Semiconductor device
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FIG. 1 is a top, front and right side perspective view of a semiconductor device according to my design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof, the left side elevational view being a mirror image thereof;
FIG. 7 is a view of a further embodiment of a semiconductor device similar to FIG. 1, the broken lines illustrating environmental structure of this embodiment which does not form part of the design of this embodiment;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a bottom plan view thereof; and,
FIG. 12 is a right side elevational view thereof, the left side elevational view being a mirror image thereof.
Claims
The ornamental design for a “semiconductor device”, as shown and described.
Type: Grant
Filed: Mar 6, 2002
Date of Patent: Jun 24, 2003
Assignee: Sharp Kabushiki Kaisha (Osaka)
Inventor: Hideshi Koizumi (Nara-ken)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Nixon & Vanderhye
Application Number: 29/156,639
International Classification: 1303;