Optical module

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Description

FIG. 1 is a front, top and right side perspective view of a optical module, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical module, showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof; and,

FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.

The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a optical module, as shown and described.

Referenced Cited
U.S. Patent Documents
4768070 August 30, 1988 Takizawa et al.
5052009 September 24, 1991 Tsuboi et al.
5252856 October 12, 1993 Murai
5814871 September 29, 1998 Furukawa et al.
6181720 January 30, 2001 Kanemoto et al.
6479889 November 12, 2002 Yoshida et al.
D476296 June 24, 2003 Koizumi
6577656 June 10, 2003 Chen et al.
6587491 July 1, 2003 Yamamoto
Other references
  • Product Overview, wysiwyg://mainframe.1101/http://www.shinko.co.jp/e.product/e.glass/e.glass.4.htm, “Glass-to-Metal Seals”, 2 pages, 2001-2002.
  • Patent Abstracts of Japan, JP 10-284640, Oct. 23, 1998.
  • Patent Abstracts of Japan, JP 08-031970, Feb. 2, 1996.
  • Patent Abstracts of Japan, JP 11-087577, Mar. 30, 1999.
  • Patent Abstracts of Japan, JP 05-129461, May 25, 1993.
  • Patent Abstracts of Japan, JP 07-176649, Jul. 14, 1995.
Patent History
Patent number: D484105
Type: Grant
Filed: Jan 2, 2003
Date of Patent: Dec 23, 2003
Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo)
Inventors: Shinichi Takagi (Tokyo), Hiroshi Aruga (Tokyo), Kiyohide Sakai (Tokyo)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 29/173,551
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;