Cutting device

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Description

FIG. 1 is a perspective view of the cutting device;

FIG. 2 is a top view of the cutting device;

FIG. 3 is a bottom view of the cutting device; and

FIG. 4 is a rear view of the cutting device;

FIG. 5 is a front view of the cutting device;

FIG. 6 is a side view of the cutting device; and,

FIG. 7 is a perspective view of the cutting device in the open position.

Claims

The ornamental design for a cutting device, as shown.

Referenced Cited
U.S. Patent Documents
D171837 March 1954 Blanchaert
D225608 December 1972 Schwartz
D256215 August 5, 1980 Chen
D310469 September 11, 1990 Dressler
D358748 May 30, 1995 Ramsey et al.
6038772 March 21, 2000 Cornell et al.
Other references
  • Hong Kong Enterprise vol. 10, 1999, p. 804, items GD001 and GD002A in top center of photo.
Patent History
Patent number: D483635
Type: Grant
Filed: Jun 3, 2003
Date of Patent: Dec 16, 2003
Assignee: Wenco, L.L.C. (New York, NY)
Inventors: Michael I. Silver (New York, NY), Wendy L. Silver (New York, NY)
Primary Examiner: Clare E. Heflin
Attorney, Agent or Law Firm: Fitzpatrick, Cella, Harper & Scinto
Application Number: 29/182,835
Classifications
Current U.S. Class: D8/57
International Classification: 0803;