High performance cooling device

- Hewlett Packard
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Description

FIG. 1 is a top front left perspective view of a first embodiment of a high performance cooling device showing my new design;

FIG. 2 is a left elevation view thereof;

FIG. 3 is a right elevation view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a top front left perspective view of a second embodiment of a high performance cooling device showing my new design;

FIG. 7 is a top front right perspective view

FIG. 8 is a left elevation view thereof;

FIG. 9 is a right elevation view thereof;

FIG. 10 is a bottom view thereof; and,

FIG. 11 is a top plan view thereof.

Claims

The ornamental design for a high performance cooling device, as shown and described.

Referenced Cited
U.S. Patent Documents
D203543 January 1966 Coe
4715438 December 29, 1987 Gabuzda et al.
5597034 January 28, 1997 Barker, III et al.
5794685 August 18, 1998 Dean
5825622 October 20, 1998 Rife et al.
5943209 August 24, 1999 Liu
D428857 August 1, 2000 Wagner et al.
6330908 December 18, 2001 Lee et al.
6336499 January 8, 2002 Liu
6367542 April 9, 2002 Chen
Patent History
Patent number: D464938
Type: Grant
Filed: Jul 27, 2001
Date of Patent: Oct 29, 2002
Assignee: Hewlett Packard Company (Palo Alto, CA)
Inventor: Shankar Hegde (Annassandrapalya Bangalore)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Trueman H. Denny, III
Application Number: 29/145,705
Classifications
Current U.S. Class: Heat Sink (D13/179)
International Classification: 1303;