right along the x-axis in FIG. 1 , the view when looking to the left along the x-axis in FIG. 1 being identical to that of FIG. 2 thereof;
FIG. 3 is a detailed view of part of the surface seen in FIG. 2 thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is an elevation view when looking down along the y-axis in FIG. 1 thereof; and,
FIG.6 is an elevation view when looking up along the y-axis in FIG. 1 thereof.
Referenced Cited
U.S. Patent Documents
| 5528451 | June 18, 1996 | Su |
Patent History
Patent number: D420022
Type: Grant
Filed: Dec 24, 1997
Date of Patent: Feb 1, 2000
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Vincent E. Burkhart (San Jose, CA), Allen Flanigan (San Jose, CA), Steven Sansoni (San Jose, CA)
Primary Examiner: Antoine Duval Davis
Law Firm: Thomason & Moser
Application Number: 0/81,238
Type: Grant
Filed: Dec 24, 1997
Date of Patent: Feb 1, 2000
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Vincent E. Burkhart (San Jose, CA), Allen Flanigan (San Jose, CA), Steven Sansoni (San Jose, CA)
Primary Examiner: Antoine Duval Davis
Law Firm: Thomason & Moser
Application Number: 0/81,238
Classifications
