Semiconductor power package with three leads

- IXYS Corporation
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Description

FIG. 1 is a perspective view of a semiconductor power package with three leads showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevational view thereof, the left side elevational view being a mirror image;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a front elevational view thereof.

Referenced Cited
U.S. Patent Documents
D202271 September 1965 Wulc
D277955 March 12, 1985 Takahashi
D288557 March 3, 1987 Bois
5754405 May 19, 1998 Derouiche
5861721 January 19, 1999 Johnson
Other references
  • Ixys Corporation Product Catalog, p. 18, HiPerFET.TM. Power Mosfets.
Patent History
Patent number: D420983
Type: Grant
Filed: Oct 16, 1998
Date of Patent: Feb 22, 2000
Assignee: IXYS Corporation (Santa Clara, CA)
Inventor: KangRim Choi (Santa Clara, CA)
Primary Examiner: Adir Aronovich
Law Firm: Townsend and Townsend and Crew
Application Number: 0/95,110
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;