Communications module

- Intel
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Description

FIG. 1 is a top, front, left side perspective view of a communications module showing our new design;

FIG. 2 is a top, rear, left side perspective view thereof;

FIG. 3 is a bottom, front, right side perspective view thereof;

FIG. 4 is a bottom, rear, right side perspective view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a front elevation view thereof;

FIG. 7 is a rear elevation view thereof;

FIG. 8 is a right side elevation view thereof; and,

FIG. 9 is a left side elevation view thereof.

Claims

The ornamental design for a communications module, as shown and described.

Referenced Cited
U.S. Patent Documents
D366463 January 23, 1996 Ive et al.
D370904 June 18, 1996 Nakata et al.
D415479 October 19, 1999 Yang et al.
D432540 October 24, 2000 Laity et al.
D452495 December 25, 2001 Murnaghan et al.
D452863 January 8, 2002 Madsen et al.
Patent History
Patent number: D469776
Type: Grant
Filed: Aug 25, 2000
Date of Patent: Feb 4, 2003
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Ian A. Laity (Simi Valley, CA), Michael R. Smither (Castaic, CA)
Primary Examiner: Kay H. Chin
Attorney, Agent or Law Firm: Kenneth J. Cool
Application Number: 29/128,484
Classifications
Current U.S. Class: Cartridge, Chip Or Card (D14/435)
International Classification: 1402;